Abstract: An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.

Abstract: In a method for human speech processing in an automatic speech recognition (ASR) system, human speech is received at a speech interface of the ASR system, wherein the ASR system comprises embedded componentry for onboard processing of the human speech and cloud-based componentry for remote processing of the human speech. A keyword is identified at the speech interface within a first portion of the human speech. Responsive to identifying the keyword, a second portion of the human speech is analyzed to identify at least one command, the second portion following the first portion. The at least one command is identified within the second portion of the human speech. The at least one command is selectively processed within at least one of the embedded componentry and the cloud-based componentry.

Abstract: A MEMS device, comprising a plurality of stacked layers, includes a plurality of solder couplings that mechanically fasten and electrically couple the MEMS device to an external component. The plurality of solder couplings is connected atop a portion of an upper surface that extends past an edge surface of a MEMS layer to form a shelf and are electrically connected via the shelf to receive signals generated by the MEMS device. These signals are provided to the external component via the solder couplings.

Abstract: An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.

Abstract: An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.

Abstract: In a method for receive beamforming using an array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the array of ultrasonic transducers is defined. A pixel capture operation is performed at each array position of the plurality of array positions. The pixel capture operation includes transmitting ultrasonic signals using a transmit beam pattern comprising ultrasonic transducers of the array of ultrasonic transducers, the transmit beam pattern for forming an ultrasonic beam toward a region of interest, and receiving reflected ultrasonic signals using a receive beam pattern comprising at least one ultrasonic transducer of the array of ultrasonic transducers. Received reflected ultrasonic signals are combined for a plurality of array positions overlapping the region of interest in a receive beamforming operation to generate a pixel for a reference array position of the plurality of array positions.

Abstract: In a method for multipath reflection correction of acoustic signals received at an ultrasonic sensor, acoustic signals are received at the ultrasonic sensor over a time of flight range. Characteristics of multipath reflection signals of received acoustic signals are determined, wherein the characteristics of the multipath reflection signals of the received acoustic signals comprise a relationship of primary signal contributions to multipath reflection signal contributions for the acoustic signals received at the ultrasonic sensor at a plurality of times of flight for a plurality of locations of the ultrasonic sensor. The characteristics of the multipath reflection signals of received acoustic signals are compared to the received acoustic signals.

Abstract: In a method for multipath reflection correction of acoustic signals received at an ultrasonic sensor, characteristics of multipath reflection signals of the ultrasonic sensor are accessed, wherein the characteristics of the multipath reflection signals include a relationship of primary signal contributions to multipath reflection signal contributions for acoustic signals received at the ultrasonic sensor at a plurality of times of flight for a plurality of locations of the ultrasonic sensor. Acoustic signals are received at the ultrasonic sensor over a time of flight range while a target is interacting with the ultrasonic sensor, wherein the acoustic signals include a primary signal contribution and a multipath reflection signal contribution. The characteristics of the multipath reflection signals are compared to received acoustic signals.

Abstract: A microelectromechanical (MEMS) sensor has a capacitance that varies based on a sensed force. A charge signal representing that capacitance is provide at an input node of an amplifier of a sense circuit. The sense circuit includes a filter and analog-to-digital converter. Feedback from the filter and the analog-to-digital converter is also received at the input node of the amplifier. The sense circuit outputs a digital signal that is representative of the sensed force.

Abstract: An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.

Abstract: In a method for determining blood vessel characteristic change using an ultrasonic sensor, a plurality of ultrasonic signal transmit and receive operations are performed at a position overlying a blood vessel of a person using an ultrasonic sensor, where the plurality of ultrasonic signal transmit and receive operations generate a plurality of received signals. Depths of blood vessel walls are determined at the position for a plurality of time instances based on local maxima of a combination of an acoustic impedance mismatch and a motion characteristic based at least in part on the plurality of received signals. A change in a blood vessel characteristic is determined based at least in part on a difference between the depths of the blood vessel walls at the plurality of time instances.

Abstract: A modulator system for converting a current-varying sensor output to a digital representation is disclosed. The modulator system includes a resonator with a first resonator input and a second resonator input. The first resonator input carries a constant reference current and the second resonator input carries a varying input current. In response to a digital output, the resonator generates a complementary voltage output based on a difference between the constant reference current and the varying input current during a conversion time. The resonator resonates near or at zero frequency. An accumulated digital output is based on the accumulation of the digital output generated at each sampling clock cycle of the conversion time and represents a digital word proportional to the varying input current.

Abstract: A microelectromechanical (MEMS) sensor has a capacitance that varies based on a sensed force. A charge signal representing that capacitance is provide at an input node of an amplifier of a sense circuit. The sense circuit includes a filter and analog-to-digital converter. Feedback from the filter and the analog-to-digital converter is also received at the input node of the amplifier. The sense circuit outputs a digital signal that is representative of the sensed force.

Abstract: Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.

Abstract: Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.

Abstract: Light-detection systems that do not destroy the light to be detected or change the propagation direction of the light are described. In one aspect, a light-detection system includes an optical element composed of a substrate with a planar surface and a polarization insensitive, high contrast, sub-wavelength grating composed of posts that extend from the planar surface. The posts and/or lattice arrangement of the posts are non-periodically varied to impart orbital angular momentum and at least one helical wavefront on the light transmitted through the optical element.

Abstract: Light-detection systems that do not destroy the light to be detected or change the propagation direction of the light are described. In one aspect, a light-detection system includes an optical element composed of a substrate with a planar surface and a polarization insensitive, high contrast, sub-wavelength grating composed of posts that extend from the planar surface. The posts and/or lattice arrangement of the posts are non-periodically varied to impart orbital angular momentum and at least one helical wavefront on the light transmitted through the optical element.

Abstract: The present invention includes a method and system for processing images captured with an image-capturing device. According to the present invention, a method and system includes reconfiguring a display of an image based on the orientation of the image-capturing device when the image is captured. Through the use of the method and system in accordance with the present invention, a user can view captured images without having to account for a rotation of the image-capturing device. The method and system includes capturing the image with an image-capturing device, determining an orientation of the image-capturing device and reconfiguring a display of the image based on the orientation of the image-capturing device.

Abstract: Various embodiments of the present invention are directed to image viewing systems. In one aspect, an image viewing system includes a projection system (104, 504, 604), and a dynamically reconfigurable screen (102, 502, 602). The projection system projects two or more images of perspective views of objects or a scene onto the screen.

Abstract: Various embodiments of the present invention are directed to sensor networks and to methods for fabricating sensor networks. In one aspect, a sensor network includes a processing node (110, 310), and one or more sensor lines (102,202,302) optically coupled to the processing node. Each sensor line comprises a waveguide (116,216,316), and one or more sensor nodes (112,210). Each sensor node is optically coupled to the waveguide and configured to measure one or more physical conditions and, encode measurement results in one or more wavelengths of light carried by the waveguide to the processing node.