Abstract: An electronic device is manufactured by a method including applying a photosensitive adhesive agent either to a pressure chamber forming substrate and a vibrating plate or to a sealing plate having a structure of a lower height from a bonding surface, precuring the photosensitive adhesive agent by heating, patterning the precured photosensitive adhesive agent, and bonding the substrates together with the structure (bump electrode) and the photosensitive adhesive agent interposed therebetween.

Abstract: A liquid ejecting head includes driving elements and electrodes each extending a second direction for ejecting liquid of pressure chambers through nozzles. The driving elements are classified into a first element group and a second element group. The electrodes are arranged along a first direction intersecting the second direction and are classified into a first electrode group electrically connected to the first element group, a second electrode group electrically connected to the second element group and a third electrode group not contribute to the ejecting liquid.

Abstract: Polyallylamine derivatives including 10 to 450 structural units represented by Formula (1): are useful for preparing dispersants, treated particles, particle-containing compositions, pigment-containing compositions, paints, ink compositions, liquid developers, and anti-blocking agents.

Abstract: The invention provides an aqueous solution capable of selectively protecting a nitrogen-containing silicon compound from corrosion by a treating solution for etching, cleaning or the like, etching oxygen-containing, carbon-containing silicon in particular, and making a large etch rate difference between a nitrogen-containing silicon compound and an oxygen-containing silicon compound, and a process for producing electronic parts as well. The invention is embodied by a treating solution for electronic parts that is an aqueous solution containing one or two or more of anionic surface active agents represented by the following formulae (1), (2) and (3), and a process for producing an electronic part. wherein R1, R2, and R3 stands for hydrogen or an alkyl or alkylene group having 1 to 4 carbon atoms, and X1 stands for a functional group capable of becoming an anionic ion.

Abstract: A bonding resin that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet being a wet-spreading portion or a portion which swells outward from the photosensitive resin.

Abstract: A piezoelectric device includes a first substrate having a piezoelectric element on one surface thereof and a second substrate having penetration wiring that includes a through hole formed in a thickness direction thereof and a conductor section formed in the through hole. A resin section is formed on a surface of one substrate of one of the first substrate and the second substrate, which opposes the other substrate, and is formed of an elastic body in a shape protruding toward the other substrate, and a first electrode layer is formed on the surface of the other substrate side of the resin section. A second electrode layer is formed on a surface of the other substrate that opposes the one substrate, and the first substrate and the second substrate are joined in a state in which the first electrode layer and the second electrode layer are abutting against each other.

Abstract: A POS terminal includes a display device, a sensor, and a processor configured to determine an amount of merchandise based on a signal output from the sensor, determine a display pattern of a plurality of content images based on the determined amount of merchandise, and control the display device to display the content images according to the determined display pattern.

Abstract: A piezoelectric device includes a first substrate having a piezoelectric element on one surface thereof and a second substrate having penetration wiring that includes a through hole formed in a thickness direction thereof and a conductor section formed in the through hole. A resin section is formed on a surface of one substrate of one of the first substrate and the second substrate, which opposes the other substrate, and is formed of an elastic body in a shape protruding toward the other substrate, and a first electrode layer is formed on the surface of the other substrate side of the resin section. A second electrode layer is formed on a surface of the other substrate that opposes the one substrate, and the first substrate and the second substrate are joined in a state in which the first electrode layer and the second electrode layer are abutting against each other.

Abstract: A bonding resin that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet being a wet-spreading portion or a portion which swells outward from the photosensitive resin.

Abstract: An electronic device is manufactured by a method including applying a photosensitive adhesive agent either to a pressure chamber forming substrate and a vibrating plate or to a sealing plate having a structure of a lower height from a bonding surface, precuring the photosensitive adhesive agent by heating, patterning the precured photosensitive adhesive agent, and bonding the substrates together with the structure (bump electrode) and the photosensitive adhesive agent interposed therebetween.

Abstract: A liquid ejecting head includes driving elements and electrodes each extending a second direction for ejecting liquid of pressure chambers through nozzles. The driving elements are classified into a first element group and a second element group. The electrodes are arranged along a first direction intersecting the second direction and are classified into a first electrode group electrically connected to the first element group, a second electrode group electrically connected to the second element group and a third electrode group not contribute to the ejecting liquid.

Abstract: The invention provides an aqueous solution capable of selectively protecting a nitrogen-containing silicon compound from corrosion by a treating solution for etching, cleaning or the like, etching oxygen-containing, carbon-containing silicon in particular, and making a large etch rate difference between a nitrogen-containing silicon compound and an oxygen-containing silicon compound, and a process for producing electronic parts as well. The invention is embodied by a treating solution for electronic parts that is an aqueous solution containing one or two or more of anionic surface active agents represented by the following formulae (1), (2) and (3), and a process for producing an electronic part. wherein R1, R2, and R3 stands for hydrogen or an alkyl or alkylene group having 1 to 4 carbon atoms, and X1 stands for a functional group capable of becoming an anionic ion.

Abstract: There is provided a vehicle seat including a seat structure member which has a frame member which configures a seat framework, a pad member which configures an outer shape of the seat and is configured to elastically support an occupant, and a sheet-like elastic fiber body which is disposed on a rear surface of the pad member. The pad member is disposed on the frame member while the elastic fiber body contacting the frame member. The elastic fiber body includes protrusions which protrude toward the frame member and recesses which are closer to the pad member than the protrusions, and the elastic fiber body is configured to come into point or line contact with the frame member by the protrusions.

Abstract: A user information management unit of a terminal generates a management number for respective users. A terminal to terminal communication unit communicates with another terminal through ad hoc communication, acquires a unique user ID set for the other user, and stores the user ID in a friend information storing unit. The data generated in a data generation unit is transmitted to a server from a sending unit along with a destination user ID selected from user IDs stored in a friend information storing unit. A reception unit in the server stores the transmitted data in a data storing unit for each destination user ID. When the server receives a connection request from a terminal, a connecting user information acquisition unit in the server identifies a user ID of a connection origin and a data retrieving unit transmits the data to the terminal by retrieving a data storing unit based on the user ID, indicating the user requested for the connection as a destination.

Abstract: A thermal negative type lithographic printing original plate has a photosensitive layer featuring high sensitivity, excellent reproducibility in FM screening, and excellent print durability and chemical resistance at a minute image portion. A photosensitive composition for the photosensitive layer contains an alkali soluble resin having a monomer unit represented by the formula (I), a silane coupling agent represented by the formula (II), an infrared absorber, a radical polymerization initiator, and a polymerizable compound having an ethylenic double bond and an amount of the silane coupling agent is from 15 to 40% of the photosensitive composition by mass.

Abstract: A semiconductor module including: a semiconductor chip in which an integrated circuit is formed; an electrode formed on the semiconductor chip and electrically connected to the integrated circuit; an insulating film formed on the semiconductor chip and having an opening positioned corresponding to the electrode; an elastic protrusion disposed on the insulating film, a surface of the elastic protrusion opposite to the insulating film being convexly curved; an interconnect extending from over the electrode to over the elastic protrusion; an elastic substrate on which a lead is formed, the lead being in contact with part of the interconnect positioned on the elastic protrusion; and an adhesive maintaining a space between a surface of the semiconductor chip on which the elastic protrusion is formed and a surface of the elastic substrate on which the lead is formed. The elastic substrate has a first depression formed by elastic deformation.

Abstract: A semiconductor module including: a semiconductor chip, an integrated circuit being formed in the semiconductor chip; a plurality of electrodes electrically connected to the integrated circuit; an insulating film formed on the semiconductor chip and having a plurality of openings positioned corresponding to the plurality of electrodes; and a long elastic protrusion extending on the insulating film. A plurality of interconnects respectively extend from over the electrodes to over the elastic protrusion, directions of the interconnects intersecting an axis AX that is parallel to the extending direction of the elastic protrusion. A plurality of leads are respectively in contact with the interconnects in an area positioned on the elastic protrusion. A cured adhesive maintains a space between a surface of the semiconductor chip on which the elastic protrusion is formed and a surface of the elastic substrate on which the leads are formed.

Abstract: A user information management unit of a terminal generates a management number for respective users. A terminal to terminal communication unit communicates with another terminal through ad hoc communication, acquires a unique user ID set for the other user, and stores the user ID in a friend information storing unit. The data generated in a data generation unit is transmitted to a server from a sending unit along with a destination user ID selected from user IDs stored in a friend information storing unit. A reception unit in the server stores the transmitted data in a data storing unit for each destination user ID. When the server receives a connection request from a terminal, a connecting user information acquisition unit in the server identifies a user ID of a connection origin and a data retrieving unit transmits the data to the terminal by retrieving a data storing unit based on the user ID, indicating the user requested for the connection as a destination.

Abstract: A semiconductor module including: a semiconductor chip, an integrated circuit being formed in the semiconductor chip; a plurality of electrodes electrically connected to the integrated circuit; an insulating film formed on the semiconductor chip and having a plurality of openings positioned corresponding to the plurality of electrodes; and a long elastic protrusion extending on the insulating film. A plurality of interconnects respectively extend from over the electrodes to over the elastic protrusion, directions of the interconnects intersecting an axis AX that is parallel to the extending direction of the elastic protrusion. A plurality of leads are respectively in contact with the interconnects in an area positioned on the elastic protrusion. A cured adhesive maintains a space between a surface of the semiconductor chip on which the elastic protrusion is formed and a surface of the elastic substrate on which the leads are formed.

Abstract: A semiconductor module including: a semiconductor chip in which an integrated circuit is formed; an electrode formed on the semiconductor chip and electrically connected to the integrated circuit; an insulating film formed on the semiconductor chip and having an opening positioned corresponding to the electrode; an elastic protrusion disposed on the insulating film, a surface of the elastic protrusion opposite to the insulating film being convexly curved; an interconnect extending from over the electrode to over the elastic protrusion; an elastic substrate on which a lead is formed, the lead being in contact with part of the interconnect positioned on the elastic protrusion; and an adhesive maintaining a space between a surface of the semiconductor chip on which the elastic protrusion is formed and a surface of the elastic substrate on which the lead is formed. The elastic substrate has a first depression formed by elastic deformation.