Patents by Inventor Noriyuki Matsuoka

Noriyuki Matsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5628645
    Abstract: An IC socket includes a socket body, an IC package receiving portion formed in the socket body and adapted to receive an IC package therein, a plurality of contacts arranged in array along the IC package receiving portion, and a contact opening/closing cover overlying the socket body. The contacts are displaced between a position for contacting leads of the IC package and a position for removing the contacting relation upon upward and downward movements of the contact opening/closing cover. The IC socket further includes a positioning member which is displaced in the same direction as the contacts in upon the upward and downward movements of the contact opening/closing cover, so as to regulate the portions of the contacts in the neighborhood of a contacting portion of each contact.
    Type: Grant
    Filed: May 18, 1995
    Date of Patent: May 13, 1997
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Noriyuki Matsuoka, Kazumi Uratsuji
  • Patent number: 5573418
    Abstract: In a press-in connection type structure for connecting an electric part having a plurality of contact elements with a connection medium having a plurality of contact elements under pressure, a press-in connection type structure for an electric part being characterized in that a coil spring is used as the pressing mechanism. The coil spring is disposed in a horizontal posture generally along a contacting area between the contact elements, a compressive force being applied along a pressure line on one side of the horizontal coil spring extending along an axis of the coil spring, so that a multi-point pressing force is generated, as a reaction thereof, at each contacting point between each turn of the coil spring along another pressure line on the other side of the coil spring and the connection medium (or electric part), thereby electrically connecting the contact elements under pressure.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: November 12, 1996
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5567165
    Abstract: A connector carrier for an electric part comprising a pressure reduction chamber (31b) having an opening portion, a flat first part arranged in such a manner as to allow one surface of the first part (wiring sheet 6) to contact the opening portion of the pressure reduction chamber and a second part (IC4) disposed within the pressure reduction chamber such that when the pressure reduction chamber is reduced in pressure, the first part (6) is urged toward the second part side (4) by a difference in air pressure, thereby allowing contact elements on both of the first and second parts to contact with each other. A pressure increasing chamber (42a) can be provided on a side of the first part opposite the second part so as to urge the first part toward the second part. The pressure increasing chamber and the pressure decreasing chamber can be utilized independently or in combination.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: October 22, 1996
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5536969
    Abstract: An IC carrier comprises a carrier body having a wiring sheet with a pattern of leads on an upper surface thereof and an IC body on which the wiring sheet is superimposed. Each of the leads on the wiring sheet are provided with a first contact pad and a second contact pad. Each of contact pads is subjected to connection with a corresponding contact piece on the IC body, and each of the second contact pads is subjected to connection with a corresponding contact at an outer area of the superimposed portion. The second contact pads are arranged on an outer upper surface of the wiring sheet.
    Type: Grant
    Filed: June 28, 1995
    Date of Patent: July 16, 1996
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5529511
    Abstract: In an electrical contact, upper end portions of a pair of contact piece portions formed by blanking are bent along respective inclined folding lines into a generally inverted L-shape to form a pair of lead holding portions, so that a lead receiving slot is formed between the pair of lead holding portions, the two inclined folding lines being disposed respectively on blanked-out surfaces of the two contact piece portions. With this construction, the blanking is effected in such a manner that the pair of lead holding portions, as well as the pair of contact piece portions, can be spaced a sufficient distance from each other, and then by bending these lead holding portions, there can be formed the lead receiving slot having a sufficiently narrow width. Thus, the requirement for the narrow design of the lead receiving slot can be met, and therefore this electrical contact can be suitably used for a lead wire of a very thin design.
    Type: Grant
    Filed: June 30, 1995
    Date of Patent: June 25, 1996
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5494169
    Abstract: An IC carrier includes a movable corner ruler for restricting a first angular portion of an IC, and a reference corner ruler for restricting a second angular portion of the IC, the second angular portion of the IC being in a diagonal relation to the first angular portion of the IC. The movable corner ruler is resiliently supported by a spring structure such that the first angular portion is resiliently pushed toward the reference corner ruler. The movable ruler includes a pair of ruler elements for pushing those two sides of the IC which define the first angular portion of the IC, the movable corner ruler being movably resiliently supported by the spring structure for movement along such two sides of the IC.
    Type: Grant
    Filed: December 1, 1994
    Date of Patent: February 27, 1996
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5493150
    Abstract: An IC carrier comprising a case for receiving an IC, a carrier body for receiving the case, and a positioning device for correctly positioning the IC which is received in the case.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: February 20, 1996
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Noriyuki Matsuoka, Kazumi Uratsuji, Shunji Abe
  • Patent number: 5458499
    Abstract: An IC socket comprises an IC package receiving portion, a plurality of contact members arranged along the IC package receiving portion, and a contact shutter member for displacing the contact members between a contacting position relative to leads of the IC package and a releasing position. A positioning member is provided for restricting a body or the leads of the IC package by being operatively in connection with the contact shutter member. The positioning member is arranged such that a positioning operation thereof is made at the same time with or prior to the electrical contact between the contact members and the leads.
    Type: Grant
    Filed: December 27, 1993
    Date of Patent: October 17, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5458513
    Abstract: An electric contactor comprises a first resilient contact element and a second resilient contact element extending in an opposing relation to each other. The first and second resilient contact elements are connected together at first ends thereof and open at the second ends thereof. The first and second resilient contact elements are provided the second ends thereof with a first press contact portion and a second press contact portion, respectively, for resiliently clamping a lead pin of an electric part therebetween, the first and second press contact portions being arranged in such a manner as to be positionally displaced with respect to each other in a direction axially of the lead pin, and such that a spring portion extending from the first press contact portion to the connecting end thereof is different in length from a spring portion extending from the second press contact portion to the connecting end thereof.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: October 17, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5447444
    Abstract: An IC socket comprises an IC package receiving portion, a plurality of contact members arranged along the IC package receiving portion, and a contact shutter member for displacing the contact members between a position for contacting leads of the IC package and a releasing position. The improvement comprises a lifter operatively connected to the contact shutter member so as to be displaced between a position above and a position below the contacting position. The lifter receives the IC package in the position above the contacting position and delivers the IC package onto a support platform of the IC package receiving portion while being displaced to the position below the contacting position.
    Type: Grant
    Filed: December 27, 1993
    Date of Patent: September 5, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5443404
    Abstract: A socket, a plurality of which are to be arranged in a row on a wiring board, comprises hook-like engagement elements formed on opposite side surfaces thereof along a direction of the row. Each of the hook-like engagement elements is engagable with a counterpart of an adjacent socket, and a clearance is formed between each of the hook-like engagement elements and the counterpart of the adjacent socket.
    Type: Grant
    Filed: December 7, 1993
    Date of Patent: August 22, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5431587
    Abstract: A contact implanting structure including a plurality of contacts each having a pressure-insertion portion provided with an engagement claw projecting therefrom, and a plurality of contact pressure-insertion holes arranged in a row on a base plate formed of an electrically insulative material and adapted to permit the pressure-insertion portions to be inserted therein, the engagement claws of the pressure-insertion portions being caused to bite into walls of the contact pressure-insertion holes respectively, thereby mounting the contacts on the base plate in a row, adjacent the contact pressure-insertion holes being formed such as to have comparatively small and large bores respectively which are different in forward and backward dimension intersecting the direction where the contact pressure-insertion holes are arranged in a row, front walls of the adjacent contact pressure-insertion holes respectively having the comparatively small and large bores being staggered relative to each other, the staggered front w
    Type: Grant
    Filed: September 16, 1994
    Date of Patent: July 11, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5389819
    Abstract: An IC carrier has an IC body and a flexible wiring sheet superimposed on and contacted with the IC body. The carrier is loaded in a socket so that the wiring sheet may contact the socket. The socket comprises an elastic backup member for elastically pressing the superimposed portion of the wiring sheet so as to contact with the IC body. An operating device deflects the elastic backup member between the pressing position and a press-releasing position.
    Type: Grant
    Filed: December 9, 1993
    Date of Patent: February 14, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5389820
    Abstract: An IC carrier comprising a carrier body carrying an IC body, which is either alone or received in a protective case, a wiring sheet with a lead pattern applied onto an upper surface thereof and on which the wiring sheet is superimposed in such a manner as to cover an outer upper surface of the IC body, a plurality of fine adjustment pushers for pressing the IC body or the protective case sidewardly at plurality of points in order to slightly move the IC body or the protective case along an inner upper surface of the wiring sheet to adjust the position of the IC body so as to correctly correspond to the wiring sheet, each of the fine adjustment pushers being formed of male screw pins which are threadedly engaged with the carrier body and reciprocally moved, the IC body or the protective case being pressed sidewardly by end faces of the male screws, respectively.
    Type: Grant
    Filed: December 21, 1993
    Date of Patent: February 14, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5370559
    Abstract: A contact implanting structure including a plurality of contacts each having a pressure-insertion portion provided with an engagement claw projecting therefrom, and a plurality of contact pressure-insertion holes arranged in a row on a base plate formed of an electrically insulative material and adapted to permit the pressure-insertion portions to be inserted therein, the engagement claws of the pressure-insertion portions being caused to bite into walls of the contact pressure-insertion holes respectively, thereby mounting the contacts on the base plate in a row, adjacent the contact pressure-insertion holes being formed such as to have comparatively small and larvae bores respectively which are different in forward and backward dimension intersecting the direction where the contact pressure-insertion holes are arranged in a row, front walls of the adjacent contact pressure-insertion boles respectively having the comparatively small and large bores being staggered relative to each other, the staggered front
    Type: Grant
    Filed: November 10, 1993
    Date of Patent: December 6, 1994
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5368498
    Abstract: A presser cover 2 is open- and closably connected to a socket body 1 through a pivotal hinge. A metal frame 13 is embedded in a synthetic resin frame 12 forming a heat discharging opening portion 10 in the presser cover 2. This metal frame 13 can be used as a bearing portion of the pivotal hinge, etc. and also as a static electricity discharging means.
    Type: Grant
    Filed: September 3, 1993
    Date of Patent: November 29, 1994
    Assignee: Yamaichi Electric Co., Ltd.
    Inventors: Noriyuki Matsuoka, Masanori Egawa
  • Patent number: 5364286
    Abstract: An electric part socket includes a socket having a plurality of contacts. An electric part having a plurality of terminals can be placed on the socket such that the terminals are brought into contact with the contacts respectively when a press-down force is applied to a body of the electric part.
    Type: Grant
    Filed: April 29, 1993
    Date of Patent: November 15, 1994
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5362241
    Abstract: A contactor for an electric part comprises a plurality of pressure bearing elements connected at one ends thereof and extending in opposed relation to each other. The other ends are left as free ends. A movable contactor has a press contacting portion formed at a connection end of the pressure bearing elements. The press contacting portion is pushed up by the elastic force stored by the pressure bearing elements, which are closed or opened against the elasticity thereof, thereby obtaining a contact pressure with a contact of an electric part.
    Type: Grant
    Filed: September 2, 1993
    Date of Patent: November 8, 1994
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Noriyuki Matsuoka, Toru Takahashi
  • Patent number: 5352124
    Abstract: A socket for an IC package includes a plurality of contacts arranged in array in such a manner as to correspond to a plurality of IC leads of an IC package. Each of the contacts comprises a first unitary contact extending to a lower surface portion of each of the unitary IC leads so as to be brought into pressure contact with the lower surface portion, and a second unitary contact extending to a side surface portion of the lead so as to be brought into pressure contact with the side surface portion. The first and second unitary contacts have male terminals separately connected to a wiring board, respectively.
    Type: Grant
    Filed: May 26, 1993
    Date of Patent: October 4, 1994
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Noriyuki Matsuoka, Eisaku Tsubota
  • Patent number: 5334036
    Abstract: Contacts are positively shifted between a contact position and a release position by an operating member. The operating member is engaged by retaining elements formed on the contacts. Projections for damping sideward movement of the contacts are formed on an engagement surface of the operating member with respect to the contacts.
    Type: Grant
    Filed: December 31, 1992
    Date of Patent: August 2, 1994
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka