Patents by Inventor Osamu Seya
Osamu Seya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9551851Abstract: An optical-electric composite cable includes an optical fiber, an inner tubular cover enclosing the optical fiber, a plurality of electric wires arranged outside the inner tubular cover, a binding member collectively bundling the plurality of electric wires, and an outer tubular cover covering an outer periphery of the binding member. A gap exists between the binding member and the outer tubular cover.Type: GrantFiled: April 11, 2014Date of Patent: January 24, 2017Assignee: Hitachi Metals, Ltd.Inventors: Hiroki Yasuda, Osamu Seya
-
Patent number: 9548143Abstract: A multipair cable includes an inner layer part including two differential signal transmission cables for an inner layer that are twisted together, a press winding tape wound around a periphery of the inner layer part, and an outer layer part including a plurality of differential signal transmission cables for an outer layer that are wound around an outer periphery of the press winding tape. The inner layer part further includes a buffer tape disposed between the two differential signal transmission cables.Type: GrantFiled: June 17, 2015Date of Patent: January 17, 2017Assignee: HITACHI METALS, LTD.Inventors: Takahiro Sugiyama, Hideki Nonen, Osamu Seya
-
Patent number: 9362632Abstract: A termination structure for high-speed transmission line includes a high-speed transmission line including a signal line configured to transmit a signal, an insulation which covers the signal line and an external conductor disposed at an outer periphery of the insulation, and a termination terminal disposed at a terminal of the high-speed transmission line. The termination terminal includes a holder disposed sandwiching the external conductor exposed at the terminal of the high-speed transmission line from both sides. The holder includes a holding part to hold the high-speed transmission line and is electrically connected to the external conductor. The holding part is formed so as to have a shape along an outer shape of the external conductor.Type: GrantFiled: April 2, 2014Date of Patent: June 7, 2016Assignee: HITACHI METALS, LTD.Inventors: Yoshinori Sunaga, Hideki Nonen, Takahiro Sugiyama, Osamu Seya
-
Publication number: 20150371736Abstract: A multipair cable includes an inner layer part including two differential signal transmission cables for an inner layer that are twisted together, a press winding tape wound around a periphery of the inner layer part, and an outer layer part including a plurality of differential signal transmission cables for an outer layer that are wound around an outer periphery of the press winding tape. The inner layer part further includes a buffer tape disposed between the two differential signal transmission cables.Type: ApplicationFiled: June 17, 2015Publication date: December 24, 2015Inventors: Takahiro SUGIYAMA, Hideki NONEN, Osamu SEYA
-
Publication number: 20150041177Abstract: An optical-electric composite cable includes an optical fiber, an inner tubular cover enclosing the optical fiber, a plurality of electric wires arranged outside the inner tubular cover, a binding member collectively bundling the plurality of electric wires, and an outer tubular cover covering an outer periphery of the binding member. A gap exists between the binding member and the outer tubular cover.Type: ApplicationFiled: April 11, 2014Publication date: February 12, 2015Applicant: Hitachi Metals, Ltd.Inventors: Hiroki YASUDA, Osamu SEYA
-
Patent number: 8948556Abstract: An optical-electrical composite cable includes an optical fiber, a tubular resin inner cover to enclose the optical fiber, a plurality of electric wires disposed on an outside of the inner cover, and a tubular outer cover to collectively cover the plurality of electric wires. The plurality of electric wires are helically wound around an outer peripheral surface of the inner cover so as to be situated between the inner cover and the outer cover.Type: GrantFiled: March 4, 2013Date of Patent: February 3, 2015Assignee: Hitachi Metals, Ltd.Inventors: Juhyun Yu, Osamu Seya, Yoshinori Sunaga, Kouki Hirano, Hiroki Yasuda, Yoshikazu Namekawa, Takanobu Watanabe
-
Publication number: 20140338951Abstract: A termination structure for high-speed transmission line includes a high-speed transmission line including a signal line configured to transmit a signal, an insulation which covers the signal line and an external conductor disposed at an outer periphery of the insulation, and a termination terminal disposed at a terminal of the high-speed transmission line. The termination terminal includes a holder disposed sandwiching the external conductor exposed at the terminal of the high-speed transmission line from both sides. The holder includes a holding part to hold the high-speed transmission line and is electrically connected to the external conductor. The holding part is formed so as to have a shape along an outer shape of the external conductor.Type: ApplicationFiled: April 2, 2014Publication date: November 20, 2014Applicant: HITACHI METALS, LTD.Inventors: Yoshinori SUNAGA, Hideki Nonen, Takahiro Sugiyama, Osamu Seya
-
Publication number: 20140211435Abstract: A conductive member connection structure includes a connection structure to electrically connect first and second conductive members that are positioned with a gap in between, a first metal member that is melted by heating and is welded to a connecting surface of the first conductive member and to a connecting surface of the second conductive member, and a second metal member that has a higher melting point than the first metal member and is covered with the first metal member without being melted by the heating. The second metal member is configured so as to prevent the first metal member from flowing out in a molten state thereof.Type: ApplicationFiled: January 9, 2014Publication date: July 31, 2014Applicant: Hitachi Metals, Ltd.Inventors: Hiroki YASUDA, Juhyun YU, Kouki HIRANO, Hiroshi KOMURO, Osamu SEYA
-
Publication number: 20140079359Abstract: An optical-electrical composite cable includes an optical fiber, a tubular resin inner cover to enclose the optical fiber, a plurality of electric wires disposed on an outside of the inner cover, and a tubular outer cover to collectively cover the plurality of electric wires. The plurality of electric wires are helically wound around an outer peripheral surface of the inner cover so as to be situated between the inner cover and the outer cover.Type: ApplicationFiled: March 4, 2013Publication date: March 20, 2014Applicant: HITACHI CABLE, LTD.Inventors: Juhyun YU, Osamu SEYA, Yoshinori SUNAGA, Kouki HIRANO, Hiroki YASUDA, Yoshikazu NAMEKAWA, Takanobu WATANABE
-
Publication number: 20120090865Abstract: A method of manufacturing a porous ultraviolet curable resin coated wire includes (a) preparing an ultraviolet curable resin composition not including a hydrous water absorbent polymer, (b) preparing a hydrous water absorbent polymer-dispersed ultraviolet curable resin composition having a water content of 40% or more by preparing a water-swollen hydrous water absorbent polymer including a water absorbent polymer and water, and then dispersing the hydrous water absorbent polymer into the ultraviolet curable resin composition, (c) forming a two-layer structure on a metal wire by coating the metal wire with the ultraviolet curable resin composition not including the hydrous water absorbent polymer and the hydrous water absorbent polymer, and (d) performing a dehydration on the two-layer structure.Type: ApplicationFiled: May 6, 2011Publication date: April 19, 2012Applicants: Hitachi Cable Fine-Tech, Ltd., HITACHI CABLE, LTD.Inventors: Yoshihisa Kato, Osamu Seya, Detian Huang
-
Publication number: 20120090871Abstract: A hydrous water absorbent polymer dispersed ultraviolet curable resin composition includes an ultraviolet curable resin composition, and a hydrous water absorbent polymer swollen by water beforehand, and dispersed in the ultraviolet curable resin composition so that the hydrous water absorbent polymer dispersed ultraviolet curable resin composition has a moisture content of not less than 50 percent. The water absorption rate of the ultraviolet curable resin composition is not more than 2 percent.Type: ApplicationFiled: May 3, 2011Publication date: April 19, 2012Inventors: Yoshihisa KATO, Tomiya Abe, Takao Miwa, Osamu Seya
-
Patent number: 8143517Abstract: An extra-fine copper alloy twisted wire including a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires including 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further including a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire includes a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.Type: GrantFiled: April 8, 2009Date of Patent: March 27, 2012Assignee: Hitachi Cable, Ltd.Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa
-
Publication number: 20090223713Abstract: An extra-fine copper alloy twisted wire comprising a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires comprising 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further comprising a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire comprises a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.Type: ApplicationFiled: April 8, 2009Publication date: September 10, 2009Applicant: Hitachi Cable, Ltd.Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa
-
Patent number: 7544886Abstract: An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1??h1/?h0)×100%] where ?h1 is a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and ?h0 is a tensile strength of the wire measured before the heat treatment.Type: GrantFiled: December 19, 2006Date of Patent: June 9, 2009Assignee: Hitachi Cable, Ltd.Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa
-
Publication number: 20070187134Abstract: An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1??h1/?h0)×100%] where ?h1 is a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and ?h0 is a tensile strength of the wire measured before the heat treatment.Type: ApplicationFiled: December 19, 2006Publication date: August 16, 2007Applicant: HITACHI CABLE, LTD.Inventors: Huang Detian, Hiromitsu Kuroda, Hakaru Matsui, Osamu Seya, Ryohei Okada, Shinichi Masui, Ryuji Nakagawa, Hiroshi Okikawa
-
Publication number: 20040187977Abstract: A wire rod comprising high-purity copper having a total unavoidable impurity content of not more than 1 ppm by mass and, added to the high-purity copper, 1.0 to 5.0% by mass of silver having a purity of not less than 99.99% by mass is drawn to an ultrafine copper alloy wire with a diameter of not more than 0.08 mm. According to this constitution, since the content of foreign matter, causative of breaking of wires, in a base material has been minimized, excellent wire drawability and bending properties can be realized. Further, since silver is used as an additive element, the ultrafine copper alloy wire possesses excellent tensile strength. This constitution can further realize a stranded copper alloy wire conductor, and an extrafine coaxial cable possessing excellent tensile strength, wire drawability, and bending properties.Type: ApplicationFiled: April 8, 2004Publication date: September 30, 2004Applicant: HITACHI CABLE, LTD.Inventors: Hakaru Matsui, Takaaki Ichikawa, Seigi Aoyama, Ryohei Okada, Osamu Seya
-
Patent number: 6768183Abstract: An NPN bipolar transistor and a PNP bipolar transistor are formed in a semiconductor substrate. The NPN bipolar transistor has a p type emitter region, a p type collector region and an n type base region and is formed in an NPN forming region. The PNP bipolar transistor has an n type emitter region, an n type collector region and a p type base region and is formed in a PNP forming region. Only one conductive type burying region is formed in at least one of the NPN forming region and the PNP forming region. A current that flows from the p type emitter region to the n type base region flows in the n type base region in a direction perpendicular to the substrate.Type: GrantFiled: April 19, 2002Date of Patent: July 27, 2004Assignee: Denso CorporationInventors: Shigeki Takahashi, Satoshi Shiraki, Hiroaki Himi, Hiroyuki Ban, Osamu Seya
-
Patent number: 6751855Abstract: A process for forming an ultrafine copper alloy wire is provided. The alloy includes a copper matrix of high purity copper having a total unavoidable impurity content of not more than 10 mass ppm. The matrix contains 0.05 to 0.9 mass % of at least one metallic element of the group of tin, indium, silver, antimony, magnesium, aluminum, and boron. The alloy is melted in a carbon crucible. The molten alloy is cast into a wire rod utilizing a carbon mold. The wire rod is then subjected to a primary wire drawing, an annealing, and a secondary wire drawing. The produced ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.Type: GrantFiled: December 4, 2002Date of Patent: June 22, 2004Assignee: Hitachi Cable, Ltd.Inventors: Hakaru Matsui, Takaaki Ichikawa, Koichi Tamura, Seigi Aoyama, Osamu Seya, Ryohei Okada
-
Patent number: 6649843Abstract: This invention provides a composite conductor having excellent strength, flexing resistance and corrosion resistance, a production method thereof and a cable employing the same composite conductor. A corrosion resistant layer is formed of Au, Ag, Sn, Ni, solder, Zn, Pd, Sn—Ni alloy, Ni—Co alloy, Ni—P alloy, Ni—Co—P alloy, Cu—Zn alloy, Sn—Bi alloy, Sn—Ag—cu alloy, Sn—Cu alloy or Sn—Zn alloy in the thickness of 0.5 &mgr;m or more on an external periphery of a core made of copper-metal fiber conductor. A wire material made of the copper-metal fiber conductor is subjected to area reduction processing. In the middle of the area reduction processing or after the area reduction processing is completed, corrosion resistant layer is formed on the periphery of the wire material in the thickness of 0.Type: GrantFiled: April 16, 2001Date of Patent: November 18, 2003Assignee: Hitachi Cable, Ltd.Inventors: Seigi Aoyama, Koichi Tamura, Takaaki Ichikawa, Hakaru Matsui, Osamu Seya, Fumitaka Nakahigashi
-
Patent number: 6627009Abstract: In an extrafine or ultrafine copper alloy wire having an outer diameter of not more than 0.1 mm, the copper alloy wire is formed of a heat treated copper alloy comprising 0.05 to 0.9% by weight in total of at least one metallic element selected from the group consisting of tin, indium, silver, antimony, magnesium, aluminum, and boron and not more than 50 ppm of oxygen with the balance consisting of copper. By virtue of this constitution, the extrafine or ultrafine copper alloy wire has a combination of excellent bending fatigue lifetime based on high tensile strength and excellent torsional strength based on high elongation or a combination of excellent tensile strength, electrical conductivity, and drawability and good elongation. The invention has been described in detail with particular reference to preferred embodiments, but it will be understood that variations and modifications can be effected within the scope of the invention as set forth in the appended claims.Type: GrantFiled: November 17, 2000Date of Patent: September 30, 2003Assignee: Hitachi Cable Ltd.Inventors: Hakaru Matsui, Takaaki Ichikawa, Seigi Aoyama, Koichi Tamura, Osamu Seya, Hiroshi Komuro, Ryohei Okada, Shigetoshi Goto