Abstract: In a wire bonding method and apparatus to bond electrodes on pellets to leads on lead frames, substrates, when such a bonding is performed, a portion of the lead away from bonding point of the lead is pressed by a pressing section of pressing arm which is moved vertically and horizontally by lead pressing device.

Abstract: In a wire bonding method in which a capillary is raised from a first bonding point after bonding and then moved in a direction opposite to a second bonding point, thus making a reverse action, such a reverse action is made in a circular-arc shape around a neck part of the wire at the first bonding point. Thus, an ideal wire-looping is accomplished, thus preventing wire damage which could be caused by reverse actions.

Abstract: A horizontal (X-Y) table used in, for example, a bonding device including a lower table movable in one direction on a horizontal plane, an upper table installed on the lower table and movable in the other direction on the horizontal plane, an upper table driving deck which is supported by a bridge that straddles the upper table and is able to make a linear motion in the moving direction of the upper table on the upper table, a driving mechanism for the lower table, a driving mechanism for the upper table driving deck, and a link which connects the upper table and upper table driving deck so as to move them in the moving direction of the lower table, thus minimizing an area to be occupied by the X-Y table.

Abstract: In a bonding method used in manufacturing semiconductor devices, after a bonding wire is connected to a first bonding point, a capillary is moved straight up and then moved away from a second bonding point, thus making a first reverse action. From there, the capillary is again raised and a second reverse action is performed so that the capillary is moved again in the direction opposite to the second bonding point. The capillary is further raised with feeding out the wire for the length which is enough to make a wire loop, and then the capillary is moved down to the second bonding point where the bonding is performed.

Abstract: A wire bonding method that uses plurality of bonders so that each samples treated by the respective bonders are collected via single sample correcting line, in which bonders perform bondings at different points on the samples and/or performs marking bonds at different points thereon, resulting in that the bonder that has performed the bonding can be easily recognized by examining bonding points.

Abstract: A wire bonding method in which a bonding tool is lowered fast toward a bonding surface and the lowering speed of the bonding tool is then reduced at a speed-change point near the bonding surface, wherein a bonding level at which the bonding tool contacts with the bonding surface is detected and stored in a memory, and the following speed-change points of the lowering motion of the bonding tool are automatically determined in accordance with the previously detected bonding level.

Abstract: In a method for bonding bumps to leads by pressing leads installed on a carrier tape against bumps formed on a substrate, corresponding lead-bump pairs are individually bonded; particularly, one lead on the carrier and one bump on the substrate are first aligned, and then other pairs of leads and bumps are successively and individually bonded, thus performing a secure and uniform bonding action without necessity of alterations to the bumps.

Abstract: A wire bonding method wherein a bonding tool is lowered in a pre-loaded state, and bonding is performed under a bonding load which is smaller than the pre-loading load. The pre-loading load is changed to the bonding load before the bonding tool contacts a bonding point, and the bonding tool contacts the bonding point under such bonding load, thus performing bonding. Such bonding is performed also by changing the pre-loading load into a load which is smaller than the bonding load before the bonding tool contracts a bonding point and further changing such load into the bonding load after the bonding tool has contacted the bonding point.

Abstract: Method of forming bumps out of wire on the electrode of a semiconductor element is executed by setting a tip end underneath a vertically movable wedge, lowering the wedge to press the tip end of the wire against the semiconductor element, securely connecting the tip end to the electrode, and then pulling the wire away from the electrode to cut the wire, leaving the tip end on the electrode.

Abstract: Method for detecting failures in wire bonding is performed by applying a minimal voltage to bonding wire between the first and second bonding steps, between the second bonding step and bonding wire cutting step, and before the next first bonding step. Thus, whether or not the first bonding and the second bonding have been performed properly and whether or not the wire condition before the next first bonding is proper are all detected before advancing next bonding.

Abstract: Method of manufacturing semiconductor elements equipped with leads which are connected to electrodes and formed of wires including the steps of positioning each semiconductor element on a bonding stage, feeding a tip end of the wire under a bonding tool so that the bonding tool presses the tip end against the electrode to bond it to the electrode, shifting the bonding tool to away from the tip end and pressing the wire against wire-cutting section of the bonding stage, and pulling the wire away from the bonding tool to cut the wire.

Abstract: An ultrasonic wire bonding apparatus including a ultrasonic oscillation control circuit which causes a transducer having a bonding tool fastened at one end to be vibrated by ultrasonic oscillation voltage. The control circuit includes an electric current amplifier connected to the transducer, an A/D converter to which an electric current amplified by an electric current amplifier is supplied so as to be converted into digital signal which is supplied to a microcomputer, an ultrasonic oscillating circuit, and an output control circuit to which ultrasonic oscillation voltage is supplied from the ultrasonic oscillating circuit. The output control circuit controls the ultrasonic oscillating voltage by comparing it to the ultrasonic oscillating output data supplied from the computer and supplies the thus controlled voltage to the transducer through a power amplifier so as to vibrate the transducer.

Abstract: A bonding method for bonding inner leads on a film to electrodes of semiconductor elements is performed by the steps of: individually positioning the film and semiconductor elements at a predetermined bonding position; individually recognizing the positions of the inner leads and electrodes; selecting a combination of one inner lead and one electrode which are positionally shifted relative to each other; correcting relative position of the inner lead and electrode which are positionally shifted so that the inner lead and electrode are aligned; the inner lead and electrode are bonded; relative positions of remaining inner leads and elctrodes are aligned; and the inner leads and elctrodes are individually connected by bonding.

Abstract: A wire bonding method in which a bonding wire is pressed against bonding surfaces by a bonding tool so that bonding is performed by applying ultrasonic vibrations to the bonding tool which makes scrubbing actions to smoothen the bonding surfaces while the bonding is being performed.

Abstract: A paste-dispensing apparatus for bonding machines, etc., which constantly dispenses a fixed amount of paste, glue, etc. regardless of the amount remaining in a syringe and detects the amount of paste remaining in the syringe, including an air supply which supplies air under positive pressure to the syringe, a dispensing valve installed between the syringe and the air supply and connected to the syringe via a first pipe and to the air supply via a second pipe so that the syringe and the air supply communicate with each other when the paste is discharged, a first pressure sensor which measures the pressure inside the first pipe, a second pressure sensor which measures the pressure inside the second pipe, and a controller. Pressure values measured by the first and second pressure sensors are supplied to the controller so that the controller outputs a signal which actuates the dispensing valve so that the first and second pipes communiate when the paste is discharged.

Abstract: An apparatus for manufacturing semiconductor devices wherein a curing oven cures samples of dies bonded to lead frames by adhesives, a wire bonder which is installed adjacent to and in line with the curing oven wire-bonds the samples which have been cured in the curing oven, and a sample feeding mechanism feeds the samples to the curing oven and then to a wire-bonding section of the wire bonder; thus, there is no need for separate transport of the samples following curing or for repeated heating of the samples, and product reliability and productivity are improved. In addition, there is no need for a special curing oven or special measures to prevent oxidation following curing.

Abstract: A workpiece heating and feeding device having a lid which is installed above a heating block which heats the workpieces, the lid having an opening formed in the central portion thereof wherein a transparent heat-resistant plate covers the opening in the lid. The lid may alternately be entirely made of a heat-resistant material. Since the heating block is covered, no dirt or dust can enter the interior of the device. In addition, since the lid has either a transparent plate or is itself made of a transparent heat-resistant material, working conditions can easily be monitored and adjustments to the feeding of the workpiece facilitated.

Abstract: A dispenser apparatus for dropping paste onto a substrates, etc. including a syringe having a nozzle, a motor which moves the syringe up and down, a controller which controls the rotational stopping positions and rotational speed of the motor, and digital switches for inputting a setting program into the controller. The setting program sets the rotational stopping positions and rotational speed of the motor so that the position at which lowering of the nozzle stops and the speed at which the nozzle is raised are controlled through the setting program.

Abstract: A wafer supplying apparatus including a supply ring to which a wafer sheet having semiconductor pellets adhered thereto is attached, a ring holder provided on an X-Y table of a pellet pick-up device, the ring holder supporting and placing the wafer sheet onto the upper surface of a cylindrical portion of the ring holder having an external diameter smaller than the internal diameter of the supply ring, a pressing ring provided above the supply ring, a pusher which pushes down the supply ring around the cylindrical portion of the ring holder through the pressing ring, and a fastener which fastens the pressing ring to the ring holder after the supply ring has been pushed down by the pusher.

Abstract: A wire bonding method for connecting a first bonding point and a second bonding point via a wire including the steps of first connecting the wire to the first bonding point, raising a capillary slightly and moving it slightly away from the second bonding point, raising the capillary further by an amount sufficient for forming the wire loop with the wire being played out, moving the capillary over the second bonding point along a circular track which has a radius sufficient for forming the wire loop, and connecting the wire to the second bonding point.