Patents by Inventor Paul Panaccione
Paul Panaccione has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10838156Abstract: A mounting clip can be placed and secured over the exterior surfaces of a package of an integrated optical assembly. The mounting clip includes a top panel, end clips that curl and extend down from end edges of the top panel, an interference tab that extends up from the top panel, and cap clips that curl and extend up from the top panel. The mounting clip is dimensioned such that bends in the end clips press and secure against exterior side surfaces of the package of the integrated assembly. Thus, the mounting clip can be secured to the package of the integrated assembly using an interference or friction fit. A cap on a fiber optic cable that extends from the package can be curled around and secured between the interference tab and cap clips of the mounting clip to secure it during surface mounting.Type: GrantFiled: August 8, 2018Date of Patent: November 17, 2020Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.Inventors: Michael R. Johnson, Paul A. Cushion, Paul E. Hogan, Paul Panaccione, Dave G. Persad
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Patent number: 10290788Abstract: Light-emitting devices and particularly light-emitting device assemblies that include light-emitting diodes (LEDs) as light sources are described. The methods and systems of at least some of the embodiments described herein increase the removal of thermal energy generated by the light-emitting devices.Type: GrantFiled: November 24, 2009Date of Patent: May 14, 2019Assignee: Luminus Devices, Inc.Inventors: Jay Guoxu Liu, Paul Panaccione
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Publication number: 20190049674Abstract: A mounting clip can be placed and secured over the exterior surfaces of a package of an integrated optical assembly. The mounting clip includes a top panel, end clips that curl and extend down from end edges of the top panel, an interference tab that extends up from the top panel, and cap clips that curl and extend up from the top panel. The mounting clip is dimensioned such that bends in the end clips press and secure against exterior side surfaces of the package of the integrated assembly. Thus, the mounting clip can be secured to the package of the integrated assembly using an interference or friction fit. A cap on a fiber optic cable that extends from the package can be curled around and secured between the interference tab and cap clips of the mounting clip to secure it during surface mounting.Type: ApplicationFiled: August 8, 2018Publication date: February 14, 2019Inventors: Michael R. Johnson, Paul A. Cushion, Paul E. Hogan, Paul Panaccione, Dave G. Persad
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Patent number: 9627582Abstract: The present invention relates to light-emitting diodes (LEDs), and related components, processes, systems, and methods. In certain embodiments, an LED that provides improved optical and thermal efficiency when used in optical systems with a non-rectangular input aperture (e.g., a circular aperture) is described. In some embodiments, the emission surface of the LED and/or an emitter output aperture can be shaped (e.g., in a non-rectangular shape) such that enhanced optical and thermal efficiencies are achieved. In addition, in some embodiments, chip designs and processes that may be employed in order to produce such devices are described.Type: GrantFiled: June 28, 2012Date of Patent: April 18, 2017Assignee: Luminus Devices, Inc.Inventors: Donald L. McDaniel, Jr., Michael Lim, Michael Gregory Brown, Scott W. Duncan, Andrei Kazmierski, Paul Panaccione
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Publication number: 20150249190Abstract: A system and method for displacing the etendue value of light emitted as measured in a plane at an emission surface of a light emitting device to a second plane at determined height above the emission surface using a light coupling layer. The system and method increases light output or extraction of generated light from the light emitting device through a light coupling layer.Type: ApplicationFiled: October 10, 2014Publication date: September 3, 2015Applicant: Luminus Devices, Inc.Inventors: Paul Panaccione, Yves Bertic, Rommanie Kuch, Lidia Hsueh Lee, Alexei A. Erchak
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Publication number: 20140014987Abstract: The present disclosure relates to shifting a chromaticity of light generated from a light-emitting device. A light-emitting device may incorporate an optical element (e.g., filter) so that light emitted from a light-generating surface having an initial chromaticity may be altered. The optical element may shift the chromaticity of emitted light having the initial chromaticity to a final chromaticity that is different from the initial chromaticity. Thus, the chromaticity of emitted light from the manufactured LEDs that would otherwise be unacceptable for having chromaticity coordinates that fall outside of a desired chromaticity bin is shifted so as to have chromaticity coordinates that fall within suitable parameters. Accordingly, a number of the manufactured LEDs that would normally be discarded may be salvaged.Type: ApplicationFiled: July 10, 2012Publication date: January 16, 2014Applicant: Luminus Devices, Inc.Inventors: Paul Panaccione, Arvind S. Baliga
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Publication number: 20130175551Abstract: A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.Type: ApplicationFiled: May 10, 2012Publication date: July 11, 2013Applicant: LUMINUS DEVICES, INC.Inventors: Michael Lim, Paul Panaccione, Aaron Breen, Michael Hadley
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Patent number: 8362703Abstract: Light-emitting devices, and related assemblies, systems and methods are described. Specifically, at least some of the embodiments relate to light-emitting devices including proximate switching element(s). The switching element(s) control the current, or power, supplied to the light-emitting devices.Type: GrantFiled: December 22, 2008Date of Patent: January 29, 2013Assignee: Luminus Devices, Inc.Inventors: Rashmi Kumar, Robert F. Karlicek, Jr., Paul Panaccione
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Publication number: 20110121347Abstract: Light-emitting devices and particularly light-emitting device assemblies that include light-emitting diodes (LEDs) as light sources are described. The methods and systems of at least some of the embodiments described herein increase the removal of thermal energy generated by the light-emitting devices.Type: ApplicationFiled: November 24, 2009Publication date: May 26, 2011Applicant: Luminus Devices, Inc.Inventors: Jay Guoxu Liu, Paul Panaccione
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Publication number: 20110121703Abstract: One or more embodiments presented herein include a light emitting system and/or device that can include a thermal management system. The thermal management system can provide for transport and/or dissipation of heat generated by a light emitting device.Type: ApplicationFiled: February 22, 2008Publication date: May 26, 2011Applicant: Luminus Devices, Inc.Inventors: Robert F. Karlicek, JR., Daniel Yen Chu, Joseph D. Whitney, Paul Panaccione, Warren P. Pumyea, Brian L. Stoffers, Michael A. Joffe, Alexei A. Erchak
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Publication number: 20110057216Abstract: A low profile optoelectronic device package has a matalized transparent substrate, a chip and a dam ring. The matalized transparent substrate has a transparent board, a window area, and a metal pattern formed on a face of the transparent board and around the window area and having at least one outer contact pad and at least two contact pads. An active face of the chip is mounted to the at least two inner contact pads and aligned to the window area. A bottom face of the chip, that is opposite to the active face is further added a soldering layer. The dam ring is sealed a joint between the chip and the matalized transparent substrate so as to define an air cavity among the chip, the matalized transparent substrate and the dam ring. The matalized transparent substrate is used as a substrate and an optical cover of a conventional device package, so the optoelectronic device package provides low profile, small area outline, low fabricating cost and high lighting efficiency.Type: ApplicationFiled: September 10, 2009Publication date: March 10, 2011Inventors: Ming-Kuen Chiu, Chin-Ta Fan, Chien-Cheng Wei, Paul Panaccione
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Patent number: 7692207Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.Type: GrantFiled: August 23, 2005Date of Patent: April 6, 2010Assignee: Luminus Devices, Inc.Inventors: Alexei A. Erchak, Paul Panaccione, Robert F. Karlicek, Jr., Michael Lim, Elefterios Lidorikis, Jo A. Venezia, Christian Hoepfner
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Publication number: 20100038670Abstract: The embodiments described herein are drawn generally towards illumination assemblies including light emitting devices. In some embodiments, the illumination assemblies including chip-scale packaged light-emitting devices and optical elements.Type: ApplicationFiled: August 18, 2009Publication date: February 18, 2010Applicant: Luminus Devices, Inc.Inventors: Paul Panaccione, Alexei A. Erchak
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Patent number: D606021Type: GrantFiled: March 29, 2007Date of Patent: December 15, 2009Assignee: Luminus Devices, Inc.Inventors: Paul Panaccione, Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Daniel Mendoza, Michael Denninger
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Patent number: D617289Type: GrantFiled: March 29, 2007Date of Patent: June 8, 2010Assignee: Luminus Devices, Inc.Inventors: Paul Panaccione, Christian Hoepfner, Georgia Chmielewski
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Patent number: D622663Type: GrantFiled: March 29, 2007Date of Patent: August 31, 2010Assignee: Luminus Devices, Inc.Inventors: Paul Panaccione, Christian Hoepfner, Georgia Chmielewski
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Patent number: D623608Type: GrantFiled: March 29, 2007Date of Patent: September 14, 2010Assignee: Luminus Devices, Inc.Inventors: Paul Panaccione, Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Jr., Daniel Mendoza, Michael Denninger
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Patent number: D623609Type: GrantFiled: March 29, 2007Date of Patent: September 14, 2010Assignee: Luminus Devices, Inc.Inventors: Paul Panaccione, Christian Hoepfner, Georgia Chmielewski
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Patent number: D624029Type: GrantFiled: March 29, 2007Date of Patent: September 21, 2010Assignee: Luminus Devices, Inc.Inventors: Paul Panaccione, Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Daniel Mendoza, Michael Denninger
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Patent number: D777121Type: GrantFiled: March 5, 2013Date of Patent: January 24, 2017Assignee: Luminus Devices, Inc.Inventors: Paul Panaccione, Scott W. Duncan, Donald L. McDaniel, Jr.