Abstract: An inventive through transmission connecting device for connecting a first component made of a light absorbing material to a second component made of a light transmissive material by means of a light transmission bonding technology. The connecting device includes a first tool mounted to a first support retaining the first component and a second tool mounted to a second support retaining the second component. The first tool and the second tool are movable with respect to each other and the first tool is at least partly made of or includes a layer of a thermal isolator having a high thermal resistance.

Abstract: A circuit testing interface and test method are disclosed. The circuit testing interface may include a test current transmitting pad, a test voltage measuring pad, and at least one driving circuit comprising an output terminal. The output terminal of the at least one driving circuit may be coupled to a through-silicon via (TSV). The circuit testing interface may further include at least one switch module, coupled to (1) the output terminal of the driving circuit, (2) the test current transmitting pad, and (3) the test voltage measuring pad.

Abstract: A circuit test interface and a test method are disclosed. The circuit test interface may include a test voltage input pad, a test voltage output pad, and a plurality of input buffers. Each of the plurality of input buffers may have a first input terminal, a second input terminal, and an output terminal. The first input terminal of each respective input buffer may be coupled to one of a plurality of through-silicon vias (TSVs). The circuit test interface may further include a plurality of switch units. Each of the plurality of switch units may have a first terminal and a second terminal. The circuit test interface may further include a scan chain, coupled to both the output terminal of each of the plurality of input buffers and to the test voltage output pad.

Abstract: A circuit testing interface and test method are disclosed. The circuit testing interface may include a test current transmitting pad, a test voltage measuring pad, and at least one driving circuit comprising an output terminal. The output terminal of the at least one driving circuit may be coupled to a through-silicon via (TSV). The circuit testing interface may further include at least one switch module, coupled to (1) the output terminal of the driving circuit, (2) the test current transmitting pad, and (3) the test voltage measuring pad.

Abstract: A circuit test interface and a test method are disclosed. The circuit test interface may include a test voltage input pad, a test voltage output pad, and a plurality of input buffers. Each of the plurality of input buffers may have a first input terminal, a second input terminal, and an output terminal. The first input terminal of each respective input buffer may be coupled to one of a plurality of through-silicon vias (TSVs). The circuit test interface may further include a plurality of switch units. Each of the plurality of switch units may have a first terminal and a second terminal. The circuit test interface may further include a scan chain, coupled to both the output terminal of each of the plurality of input buffers and to the test voltage output pad.

Abstract: A testing circuit for verifying the impedance of off-chip drivers includes: a plurality of off-chip drivers (OCD), each off-chip driver including a through-silicon via (TSV); an IREF test pad, for driving a current to the plurality of off-chip drivers; a plurality of pre-drivers, each respective pre-driver coupled to one of the plurality of off-chip drivers, wherein the plurality of pre-drivers are configured to turn on the off-chip drivers; a VREF test pad, for inputting a reference voltage to the testing circuit; a plurality of input buffers (IB) for outputting a plurality of comparison results, each of the plurality of input buffers configured to output the plurality of comparison results according to the reference voltage and the voltage at the TSV nodes; and a test pad, coupled to the plurality of IBs, for receiving the comparison results to determine whether the impedance of each OCD is within a desired range.

Abstract: A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate are housed within an encapsulation material. The bottom surface of the first chip is attached to the package substrate. The top surface of the first chip has a first plurality of landing pads, which serve as a mechanical and electrical interface between the first and second chip. The bottom surface of the second chip has a second plurality of landing pads that serve as a mechanical and electrical interface between the second and first chip. Additionally, the top surface of the second chip has a third plurality of landing pads that serve as a mechanical and electrical interface between the second and third chip.

Abstract: A refresh scheduler is configured to refresh memory cells of a memory device according to a plurality of refresh intervals. The various refresh intervals are determined in response to refresh errors.

Abstract: Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.

Abstract: Embodiments of the invention generally provide a system, method and memory device for accessing memory. One embodiment includes synchronization circuitry configured to determine timing skew between a first memory device and a second memory device, and introduce a delta delay to at least one of the first memory device and the second memory device to adjust the timing skew.

Abstract: Embodiments of the invention generally provide a system, method, and memory device for accessing memory. In one embodiment, a first memory device includes command decoding logic configured to decode commands issued to the first memory device and a second memory device, while command decoding logic of the second memory device is bypassed.

Abstract: The present invention is generally related to integrated circuit devices, and more particularly, to methods and systems of a multi-chip package (MCP) containing a self-diagnostic scheme for detecting errors in the MCP. The MCP generally comprises a controller, at least one volatile memory chip having error detection logic, at least one non-volatile memory chip, and at least one fail signature register for storing fail signature data related to memory errors detected in the MCP. The controller can poll the fail signature register for fail signature data related to memory errors stored therein. Upon detection of fail signature data, the controller can store the fail signature data on a fail signature register located on a non-volatile memory.

Abstract: Embodiments of the invention generally provide an apparatus and technique for sharing an internally generated voltage between devices of a multi-chip package (MCP). The internally generated voltage may be shared via a conductive structure that electrically couples the devices and carries the internally generated voltage.

Abstract: A random access memory including a first amplifier, a second amplifier, a first data path, a second data path, and a first circuit. The first data path receives first data via first memory cells and the second data path receives second data via second memory cells. The first circuit is configured to receive the first data via the first data path and the second data via the second data path. The first circuit is configured to selectively provide the first data to the first amplifier and the second amplifier and the second data to the first amplifier and the second amplifier.

Abstract: A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate are housed within an encapsulation material. The bottom surface of the first chip is attached to the package substrate. The top surface of the first chip has a first plurality of landing pads, which serve as a mechanical and electrical interface between the first and second chip. The bottom surface of the second chip has a second plurality of landing pads that serve as a mechanical and electrical interface between the second and first chip. Additionally, the top surface of the second chip has a third plurality of landing pads that serve as a mechanical and electrical interface between the second and third chip.

Abstract: A memory includes a first macro chip, a spine chip, and a common substrate. The common substrate is configured to pass signals between the first macro chip and the spine chip. The first macro chip, the spine chip, and the common substrate provide a memory.

Abstract: The present invention is generally related to integrated circuit devices, and more particularly, to methods and systems of a multi-chip package (MCP) containing a self-diagnostic scheme for detecting errors in the MCP. The MCP generally comprises a controller, at least one volatile memory chip having error detection logic, at least one non-volatile memory chip, and at least one fail signature register for storing fail signature data related to memory errors detected in the MCP. The controller can poll the fail signature register for fail signature data related to memory errors stored therein. Upon detection of fail signature data, the controller can store the fail signature data on a fail signature register located on a non-volatile memory.

Abstract: Embodiments of the invention generally provide a system, method and memory device for accessing memory. One embodiment includes synchronization circuitry configured to determine timing skew between a first memory device and a second memory device, and introduce a delta delay to at least one of the first memory device and the second memory device to adjust the timing skew.

Abstract: Embodiments of the invention generally provide a system, method, and memory device for accessing memory. In one embodiment, a first memory device includes command decoding logic configured to decode commands issued to the first memory device and a second memory device, while command decoding logic of the second memory device is bypassed.

Abstract: Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.