Abstract: The present disclosure relates to an austenitic stainless steel contains C?0.10 mass %, Si?0.50 mass %, 3.0?Mn?8.0 mass %, P?0.30 mass %, S?0.30 mass %, 7.0 Ni?12.0 mass %, 18.0?Cr?28.0 mass %, 1.0?Mo?3.0 mass %, 0.03?V?0.50 mass %, 0.0003?B?0.0300 mass %, 0.0001?Ca?0.0300 mass %, 0.35?N?0.80 mass %, W?2.0 mass %, Zr?0.20 mass %, Cu?0.5 mass %, Al?0.10 mass %, and O?0.050 mass %, with a balance being Fe and unavoidable impurities. The austenitic stainless steel has a number density of coarse alloy carbonitrides of 3×105 pieces/mm2 or less.

Abstract: According to one embodiment, a mobile terminal for use in a self-service checkout system includes a processor, a communication interface connectable to a reservation management server, and a display screen. The processor receives product identification information for identifying a product to be purchased in a sales transaction, and displays a reservation request screen on the display screen to receive a reservation request for which a reservation time for using an accounting device for settlement processing of the sales transaction is set. The processor sends the reservation request to the reservation management server via the communication interface and receives a reservation request response from the reservation management server. The reservation request response includes reservation information when the reservation request is accepted by the reservation management server.

Abstract: A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.

Abstract: To provide a bonding technique that is capable of bonding a metal and a resin with a sufficient bonding strength. A bonded article including a functional group-carrying metal surface and a functional group-carrying resin surface, which are bonded directly to each other, the functional group-carrying metal surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a metal, the functional group-carrying resin surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a resin.

Abstract: An electrode body having an electrode, and a primer layer or a plurality of primer layers laminated on the electrode, wherein the at least one primer layer is an in-situ polymerizable composition layer formed from a polymerization product of an in-situ polymerizable composition, a method for producing an electrode body, and an electrochemical element.

Abstract: A capacitor module is provided with a case with a bottom surface and an opening, a first capacitor group including first capacitors each having first and second electrodes, and a side surface connecting the first and second electrodes, a second capacitor group including second capacitors each having third and fourth electrodes, and a side surface connecting the third and fourth electrodes, a first bus bar having an electrode contact portion in contact with the first electrode, a second bus bar having an electrode contact portion in contact with the third electrode, a third bus bar having an electrode contact portion commonly in contact with the second electrode and the fourth electrode, a sealing resin filled in the case; and an insulating member provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and surrounded by the sealing resin.

Abstract: A cooling mechanism for a vehicle electric motor. The cooling mechanism includes: a coolant oil passage provided between a rotor core and a rotor shaft of the electric motor; an oil supply passage provided inside the rotor shaft and communicating with the coolant oil passage; and at least one first discharge port and at least one second discharge port provided in respective first and second end plates disposed on respective opposite sides of the rotor core. The coolant oil passage includes a first passage portion communicating with the at least one first discharge port, and a second passage portion communicating with the at least one second discharge port. Each of the at least one first discharge port is located in a position that is different from a position of any one of the at least one second discharge port as seen in an axial direction of the rotor shaft.

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Abstract: The present invention relates to a polishing apparatus and a polishing method for polishing a substrate while detecting a film thickness of the substrate by analyzing reflected light from the substrate on a polishing pad. The polishing apparatus includes a polishing table (3) configured to support a polishing pad (2) having a through-hole (61); a pad-height measuring device (32) configured to measure a height of the polishing surface (2a); a pure-water supply line (63) and a pure-water suction line (64) coupled to the through-hole (61); a flow-rate adjusting device (71) coupled to the pure-water supply line (63); and an operation controller (35) configured to control an operation of the flow-rate adjusting device (71).

Abstract: There is disclosed a polishing apparatus which allows for easy replacement of a light source with another type of light source. The light-source assembly includes: a base fixed to a polishing table and coupled to a light-emitting transmission line; and a light-source module having a lamp for emitting light. The light-source module is removably attached to the base. The base is a common base which is adapted to any of a plurality of light-source modules of different types including the light-source module. The base includes a positioning structure which achieves positioning of the light-source module relative to the base.

Abstract: A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is an in-situ polymerizable composition layer of an in-situ polymerizable composition polymerized on the thermoplastic resin material.

Abstract: A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.

Abstract: The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head (7) by supplying a rinsing liquid into a through-hole (51) formed in a polishing pad (2) on a polishing table (3) before or after polishing of a substrate (W) with use of slurry, the optical sensor head (7) being located below the through-hole (51); and discharging the rinsing liquid from the through-hole (51) through a drain line (54).

Abstract: A polishing device has a substrate stage which holds a substrate Wf, a processing head which processes a surface of the substrate Wf, an indentation detecting system which detects a position of an indentation in the substrate Wf, a movement mechanism which moves the processing head in a radial direction of the substrate stage, and a rotation mechanism which rotates the substrate stage, and the indentation detecting system has a fluid injection nozzle configured to inject a fluid to a circumferential edge portion of the substrate Wf when the substrate Wf is held on the substrate stage, a fluid measuring device which measures a physical quantity which is pressure or a flow rate of the fluid, and a position detector which detects the position of the indentation formed in the circumferential edge portion of the substrate Wf based on a change in physical quantity.

Abstract: The present invention provides production of hydroxylated fatty acid by a hydration reaction using a novel enzyme derived from Lactobacillus and using fatty acid as a substrate, and further, a production method of oxo fatty acid by an enzyme reaction or chemical oxidation reaction using the hydroxylated fatty acid as a substrate. In addition, a valuable novel rare fatty acid obtained by such production method is also provided.

Abstract: The invention provides a metabolism improving agent containing a rare fatty acid such as hydroxylated fatty acid, oxo fatty acid and the like, and further, food, pharmaceutical product and the like containing the metabolism improving agent.

Abstract: The present invention relates to a precipitation-hardening martensitic stainless steel, containing: 0<C<0.10 mass %, 0<Si?0.20 mass %, 0<Mn?1.00 mass %, 8.0 mass %?Ni?15.0 mass %, 8.0 mass %?Cr?14.0 mass %, 0.4 mass %?Nb?2.50 mass %, and the balance being Fe and inevitable impurities.

Abstract: A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.