Abstract: A carbon monoxide removing catalyst such as a ruthenium supporting catalyst is provided for removing, through oxidation thereof, carbon monoxide from an alcohol reformed gas containing hydrogen and carbon monoxide to be supplied to a fuel cell. For its activation, the catalyst is caused to contact an inactive gas or a hydrogen-containing inactive gas consisting of less than 50 volume % of hydrogen gas and the remaining volume of inactive gas, thereby to avoid poisoning of the electrode of the fuel cell with carbon monoxide.

Abstract: A carbon monoxide removing catalyst such as a ruthenium supporting catalyst is provided for removing, through oxidation thereof, carbon monoxide from an alcohol reformed gas containing hydrogen and carbon monoxide to be supplied to a fuel cell. For its activation, the catalyst is caused to contact an inactive gas or a hydrogen-containing inactive gas consisting of less than 50 volume % of hydrogen gas and the remaining volume of inactive gas, thereby to avoid poisoning of the electrode of the fuel cell with carbon monoxide.

Abstract: A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and (f) firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.

Abstract: An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.

Abstract: A system controller 115 includes a table data storage 131 storing table data for calculating the order of priority of each destination, and a priority destination list creator 132 for creating a priority destination list based on the table data in such a manner that priorities of destinations that suit the preferences of the user will set high based on destination conditions set by the user and the stored table data.

Abstract: To provide with a navigation apparatus capable of efficient route guidance in which a date on which route guidance process is performed coincides with an available date and time, and in consideration with a stay length. The navigation apparatus in this implementation is provided with a GPS reception section, a sensor section, a map data storage section in which data such as map data is recorded in advance, and a system control section which generates design data and performs process management on the basis of the generated design data. The system control section searches routes on the basis of spot data groups related to an extracted destination, generates route data on the basis of the search results, the spot data and an input departure time, and manages route guidance on the basis of the generated route data.

Abstract: A fabrication method of a semiconductor device comprises the steps of forming a metal thin film Whose oxide is insulative on sidewall of a hole formed in a semiconductor substrate and forming an insulating metal oxide film by oxidizing the metal thin film.

Abstract: A management system of a machine equipped with a driving-power source reads out maintenance conditions from a storage means of maintenance management information when data and conditions, concerned about a maintenance management of a machine, the features of the machine, and so on, including the maintenance conditions, are inputted from the input means. Then, information about predicted maintenance management under a certain operation time of the machine is predicted with reference to the maintenance conditions. Subsequently, the information about the predicted maintenance management is represented on a display means. Furthermore, a maintenance predicted value is previously stored in a data base or the like with respect to the maintenance within an operation time under the contract or within a contract term for each of a plurality of contract ranks. A maintenance actual result value of the machine being entered is accumulatively stored.

Abstract: A communicating apparatus performs an asynchronous communication with a base station. The communicating apparatus is provided with: a receiving device for receiving a down link signal, which is transmitted from the base station and in which a division signal is inserted for each of constant time intervals; a detecting device for detecting division signals out of the received down link signal, in phase to the constant time intervals; an adding device for adding the detected division signals over a predetermined time duration, which is longer than the constant time interval, with matching phases for each of the constant time intervals, so as to generate accumulated additional values; and a memory device for storing the accumulated additional values generated by the adding device, to thereby perform synchronization capturing with the base station on the basis of the accumulated additional values added over the predetermined time duration and stored in the memory device.

Abstract: When the quick traverse play back command (or, quick returning play back command) of the audio information by the compression audio information is given to the play back apparatus, by the control of the control section, the special audio according to the temporarily stored data stored in the first storage means is repeatedly played back, instead of the play back of the audio by the ordinary play back operation.

Abstract: A mobile communication system including a plurality of base stations arranged in a communication area, each emitting a radio wave inherent thereto and a mobile station moving in the communication area and communicating with respective base stations via the transmitted radio waves. There is previously stored a location correlation data group including correlation data representing correlation situations of a plurality of arriving radio waves produced by the transmitted radio waves at respective ones of a plurality of sampling locations within the communication area, the location correlation data corresponding to respective locations. Upon reception of radio waves at a current location of the mobile station, current correlation data is calculated representing correlation situations among received arriving radio waves for the respective mobile station.

Abstract: A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet 1. The adhesive agent layer 3 and a substrate are then aligned and the semiconductor wafer and the substrate are adhered via the adhesive agent layer 3 to avoid defects caused by fluidity of an under filling material.

Abstract: Disclosed herein is a hardenable pressure-sensitive adhesive sheet enabling production of a semiconductor device of high reliability while preventing the occurrence of package cracking and other failure; and a process for producing a semiconductor device with the use of the hardenable pressure-sensitive adhesive sheet. There is provided a hardenable pressure-sensitive adhesive sheet having a hardenable pressure-sensitive adhesive layer comprising a pressure-sensitive component (A) and an epoxy resin (B), wherein the hardenable pressure-sensitive adhesive layer after thermal curing has a storage modulus of 1.0×107 Pa or below at 100° C. and 1.0×105 Pa or above at 160° C.

Abstract: A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.

Abstract: A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips 2 are intermittently formed on a tape shaped base material 11 in the longitudinal direction of the base material 11 to have a substantially identical shape with that of the semiconductor chip 2 to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions 12 has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips 2 and prevent a wasteful use of an adhesive agent.

Abstract: The present invention provides a sheet to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches. The sheet to form a protective film for chips of the present invention comprises a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component.

Abstract: A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet 1. The adhesive agent layer 3 and a substrate are then aligned and the semiconductor wafer and the substrates are adhered via the adhesive agent layer 3 to thereby avoid defects caused by fluidity of an under filling material.

Abstract: A semiconductor integrated circuit is adhered to the substrate and includes semiconductor integrated circuit electrodes. A hardened adhesive agent layer is formed from an adhesive agent with gradable adhesiveness and has conductor bodies buried therein. The adhesive agent includes a (meth)acrylate copolymer having a weight-average molecular weight of not less than 30,000, an epoxy resin having a weight-average molecular weight of 100 to 10,000, a photopolymerizable low molecular compound and thermal activation latent epoxy resin curing agent. The conductor bodies are connected with the semiconductor integrated circuit electrodes, and the adhesive agent layer is aligned with the substrate so that the conductor bodies buried in the adhesive agent layer and the substrate electrodes are electrically connected.

Abstract: This invention provides a rubber-coated stainless steel plate suitable as a gasket core material with excellent adhesion to the rubber layer, a method of manufacturing the same, and a gasket comprising the rubber-coated stainless steel plate. The following are provided by the present invention: a stainless steel plate having a roughened surface on which chrome hydroxide, chrome oxide, iron hydroxide, and iron oxide are deposited; a rubber-coated stainless steel plate formed by coating the surface of the stainless steel plate with a rubber layer; a gasket comprising the rubber-coated stainless steel plate; and a method of manufacturing the stainless steel plate, wherein the stainless steel plate is roughened with at least one of chemical roughening and electrochemical roughening and is then subjected to cathode electrolytic treatment in an alkaline solution.

Abstract: A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.