Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an arm component and a blade component. The blade component may comprise two or more end effectors that can retrieve and place two or more substrates at a time. The apparatus can include multiple arm components and multiple blade components. Each blade component can comprise two or more end effectors to carry two or more substrates at one time. The blade components can move independent of one another or may be dependently connected.

Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B1, B2, B3 that are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch P1 is smaller than a second pitch P2. Blades B2 and B3 (or optionally blades B1 and B2) can service the first dual load lock with Pitch P1 and blades B1 and B3 can service the second dual load lock including the second pitch P2. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.

Abstract: A method and an integrated system. The integrated system can include an optical inspection unit, a charged particle device, an interface unit, and at least one controller.

Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Abstract: Electronic device processing assemblies including an equipment front end module (EFEM) with at least one side storage pod attached thereto are described. The side storage pod has a side storage container. In some embodiments, an exhaust conduit extends between the chamber and a pod plenum that can contain a chemical filter proximate thereto. A supplemental fan may draw purge gas from the pod plenum through the chemical filter and route the gas through a return duct to an upper plenum of the EFEM. Methods and side storage pods in accordance with these and other embodiments are also disclosed.

Abstract: Equipment front end module (EFFM) includes front located return ducts. The EFFM may include a front wall, a rear wall, and two side walls, the front wall including a plurality of load ports, and the rear wall configured to couple to a load lock apparatus. An EFFM chamber is formed between the front wall, the rear wall, and the two side walls. An upper plenum is positioned at a top of the EFFM and includes an opening into the EFFM chamber. Return ducts provide a return gas flow path enabling recirculation of gas from the EFFM chamber to the upper plenum. At least some of the plurality of return ducts are located between the load ports. Electronic device manufacturing assemblies and methods of operating equipment front end modules are also disclosed.

Abstract: In some embodiments, a side storage pod apparatus of an equipment front end module (EFEM) includes a side storage enclosure having a surface configured to couple to a side wall of a body of the equipment front end module, and an opening configured to receive substrates from the equipment front end module. The EFEM further includes a side storage chamber within the side storage enclosure having a plurality of support members configured to support substrates thereon. The EFEM further includes a plenum chamber provided proximate the side storage chamber, the plenum chamber being a separate chamber from the side storage chamber and an exhaust port coupled to the plenum chamber.

Abstract: Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a side storage container and a container plenum. A fan draws purge gas from the equipment front end module chamber into the container plenum where the purge gas is directed into the side storage container to pass over substrates stored therein and is then exhausted back into the equipment front end module chamber. Methods and systems are also disclosed.

Abstract: Electronic device processing assemblies including an EFEM with at least one side storage pod attached thereto. The side storage pod has a side storage pod container. A supply conduit extends between an upper plenum of the EFEM to the side storage pod container. A fan causes purge gas to simultaneously flow into the EFEM chamber and into the side storage pod container. The fan also causes recirculation of the purge gas from the EFEM chamber. Methods of operating EFEMs and EFEMs are also disclosed.

Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

Abstract: Electronic device processing apparatus including a factory interface chamber purge apparatus with purge gas heating. The factory interface chamber purge apparatus includes one or more heating elements configured to heat the purge gas. In some embodiments, the provision of heated purge gas to the chamber filter assembly can rapidly reduce moisture contamination after the access door is opened for factory interface servicing. In further embodiments, the provision of heated purge gas to the factory interface chamber can aid in desorbing certain chemical compounds from the substrates following processing when a low-humidity environment is provided. Purge control methods and apparatus are described, as are numerous other aspects.

Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B1, B2, B3 that are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch P1 is smaller than a second pitch P2. Blades B2 and B3 (or optionally blades B1 and B2) can service the first dual load lock with Pitch P1 and blades B1 and B3 can service the second dual load lock including the second pitch P2. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.

Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B1, B2, B3 that are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch P1 is smaller than a second pitch P2. Blades B2 and B3 (or optionally blades B1 and B2) can service the first dual load lock with Pitch P1 and blades B1 and B3 can service the second dual load lock including the second pitch P2. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Abstract: A measurement tool includes a rotation stage supporting an workpiece support, a thickness sensor overlying a workpiece support surface; a translation actuator coupled to the thickness sensor for translation of the thickness sensor relative to the workpiece support surface; and a computer coupled to control the rotation actuator and the translation actuator, and coupled to receive an output of the thickness sensor.

Abstract: A substrate carrier door assembly including relatively high sealing force that can be modulated. Substrate carrier door assembly includes a carrier door configured to seal to a carrier body, a first attraction member on the carrier body, and a second attraction member on the carrier door. Attraction members are selected from a group of a magnetic material and a permanent magnet. Substrate carrier door assembly includes a magnetic field generator energizable to reduce attraction force between the attraction members making the carrier door relatively easier to remove, yet providing enhanced sealing when not energized. Substrate carriers including the substrate carrier door assembly and methods of processing substrates are provided. A substrate carrier including a port configured to allow gas to be injected into, or removed from, a carrier chamber, and a magnetic port seal is also disclosed, as are numerous other aspects.

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.