Abstract: The present disclosure is drawn to a piezoelectric thin film stack and method of preparing the same. The piezoelectric thin film stack can comprise a substrate with an oxide application surface, a metal oxide adhesive blend layer applied to the oxide application surface, and a piezoelectric film applied directly to the metal oxide adhesive blend layer.

Abstract: A method of forming a nano-structure involves forming a multi-layered structure including an oxidizable material layer established on a substrate, and another oxidizable material layer established on the oxidizable material layer. The oxidizable material layer is an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. Anodizing the other oxidizable material layer forms a porous anodic structure, and anodizing the oxidizable material layer forms a dense oxidized layer and nano-pillars which grow through the porous anodic structure into pores thereof. The porous structure is selectively removed to expose the nano-pillars. A surface (I) between the dense oxidized layer and a remaining portion of the oxidizable material layer is anodized to consume a substantially cone-shaped portion of the nano-pillars to form cylindrical nano-pillars.

Abstract: Nano-structure includes a substrate and a non-oxidized portion of a metal layer (having an expansion coefficient, during oxidation, that is more than 1) on the substrate. An oxide layer is formed on the non-oxidized portion. A plurality of metal oxide nano-pillars is grown from the oxide layer. Each nano-pillar is grown through a plurality of pores defined in a template. A space is defined between adjacent nano-pillars. A continuous metal oxide cap layer is over the nano-pillars and over, but not in, the space between adjacent nano-pillars. The cap layer is formed from end portions of the nano-pillars that merge together over a template surface. The cap layer is in contact with all of the nano-pillars. The oxide layer, the nano-pillars, and the oxide cap layer are formed from anodization of portions of the metal layer.

Abstract: An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising zinc-gallium oxide, zinc-indium oxide, zinc-gallium-tin oxide, or zinc-indium-tin oxide.

Abstract: A piezoelectric actuator is formed by forming first and second electrodes on a substrate, and depositing a material on the substrate and between side surfaces of adjacent first and second electrodes to form a thin film sheet within which the first and the second electrodes extend from a first surface of the thin film sheet towards a second surface of the thin film sheet opposite the first surface. The second electrode is interdigitated in relation to the first electrode. The side surfaces of the first and the second electrodes are at least substantially perpendicular to the substrate. The thin film sheet is to physically deform in response to an electric field induced within the thin film sheet via application of a voltage across the first and the second electrodes.

Abstract: A lead-free piezoelectric ceramic material has the general chemical formula xBiCoO3-y(Bi0.5Na0.5)TiO3-z(Bi0.5K0.5)TiO3, xBiCoO3-y(Bi0.5Na0.5)TiO3-zNaN-bO3, xBiCoO3-y(Bi0.5Na0.5)TiO3-zKNbO3, xBiCoO3-yBi(Mg0.5Ti0.5)O3-z(Bi0.5Na0.5)TiO3, xBiCoO3-yBa-TiO3-z(Bi0.5Na0.5)TiO3, or xBiCoO3-yNaNbO3-zKNbO3; wherein x+y+z=1, and x, y, z?0.

Abstract: The present disclosure is drawn to a thin film stack, which includes a substrate, a metal layer, and an adhesive layer comprising a blend of from 3 at % to 94 at % indium oxide, from 3 at % to 94 at % gallium oxide, and from 3 at % to 94 at % zinc oxide. The adhesive layer is adhered between the substrate and the metal layer.

Abstract: The present disclosure is drawn to a thin film stack, which includes a substrate, a metal layer, and an adhesive layer comprising a blend of from 3 at % to 94 at % indium oxide, from 3 at % to 94 at % gallium oxide, and from 3 at % to 94 at % zinc oxide. The adhesive layer is adhered between the substrate and the metal layer.

Abstract: The present disclosure is drawn to a thin film stack including a substrate, a metal layer, and an adhesive layer. The adhesive layer comprises a blend of zinc oxide and tin oxide, and the adhesive layer is adhered between the substrate and the metal layer.

Abstract: A piezoelectric mechanism includes first and second electrodes and a thin film sheet of piezoelectric material. The second electrode is interdigitated in relation to the first electrode. The first and the second electrodes are embedded within the thin film sheet. The thin film sheet is polarized in a direction at least substantially perpendicular to a surface of the thin film sheet. The thin film sheet is to physically deform in a shear mode due to polarization of the thin film sheet at least substantially perpendicular to the surface of the thin film sheet, responsive to an electric field induced within the thin film sheet at least substantially parallel to the sheet via application of a voltage across the first and the second electrodes.

Abstract: A method of forming a nano-structured substrate is provided, the method comprising including forming non-integral nano-pillars on a substrate surface and directionally etching the substrate surface using the non-integral nano-pillars as a mask to form integral nano-structures in the substrate.

Abstract: A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

Abstract: A fluid ejection device includes a firing chamber having an ejection orifice opposite a chamber floor, a heating element and a mesa projecting from the chamber floor, the mesa is spaced from the heating element to define a passive zone between the mesa and heating element.

Abstract: A piezoelectric actuator includes a cantilever membrane. A thin film sheet is affixed to one side of the cantilever membrane to bend the membrane in multiple directions in response to an electric field induced within the thin film sheet. A plurality of coplanar electrodes disposed on the thin film sheet are interdigitated in relation to one another to generate the electric field during application of a voltage across interdigitated electrodes.

Abstract: An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising indium oxide, tin oxide, gallium oxide, indium-tin oxide, indium-gallium oxide, tin-gallium oxide, or indium-tin-gallium oxide.

Abstract: In an embodiment, a method of compensating for capacitance change in a piezoelectric element of a fluid ejection device includes sensing a current driving a piezoelectric element, determining from the current that capacitance of the piezoelectric element has changed, and altering a rise time of the current driving the piezoelectric element to compensate for the changed capacitance.

Abstract: A heating element of a fluid ejection device, the heating element including a ring-type body, an inner edge of the body, and an outer edge of the body, wherein at least one of the inner edge and the outer edge defines an undulated surface contour.

Abstract: A fluid ejection device includes a firing chamber having a chamber floor with an orifice opposite the chamber floor and a heating element partially covering the chamber floor, a region of the chamber floor being contoured to define a cavity extending into the chamber floor.

Abstract: A method of depositing nano-dots on a substrate includes forming a template on the base, the template defining nano-pores, at least partially filling the nano-pores with a pillar material to define nano-pillars, depositing a dot material on the nano-pillars to define nano-dots on the nano-pillars, and contact printing the substrate with the array of nano-dots.

Abstract: A lead-free piezoelectric ceramic material has the general chemical formula xBi(A0.5Ti0.5)O3-y(Bi0.5K0.5)TiO3-z(Bi0.5Na0.5)TiO3, wherein x+y+z=1, x?0, and A=Ni or Mg.