Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a suspended Majorana fermion device comprising an ion implant defined nanorod in a semiconducting device are provided. According to an embodiment, a quantum computing device can comprise a Majorana fermion device coupled to an ion implanted region. The quantum computing device can further comprise an encapsulation film coupled to the ion implanted region and a substrate layer. The encapsulation film suspends the Majorana fermion device in the quantum computing device.

Abstract: Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.

Abstract: Techniques facilitating low thermal conductivity support systems within cryogenic environments are provided. In one example, a cryostat can comprise a support rod and a washer. The support rod can couple first and second thermal stages of the cryostat. The washer can intervene between the support rod and the first thermal stage. The washer can thermally isolate the support rod and the first thermal stage.

Abstract: Techniques facilitating increased operational reliability for jib cranes are provided. In one example, a jib crane can comprise a mast, a shaft mechanism, and a rod. The mast can extend vertically from a base structure. The shaft mechanism can be disposed within the mast. The rod can be coupled to a boom arm and can be disposed within the shaft mechanism. Rotation of the rod can facilitate continuous rotation of the boom arm about a longitudinal axis of the rod with respect to the base structure.

Abstract: Techniques facilitating transfer port systems for cryogenic environments are provided. In one example, an outer vacuum chamber of a cryostat can comprise a sidewall encompassing an inner chamber comprising a sample mounting surface. The sidewall can comprise a feedthrough port providing access to the sample mounting surface from a region external to the outer vacuum chamber.

Abstract: Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.

Abstract: Techniques facilitating custom thermal shields for cryogenic environments are provided. In one example, a cryostat can comprise a thermal shield extending between a thermal stage and a base structure coupled to a bottom plate of an outer vacuum chamber. The thermal stage can be coupled to a top plate of the outer vacuum chamber. The thermal shield can provide access to a sample mounting surface encompassed within the thermal shield from a region external to the outer vacuum chamber via the top and bottom plates of the outer vacuum chamber.

Abstract: Techniques facilitating mechanical vibration management for cryogenic environments are provided. In one example, a system can comprise a processor that executes computer executable components stored in memory. The computer executable components can comprise a linearization component and a drive component. The linearization component can translate data indicative of a nonlinear drive signal into a linear drive signal. The drive component can dynamically control operation of a compressor of a cryocooler using the linear drive signal. The cryocooler can provide cooling capacity for a cryogenic environment.

Abstract: An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.

Abstract: A device includes a first substrate formed of a first material that exhibits a threshold level of thermal conductivity. The threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, the device also includes a second substrate disposed in a recess of the first substrate, the second substrate formed of a second material that exhibits a second threshold level of thermal conductivity. The second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, at least one qubit is disposed on the second substrate. In an embodiment, the device also includes a transmission line configured to carry a microwave signal between the first substrate and the second substrate.

Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Abstract: A qubit control system for a quantum computer includes an optical waveguide configured to receive and transmit therethrough a wavelength division multiplexed optical signal which has a plurality of modulated optical carriers, each optical carrier being at a different optical wavelength and carrying a digital qubit control signal; an optical demultiplexer optically coupled to the optical waveguide to receive the multiplexed optical signal to recover the plurality of modulated optical carriers; a plurality of photodetectors in communication with the optical demultiplexer; a plurality of cryogenic filters in communication with the plurality of photodetectors, each being configured to filter corresponding one of the plurality of digital qubit control signals to provide a corresponding one of a plurality of analog qubit control signals which is directed to a corresponding superconducting qubit and the photodetectors. The cryogenic filters are provided at a cryogenic temperature.

Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.

Abstract: A system includes a quantum processor includes a plurality of qubits. For each qubit, there is a circulator operative to receive a control signal and an output signal from the qubit. An isolator is coupled to an output of the circulator. A quantum-limited amplifier is coupled to an output of the isolator and configured to provide an output of the qubit. A multiplexor (MUX) is configured to frequency multiplex the outputs of at least two of the plurality of qubits as a single output of the quantum processor.

Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a suspended Majorana fermion device comprising an ion implant defined nanorod in a semiconducting device are provided. According to an embodiment, a quantum computing device can comprise a Majorana fermion device coupled to an ion implanted region. The quantum computing device can further comprise an encapsulation film coupled to the ion implanted region and a substrate layer. The encapsulation film suspends the Majorana fermion device in the quantum computing device.

Abstract: A quantum computing system includes a dilution refrigerator having a plurality of chambers. A trapped ion computing device includes a first set of qubits in a given chamber of the plurality of chambers of the dilution refrigerator. A superconducting computing device having a second set of superconducting qubits is inside the given chamber of the plurality of chambers of the dilution refrigerator.

Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.

Abstract: A quantum system includes a qubit array comprising a plurality of qubits. A bus resonator is coupled between at least one pair of qubits in the qubit array. A switch is coupled between the at least one qubit pair of qubits.

Abstract: A qubit control system for a quantum computer includes a source of a plurality optical carriers; an optical modulator to receive the plurality optical carriers and to modulate each optical carrier with a qubit control signal to provide a plurality of modulated optical signals; an optical multiplexer to provide a wavelength division multiplexed optical signal; an optical waveguide to receive and transmit the wavelength division multiplexed optical signal therethrough; an optical demultiplexer to receive the wavelength division multiplexed optical signal to recover each of the plurality of modulated optical signals; a demodulator to receive each of the recovered plurality of modulated optical signals to output a corresponding plurality of recovered qubit control signals to control subsets of a plurality of qubits.

Abstract: Techniques for designing and fabricating quantum circuitry, including a coplanar waveguide (CPW), for quantum applications are presented. With regard to a CPW, a central conductor and two return conductor lines can be formed on a dielectric substrate, with one return conductor line on each side of the central conductor and separated from it by a space. The central conductor can have bridge portions that can be raised a desired distance above the substrate and base conductor portions situated between the bridge portions and in contact with the surface of the substrate; and/or portions of the substrate underneath the bridge portions of the central conductor can be removed such that the bridge portions, whether raised or unraised, can be the desired distance above the surface of the remaining substrate, and the base conductor portions can be in contact with other portions of the surface of the substrate that were not removed.