Abstract: The present disclosure relates to semiconductor structures and methods for making the same. The semiconductor structure comprises a first insulation layer, a first semiconductor layer, and a conducting structure. The first semiconductor layer is over the first insulation layer. The first semiconductor layer comprises a first transistor. The first transistor comprises a first source region, a first drain region, and a first channel region under a first gate disposed over the first semiconductor layer. The conducting structure is disposed under the first channel region and spaced apart from the first drain region. The conducting structure is disposed over the first insulation layer and either within or in contact with the first semiconductor layer.

Abstract: A non-volatile memory device includes: an insulation layer; a PN diode, which is formed in a monocrystalline silicon layer, a monocrystalline germanium layer or a monocrystalline gallium arsenide layer on the insulation layer; a writing wire which is conductive and is electrically connected to the anode end of the PN diode; a memory unit on the PN diode, the memory unit being electrically connected to a cathode end of the PN diode; and a selection wire on the memory unit, the selection wire being electrically connected to the memory unit; wherein when the non-volatile memory device is selected for a data to be written into, a first current flows through the PN diode to write the data into the memory unit.

Abstract: A package structure is provided, which includes: a light emitting element having a first surface, a second surface opposite to the first surface, and a side surface adjacent to and connected with the first surface and the second surface; a fluorescent layer covering the first surface and the side surface of the light emitting element; a transparent layer covering the fluorescent layer with an inclined surface formed at an outer side of the transparent layer; and a reflective layer formed on the inclined surface and covering an outer side of the fluorescent layer. Therefore, light can be prevented from leakage from the outer side of the fluorescent layer. A method for fabricating the package structure is also provided.

Abstract: A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.

Abstract: A method for forming a phosphor material on a surface of a target is provided, which includes the steps of: providing a chamber for receiving the phosphor material constituted by a plurality of particles, wherein a grid is disposed on or beneath a surface constituted by the phosphor material in the chamber, and the grid has a plurality of fine lines SN each having opposite first and second ends, N being a positive integer greater than 1; exposing the surface of the target to the phosphor material; and creating a charge on the plurality of particles, generating an electric field between the chamber and the surface of the target and oscillating the plurality of fine lines, so as to drive the plurality of particles toward the surface of the target and to be deposited on the surface of the target.

Abstract: A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.

Abstract: A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.

Abstract: A method for dispensing powder includes: providing a device for dispensing powder, the device including a framework, warps connected to the framework, a trough for receiving powder, an actuating member for displacing at least one of the framework and the trough, and an action source for the powder to be detached from the warps and dispensed on an object; supplying the powder to the warps and generating an electric field for the powder to carry an electric charge and become charged powder; and providing a force, by the action source, to at least one of the framework and the warps for the charged powder to be detached from the warps, the charged powder moving dependent on the electric field and being dispensed on the object. The warps have equal amounts of charged powder carried thereon, allowing the charged powder to be distributed evenly.

Abstract: A light-emitting structure and a method of fabricating the light-emitting structure. The method includes covering an LED die provided on a carrier with a uniform phosphor layer, with an accommodation space constituted by the carrier and the uniform phosphor layer; and forming in the accommodation space a first light-pervious body such that the uniform phosphor layer in various shapes is formed on the LED die. The light-emitting structure thus fabricated has excellent optical property.

Abstract: A package structure is provided, which includes a light emitting element having opposite first and second sides, a coating body combined with side faces of the light emitting element, a fluorescent layer disposed on the second side, and a metal structure disposed on the first side. As the coating body is in contact with and combined with the side faces of the light emitting element, light will not be emitted from the side faces of the light emitting element. Therefore, the heat generated is reduced, and issues such as yellowing of the encapsulant and poor luminous efficiency due to overheating of the fluorescent powder are avoided. Further, the metal structure enhances the heat dissipation. A method for manufacturing the package structure is also provided.

Abstract: A method of manufacturing a light-emitting package structure is provided. The method includes disposing at least one light emitting element on a carrier and forming a reflective material. The light emitting element has opposite first and second sides and a plurality of third sides connected to the first side and the second side. The light emitting element is disposed on the carrier via the second side. The reflective material is formed on the third side of the light emitting element, so as to form a reflective film.

Abstract: A molded substrate is provided, including: a release film; and a plurality of phosphor particles formed on the release film, wherein the phosphor particles have gaps therebetween. A method of manufacturing a package structure is also provided, including: disposing at least one light emitting element on a carrier; forming a transparent adhesive layer on a surface of the light emitting element; disposing the molded substrate on the transparent adhesive layer with the phosphor particles disposed between the transparent adhesive layer and the release film; filling the transparent adhesive layer into the gaps of the phosphor particles to form a phosphor layer; and removing the release film, so as to obtain an even phosphor layer.

Abstract: The present disclosure provides a method of manufacturing a package structure. The method includes: providing a plurality of conductive portions and a light emitting element; encapsulating the light emitting element and the conductive portions by an encapsulant with a lateral surface of the light emitting element electrically insulated from the conductive portions; electrically connecting the light emitting element to the conductive portions by a conductive element. Accordingly, several methods can be selected to form the conductive element with no conventional limitations. The present disclosure further provides a package structure and a carrier.

Abstract: A method for fabricating a package structure is provided. At least one light emitting component is sucked and adhered to a carrier. An encapsulating member encapsulates the light emitting component. A conductive component is connected to the light emitting component.

Abstract: A package structure is provided, which includes a metal element, a light emitting element disposed on the metal element, an insulative body encapsulating the light emitting element, a conductive adhesive coupled to the light emitting element, and a phosphor layer covering the light emitting element and the conductive adhesive. By using the conductive adhesive as a circuit, the fabricating cost can be reduced for meeting the low-profile requirement. The present invention further provides a method of fabricating the package structure.

Abstract: A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.

Abstract: A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.

Abstract: A method of transferring a uniform phosphor layer on an article and a light-emitting structure having a uniform phosphor layer. The method includes disposing a surface of the article in a proximity of a carrier having the uniform phosphor layer on a surface thereon, and causing the uniform phosphor layer to be secured to the surface of the article. Therefore, the uniform phosphor layer is secured to the articles according to a contour of the article.

Abstract: A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.

Abstract: A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.