Patents by Inventor Olaf Hohlfeld

Olaf Hohlfeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MODULE INCLUDING A STABLE SOLDER JOINT
    Publication number: 20100068552
    Abstract: A solder includes a soft solder having a melting point less than 450° C. and particles embedded in the soft solder. Each particle has a maximum length greater than 50 ?m. The particles comprise greater than 10 Vol % and less than 60 Vol % of the solder.
    Type: Application
    Filed: November 19, 2009
    Publication date: March 18, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Jens Goerlich, Karsten Guth, Olaf Hohlfeld
  • MODULE INCLUDING A ROUGH SOLDER JOINT
    Publication number: 20090243089
    Abstract: A module includes a metallized substrate including a metal layer, a base plate, and a joint joining the metal layer to the base plate. The joint includes solder contacting the base plate and an inter-metallic zone contacting the metal layer and the solder. The inter-metallic zone has spikes up to 100 ?m and a roughness (Rz) of at least 20 ?m.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 1, 2009
    Applicant: Infineon Technologies AG
    Inventors: Olaf Hohlfeld, Reinhold Bayerer