Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced at a low manufacturing cost and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an insulating substrate. The method includes a step of forming a conductive pattern as a recognition mark on one surface where the wiring patterns are formed, and a step of forming a through hole from a surface where the wiring pattern is not formed toward the conductive pattern. In the substrate, bumps connected with the KGD are formed on the surface on which the wiring patterns are not formed. Also, the conductive pattern may have a shape as the recognition mark or the through hole may have the shape as the recognition mark.

Abstract: A method is provided, comprising the steps of inserting the contact terminal section of the contact provided in a socket into a hole provided in the substrate, sliding the socket relative to a surface of the substrate on which the hole is formed, while maintaining the state in which the contact terminal section is inserted into the hole provided in the substrate, and fixing the socket and the contact terminal section to the substrate, while maintaining the state in which the socket and the contact terminal section are made to slide.

Abstract: A latch locking mechanism of a KGD carrier includes a carrier retaining member having a cover and a chip retaining member, a carrier base assembly having a carrier main body, a substrate, and a carrier base, at least two opposite latches rotationally movably provided on the cover of the carrier retaining member and each including an operation portion and a locking portion which generally form an L shape, and engaging portions provided on the carrier main body of the carrier base assembly to engage with the corresponding locking portions of the latches. When the locking portions of the two opposite latches are closed, the locking portions engage with the corresponding engaging portions provided on the carrier main body to lock the carrier retaining member and the carrier base assembly.

Abstract: A KGD carrier holds the IC chip by means of a carrier retaining member and a carrier base assembly. The carrier base assembly includes a carrier body, a carrier base and a substrate. The carrier body is provided with grooves, which are located opposing to pads formed on a peripheral portion of the substrate, to permit the in-and-out motion of contacts of the IC socket. The carrier base is provided with the grooves, which are located opposing to the pads formed on the peripheral portion of the substrate, to permit the in-and-out motion of the contacts of the IC socket. The substrate is interposed between the carrier body and the carrier base so as to enable the pads of the substrate and the corresponding contacts of the IC socket to be electrically connected with each other.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: An open top IC socket according to the present invention includes a plurality of IC package mounting units each including a socket body that includes a plurality of pairs of contact sections into which terminals of an IC package are inserted and each of which is able to open and close, and each further including a slide block slidably overlapped on the socket body for opening and closing the contact sections, a socket base for containing and holding the IC package mounting units in an aligned state, a coupling member for mutually coupling the individual slide blocks of the IC package mounting units, and a block operation element mounted on the socket base for sliding the individual slide blocks in the direction of sliding of the slide blocks. According to the present invention, the mounting and detaching of the plurality of the IC packages can be achieved simultaneously.

Abstract: A latch locking mechanism of a KGD carrier includes a carrier retaining member having a cover and a chip retaining member, a carrier base assembly having a carrier main body, a substrate, and a carrier base, at least two opposite latches rotationally movably provided on the cover of the carrier retaining member and each including an operation portion and a locking portion which generally form an L shape, and engaging portions provided on the carrier main body of the carrier base assembly to engage with the corresponding locking portions of the latches. When the locking portions of the two opposite latches are closed, the locking portions engage with the corresponding engaging portions provided on the carrier main body to lock the carrier retaining member and the carrier base assembly.

Abstract: A KGD carrier holds the IC chip by means of a carrier retaining member and a carrier base assembly. The carrier base assembly includes a carrier body, a carrier base and a substrate. The carrier body is provided with grooves, which are located opposing to pads formed on a peripheral portion of the substrate, to permit the in-and-out motion of contacts of the IC socket. The carrier base is provided with the grooves, which are located opposing to the pads formed on the peripheral portion of the substrate, to permit the in-and-out motion of the contacts of the IC socket. The substrate is interposed between the carrier body and the carrier base so as to enable the pads of the substrate and the corresponding contacts of the IC socket to be electrically connected with each other.

Abstract: An open top IC socket according to the present invention includes a plurality of IC package mounting units each including a socket body that includes a plurality of pairs of contact sections into which terminals of an IC package are inserted and each of which is able to open and close, and each further including a slide block slidably overlapped on the socket body for opening and closing the contact sections, a socket base for containing and holding the IC package mounting units in an aligned state, a coupling member for mutually coupling the individual slide blocks of the IC package mounting units, and a block operation element mounted on the socket base for sliding the individual slide blocks in the direction of sliding of the slide blocks. According to the present invention, the mounting and detaching of the plurality of the IC packages can be achieved simultaneously.

Abstract: A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced while manufacturing cost is low and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an insulating substrate. The method includes step of forming a conductive pattern as a recognition mark on one surface where the wiring patterns are formed, and step of forming a through hole from a surface where the wiring pattern is not formed toward the conductive pattern. In the substrate, bumps connected with the KGD are formed on the surface on which the wiring patterns are not formed. Also, the conductive pattern may have a shape as the recognition mark or the through hole may have the shape as the recognition mark.

Abstract: An IC carrier includes a carrier base, a carrier cover and a wiring sheet, through which an IC and a socket contact each other, interposed between the carrier cover and the wiring sheet. The IC is retained by the carrier base such that the IC and the wiring sheet face each other. The IC carrier further includes a plurality of connecting pins projecting from an opposing surface of one of the carrier base and the carrier cover. The connecting pins are inserted into through-holes formed in the wiring sheet and then press fitted into connecting holes formed in the other of the carrier base and the cover, so that an area in the vicinity of a peripheral edge of the wiring sheet is sandwiched between the carrier base and the carrier cover.

Abstract: An IC carrier retains an IC and a wiring sheet in an opposed relation so that electrical connection can be achieved between the IC and a socket through the wiring sheet. The IC carrier comprises a slip-preventive sheet capable of suppressing lateral displacement of the wiring sheet with respect to the IC by exerting a surface pressure against the wiring sheet.

Abstract: Between an IC and an IC receptacle is interposed a flexible wiring sheet, via which contact pieces of the IC and contacts of the IC receptacle are held in contact with one another. In this case, lateral deviation and flexing of the wiring sheet are prevented satisfactorily, and proper contact between the IC and IC receptacle is ensured. A back-up frame is applied by adhesive to the flexible wiring sheet to form a contact agency. The back-up frame 11 has a central window 11 to form a non-backed-up region in a central portion of the flexible wiring sheet 3 that covers the window. The IC 3 and flexible wiring sheet are held in forced contact with each other in the non-backed-up region. The back-up frame has an outer edge portion forming a back-up region for backing up an edge portion of the wiring sheet. In this back-up region, the IC receptacle and the flexible wiring sheet 1 are held in contact with each other.

Abstract: An IC carrier includes a carrier body for retaining a flexible wiring sheet and an IC in an opposing relation. The carrier body has suction holes formed in a flexible wiring sheet placing surface thereof and extending all the way through the carrier body. A negative pressure is applied to the flexible wiring sheet through the suction holes, thereby retaining a relative position between the flexible wiring sheet and the carrier body.

Abstract: An IC career includes a movable corner ruler for regulating one of the two diagonally opposed corner portions which are situated on opposite corners of an IC, and a reference ruler for regulating the other corner portion. The movable ruler is resiliently retained by a first and a second plate spring extending along the two sides forming the first-mentioned corner portion of the IC such that the first-mentioned one corner portion is resiliently urged towards the reference corner ruler. The first and second plate springs are connected with each other through a connection piece integrally blanked together with the first and second plate springs, and internal ends of the first and second plate springs extend from connection portions with respect to the connection piece so as to define free ends.

Abstract: A socket for an IC package includes a socket body having a plurality of contacts arranged thereon so as to be contacted respectively with corresponding leads arranged on the IC packages. Also a contact shutter cover is mounted on an upper surface of the socket body so as to permit upward and downward movement thereof. The contacts are displaced between a contacting position and a contact-releasing position in accordance with the upward and downward movement of the contact shutter cover. The socket for an IC package further includes a positioning device provided on the contact shutter cover and adapted to restrict side surfaces of the leads of the IC package placed in the socket body.

Abstract: In an IC socket, a depressing portion of a cover is pressed against a pressure receiving portion of a pressure receiving lever by downwardly pressing the cover, and then a contact portion of a contact is displaced in the rearward direction by movement of the pressure receiving lever. The depressing portion is formed by an inclined cam surface having a downward gradient in the rearward direction. When the cover is moved in the downward direction, the pressure receiving portion is caused to slidably move from the upper end side to the lower end side of the downwardly inclined cam surface.