Abstract: A heater assembly that that is effective at maintaining heating lamps at acceptable temperatures is disclosed. The heater assembly utilizes radiative heat transfer to transfer unwanted heat buildup in the heating lamps to a cooling base. One or more high emissivity films are disposed between the heating lamps and the cooling base to facilitate heat transfer. Further, a reflective coating is applied to a portion of the heating lamps to reflect heat away from the cooling base. The heater assembly may be utilized in a high vacuum environment as it does not rely on convective cooling.

Abstract: Embodiments herein disclose a de-coupled substrate lift mechanism installation bracket and method of adjusting a plane of a lift pin hoop of the substrate lift mechanism. In one embodiment an apparatus for making adjustments about two remote axes includes a first adjustment mechanism and a second adjustment mechanism. The first adjustment mechanism includes a common member, one or more first side members, a connector member, and a plurality of first joints pivotably coupling the common member, the one or more first side members, and the connector member. The second adjustment mechanism includes a first body having the common member, one or more second side members, a first frame member, and a plurality of second joints pivotably coupling the common member, the one or more second side members, and the first frame member.

Abstract: An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.

Abstract: Embodiments herein disclose a de-coupled substrate lift mechanism installation bracket and method of adjusting a plane of a lift pin hoop of the substrate lift mechanism. In one embodiment an apparatus for making adjustments about two remote axes includes a first adjustment mechanism and a second adjustment mechanism. The first adjustment mechanism includes a common member, one or more first side members, a connector member, and a plurality of first joints pivotably coupling the common member, the one or more first side members, and the connector member. The second adjustment mechanism includes a first body having the common member, one or more second side members, a first frame member, and a plurality of second joints pivotably coupling the common member, the one or more second side members, and the first frame member.

Abstract: A planar end effector and method of making a planar end effector. The method may include the steps of applying adhesive to a first side of a first sheet, the first sheet having a second side opposite the first side, and disposing a first side of a second sheet on the adhesive, the second sheet having a second side opposite the first side, wherein the first sides of the first and second sheets confront each other and define an at least partially adhesive-filled bond-gap therebetween and wherein the second sides of the first and second sheets are parallel with one another. The method may further include the steps of curing the adhesive to produce a planar composite workpiece including the first sheet, the second sheet, and an intermediate adhesive layer, and cutting the end effector from the composite workpiece.

Abstract: A composite end effector including a lower sandwich panel having a first side and a second side opposite the first side, an upper sandwich panel having a first side and a second side opposite the first side, wherein the first side of the upper sandwich panel is bonded to the first side of the lower sandwich panel, and an intermediate element disposed between the second side of the lower sandwich panel and the second side of the upper sandwich panel. The intermediate element may include an electrical conductor, wherein an electrostatic chuck is electrically coupled to the electrical conductor through an aperture in the upper sandwich panel. Alternatively or additionally, the intermediate element may include a pair of optical fibers disposed within a pair of channels formed in at least one of the first side of the upper sandwich panel and the first side of the lower sandwich panel.

Abstract: A composite end effector including a lower sandwich panel having a first side and a second side opposite the first side, an upper sandwich panel having a first side and a second side opposite the first side, wherein the first side of the upper sandwich panel is bonded to the first side of the lower sandwich panel, and an intermediate element disposed between the second side of the lower sandwich panel and the second side of the upper sandwich panel. The intermediate element may include an electrical conductor, wherein an electrostatic chuck is electrically coupled to the electrical conductor through an aperture in the upper sandwich panel. Alternatively or additionally, the intermediate element may include a pair of optical fibers disposed within a pair of channels formed in at least one of the first side of the upper sandwich panel and the first side of the lower sandwich panel.

Abstract: A planar end effector and method of making a planar end effector. The method may include the steps of applying adhesive to a first side of a first sheet, the first sheet having a second side opposite the first side, and disposing a first side of a second sheet on the adhesive, the second sheet having a second side opposite the first side, wherein the first sides of the first and second sheets confront each other and define an at least partially adhesive-filled bond-gap therebetween and wherein the second sides of the first and second sheets are parallel with one another. The method may further include the steps of curing the adhesive to produce a planar composite workpiece including the first sheet, the second sheet, and an intermediate adhesive layer, and cutting the end effector from the composite workpiece.

Abstract: A heated platen having a heating element and an electrical contact assembly for the heating element is generally described. Various examples provide a dielectric plate including a heating element and a terminal disposed therein. An electrical connection assembly configured to connect the heating element to a power source is also provided. The electrical connection including an electrical connection plug, a conductive sleeve disposed within the electrical connection plug, and a connector pin having a bottom portion and a top portion, the bottom portion disposed within the sleeve, the top portion having a spring structure, the spring structure configured to maintain electric contact with the terminal throughout a range of temperatures.

Abstract: An end effector includes a base, a plurality of fingers extending from the base, and a plurality of pads disposed on each of said fingers to support a substrate. The fingers comprise a carbon fiber material and taper from a first diameter and first wall thickness proximate said base to a second diameter smaller than said first diameter and second wall thickness smaller than said first wall thickness distal said base. A method includes adhering a plurality of pads along a plurality of tapered fingers, and adhering proximal ends of the plurality of tapered fingers with corresponding recesses of a base. The assembled pads, tapered fingers and base are placed on a fixture such that top surfaces of the plurality of pads rest on a top surface of the fixture and the assembly is held in place on the fixture until the adhesive has cured at room temperature.

Abstract: Techniques for handling media arrays are disclosed. The techniques may be realized as a system for handling a plurality of substrates. The system may comprise a plurality of row elements for supporting the plurality of substrates, wherein the plurality of row elements may be operable to change configuration of the substrates from open configuration to a high-density configuration, where a distance between adjacent substrates in the open configuration may be greater than a distance between the adjacent substrates in the high-density configuration.

Abstract: An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.

Abstract: Techniques for handling media arrays are disclosed. The techniques may be realized as a system for handling a plurality of substrates. The system may comprise a plurality of row elements for supporting the plurality of substrates, wherein the plurality of row elements may be operable to change configuration of the substrates from open configuration to a high-density configuration, where a distance between adjacent substrates in the open configuration may be greater than a distance between the adjacent substrates in the high-density configuration.

Abstract: A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. The optic can be rotated radially relative to a center point of the substrate edge to allow for focused inspection of all surfaces of the substrate edge.

Abstract: An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate. A clean ignition system is used to ignite the combustion flame.

Abstract: An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate.

Abstract: A method and apparatus for dry chemical processing a wafer at atmospheric pressure is disclosed. The edge area of a substrate is placed in isolation from the remainder of the substrate. According to the present teachings, a method for centering a wafer on a rotatable chuck is provided. The method includes the steps of positioning a wafer adjacent to a micrometer. The wafer is then rotated and a plurality of wafer edge locations and rotational increments are measured. A center offset value for the value of the wafer center with respect to a chuck is calculated. The wafer is then moved with respect to a center position of the chuck.

Abstract: An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate. A seal arrangement is provided for the processing chamber.

Abstract: A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. The optic is held at an angle from a surface normal to avoid reflective artifacts from the specular surface of the substrate. The optic can be rotated radially relative to a center point of the substrate edge to allow for focused inspection of all surfaces of the substrate edge. The plurality of lights can modulate color and intensity of light to enhance inspection of the substrate for defects.