Patents by Inventor NGK Insulators, Ltd.

NGK Insulators, Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130045424
    Abstract: An object of the present invention is to provide a lithium secondary battery which has improved capacity, durability, and rate characteristic as compared with conventional lithium secondary batteries. A plate-like particle or a film for a lithium secondary battery cathode active material has a layered rock salt structure. The (003) plane is oriented in a direction intersecting the direction of the plate surface of the particle or film.
    Type: Application
    Filed: October 17, 2012
    Publication date: February 21, 2013
    Applicant: NGK INSULATORS, LTD.
    Inventor: NGK INSULATORS, LTD.
  • Publication number: 20130026488
    Abstract: Provided is a crack-free epitaxial substrate having excellent breakdown voltage properties in which a silicon substrate is used as a base substrate thereof. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer including a plurality of composition modulation layers each formed of a first composition layer made of AlN and a second composition layer made of AlxGa1-xN (0?x<1) being alternately laminated. The relationship of x(1)?x(2)? . . . ?x(n?1)?x(n) and x(1)>x(n) is satisfied, where n represents the number of laminations of each of the first and the second composition layer, and x(i) represents the value of x in i-th one of the second composition layers as counted from the base substrate side. Each of the second composition layers is formed so as to be in a coherent state relative to the first composition layer.
    Type: Application
    Filed: October 4, 2012
    Publication date: January 31, 2013
    Applicant: NGK Insulators, Ltd.
    Inventor: NGK Insulators, Ltd.
  • Publication number: 20130026486
    Abstract: Provided is a crack-free epitaxial substrate having excellent breakdown voltage properties in which a silicon substrate is used as a base substrate thereof. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer including a composition modulation layer that is formed of a first composition layer made of AlN and a second composition layer made of AlxGa1-xN (0?x<1) being alternately laminated. The relationship of x(1)?x(2)? . . . ?x(n?1)?x(n) and x(1)>x(n) is satisfied, where n represents the number of laminations of each of the first and the second composition layer (n is a natural number equal to or greater than two), and x(i) represents the value of x in i-th one of the second composition layers as counted from the base substrate side, to thereby cause a compressive strain to exist such that the compressive strain increases in a portion more distant from the base substrate.
    Type: Application
    Filed: October 2, 2012
    Publication date: January 31, 2013
    Applicant: NGK INSULATORS, LTD.
    Inventor: NGK Insulators, Ltd.
  • Publication number: 20130022526
    Abstract: A mixed powder was prepared by weighing Yb2O3 and SrCO3 in such a way that the molar ratio became 1:1. The resulting mixed powder was subjected to uniaxial pressure forming, so as to produce a disc-shaped compact. The compact was heat-treated in an air atmosphere, so that a complex oxide was synthesized. The resulting complex oxide was pulverized. After the pulverization, a slurry was taken out and was dried in a nitrogen gas stream, so as to produce a synthesized powder material. The resulting synthesized powder material was subjected to uniaxial pressure forming, so as to produce a disc-shaped compact. The resulting compact was fired by a hot-press method, so as to obtain a corrosion-resistant member for semiconductor manufacturing apparatus. The resulting corrosion-resistant member was made from a SrYb2O4.
    Type: Application
    Filed: September 21, 2012
    Publication date: January 24, 2013
    Applicant: NGK INSULATORS, LTD.
    Inventor: NGK INSULATORS, LTD.
  • Publication number: 20130023401
    Abstract: Initially, an Yb2O3 raw material was subjected to uniaxial pressure forming at a pressure of 200 kgf/cm2, so that a disc-shaped compact having a diameter of about 35 mm and a thickness of about 10 mm was produced, and was stored into a graphite mold for firing. Subsequently, firing was performed by using a hot-press method at a predetermined firing temperature (1,500° C.), so as to obtain a corrosion-resistant member for semiconductor manufacturing apparatus. The press pressure during firing was specified to be 200 kgf/cm2 and an Ar atmosphere was kept until the firing was finished. The retention time at the firing temperature (maximum temperature) was specified to be 4 hours. In this manner, the corrosion-resistant member for semiconductor manufacturing apparatus made from an Yb2O3 sintered body having an open porosity of 0.2% was obtained.
    Type: Application
    Filed: September 21, 2012
    Publication date: January 24, 2013
    Applicant: NGK INSULATORS, LTD.
    Inventor: NGK INSULATORS, LTD.
  • Publication number: 20130020583
    Abstract: Provided is a crack-free epitaxial substrate. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer formed of a first and a second lamination unit being alternately laminated such that each of an uppermost and a lowermost portion of the buffer layer is formed of the first lamination unit. The first lamination unit is formed of a first and a second composition layer having different compositions being alternately laminated so as to increase the thickness of the second composition layer in a portion more distant from the base substrate side, to thereby cause a compressive strain to exist in the first lamination unit such that it increases in a portion more distant from the base substrate. The second lamination unit is formed as an intermediate layer that is substantially strain-free and formed with a thickness of 15 nm or more and 150 nm or less.
    Type: Application
    Filed: September 26, 2012
    Publication date: January 24, 2013
    Applicant: NGK Insulators, Ltd.
    Inventor: NGK Insulators, Ltd.
  • Publication number: 20130015134
    Abstract: There is provided a carbon membrane formed by carbonizing a phenol resin having at least one kind of atomic groups selected from the group consisting of a methylene bond, a dimethylene ether bond, and a methylol group, wherein the total mole content rate of the atomic groups is 100 to 180% with respect to the phenolic nuclei.
    Type: Application
    Filed: September 17, 2012
    Publication date: January 17, 2013
    Applicant: NGK INSULATORS, LTD.
    Inventor: NGK Insulators, Ltd.
  • Publication number: 20130015466
    Abstract: Provided is an epitaxial substrate for a semiconductor device, which has excellent schottky contact characteristics that are stable over time. The epitaxial substrate for a semiconductor device includes a base substrate, a channel layer formed of a first group III nitride containing at least Ga and having a composition of Inx1Aly1Gaz1N (x1+y1+z1=1), and a barrier layer formed of a second group III nitride containing at least In and Al and having a composition of Inx2Aly2Gaz2N (x2+y2+z2=1), wherein the barrier layer has tensile strains in an in-plane direction, and pits are formed on a surface of the barrier layer at a surface density of 5×107/cm2 or more and 1×109/cm2 or less.
    Type: Application
    Filed: September 20, 2012
    Publication date: January 17, 2013
    Applicant: NGK INSULATORS, LTD.
    Inventor: NGK Insulators, Ltd.