Substrate transfer structure
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Description
The broken lines are for the purpose of showing environmental structure, and form no part of the claimed design.
Claims
We claim the ornamental design for a substrate transfer structure, substantially as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
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Patent History
Patent number: D938373
Type: Grant
Filed: Oct 25, 2019
Date of Patent: Dec 14, 2021
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Jason M. Schaller (Austin, TX), Benjamin Riordon (Newburyport, MA), Mitchell DiSanto (Georgetown, TX), Paul Forderhase (Austin, TX), Gary Wyka (Cedar Park, TX), Jeffrey Hudgens (San Francisco, CA), Paul Z. Wirth (Kalispell, MT), Charles T. Carlson (Austin, TX), Siva Chandrasekar (Hosur), Michael Carrell (Austin, TX), Venkata Raghavaiah Chowdhary Kode (Pflugerville, TX), Dmitry A. Dzilno (Sunnyvale, CA), Juan Carlos Rocha-Alvarez (San Carlos, CA)
Primary Examiner: Michael C Stout
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/710,816
Type: Grant
Filed: Oct 25, 2019
Date of Patent: Dec 14, 2021
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Jason M. Schaller (Austin, TX), Benjamin Riordon (Newburyport, MA), Mitchell DiSanto (Georgetown, TX), Paul Forderhase (Austin, TX), Gary Wyka (Cedar Park, TX), Jeffrey Hudgens (San Francisco, CA), Paul Z. Wirth (Kalispell, MT), Charles T. Carlson (Austin, TX), Siva Chandrasekar (Hosur), Michael Carrell (Austin, TX), Venkata Raghavaiah Chowdhary Kode (Pflugerville, TX), Dmitry A. Dzilno (Sunnyvale, CA), Juan Carlos Rocha-Alvarez (San Carlos, CA)
Primary Examiner: Michael C Stout
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/710,816
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)