Abstract: A thermal negative type lithographic printing original plate has a photosensitive layer featuring high sensitivity, excellent reproducibility in FM screening, and excellent print durability and chemical resistance at a minute image portion. A photosensitive composition for the photosensitive layer contains an alkali soluble resin having a monomer unit represented by the formula (I), a silane coupling agent represented by the formula (II), an infrared absorber, a radical polymerizable initiator, and a polymerizable compound having an ethylenic double bond and an amount of the silane coupling agent is from 15 to 40% of the photosensitive composition by mass.

Abstract: A method of manufacturing a wiring board, including: providing a resin substrate on which is formed a metal layer including a first layer and a second layer formed on the first layer; forming an interconnecting pattern by etching the metal layer so that the interconnecting pattern includes the patterned first layer and second layer and a part of the first layer remains outside the second layer as a residue of the first layer; electroless plating the interconnecting pattern and the residue of the first layer; and then washing the resin substrate. The washing of the resin substrate is performed by using at least one of an acidic solution used for dissolving and removing the residue of the first layer and a metal deposited on the residue of the first layer by the electroless plating and an alkaline solution used for dissolving the resin substrate to remove an area which supports the residue of the first layer.

Abstract: A method of manufacturing a wiring board, including: providing a resin substrate on which is formed a metal layer including a first layer and a second layer formed on the first layer; forming an interconnecting pattern by etching the metal layer so that the interconnecting pattern includes the patterned first layer and second layer and a part of the first layer remains outside the second layer as a residue of the first layer; electroless plating the interconnecting pattern and the residue of the first layer; and then washing the resin substrate. The washing of the resin substrate is performed by using at least one of an acidic solution used for dissolving and removing the residue of the first layer and a metal deposited on the residue of the first layer by the electroless plating and an alkaline solution used for dissolving the resin substrate to remove an area which supports the residue of the first layer.

Abstract: A method for manufacturing a wiring board includes electroless plating wiring patterns provided on a base substrate and cleaning the base substrate. The step of cleaning the base substrate includes at least either using an alkaline solvent or using an acid solvent.

Abstract: The present invention relates to a method for screening and identifying therapeutic agents or preventive agents for central nervous system diseases which comprises assaying a suppressing effect of a test substance on an expression of a splicing variant transcribed from presenilin-2 gene and to a method for examining central nervous system diseases which comprises detecting an expression of a splicing variant transcribed from presenilin-2 gene in a test sample originated from an animal individual.

Abstract: The present invention relates to a method for screening and identifying therapeutic agents or preventive agents for central nervous system diseases which comprises assaying a suppressing effect of a test substance on an expression of a splicing variant transcribed from presenilin-2 gene and to a method for examining central nervous system diseases which comprises detecting an expression of a splicing variant transcribed from presenilin-2 gene in a test sample originated from an animal individual.