Patents by Inventor Peter Wirtz

Peter Wirtz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140091482
    Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.
    Type: Application
    Filed: March 15, 2013
    Publication date: April 3, 2014
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
  • Patent number: 8222722
    Abstract: An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: July 17, 2012
    Assignee: ST-Ericsson SA
    Inventors: Nedyalko Slavov, Heinz-Peter Wirtz, Thomas Villiger, Kwei-Kuan Kuo
  • Publication number: 20120117670
    Abstract: The present invention refers to monoclonal humanized antibodies, which bind to the extracellular domain of the AXL receptor tyrosine kinase and which at least partially inhibit AXL activity.
    Type: Application
    Filed: May 11, 2010
    Publication date: May 10, 2012
    Applicant: U3 PHARMA GMBH
    Inventors: Peter Wirtz, Jens Ruhe, Takeshi Takilzawa, Tomoko Takayama
  • Patent number: 8125074
    Abstract: A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: February 28, 2012
    Assignee: ST-Ericsson SA
    Inventors: Nedyalko Slavov, Heinz-Peter Wirtz, Kwei-Kuan Kuo
  • Publication number: 20110061917
    Abstract: A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.
    Type: Application
    Filed: September 11, 2009
    Publication date: March 17, 2011
    Applicant: ST-ERICSSON SA
    Inventors: Nedyalko Slavov, Heinz-Peter Wirtz, Kwei-Kuan Kuo
  • Publication number: 20110064362
    Abstract: An integrated circuit device or package comprising: a laminated substrate, at least an electro-optical element at least partially inserted in the laminated substrate, and at least an optical wave-guide element at least partially inserted in the laminated substrate and optically coupled to the electro-optical element. An integrated circuit system comprising an integrated circuit device and a mounting plate carrying an optical wave-guide part or fiber.
    Type: Application
    Filed: September 11, 2009
    Publication date: March 17, 2011
    Applicant: ST-ERICSSON SA
    Inventors: Nedyalko Slavov, Heinz-Peter Wirtz, Kwei-Kuan Kuo
  • Publication number: 20110062576
    Abstract: An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package.
    Type: Application
    Filed: September 11, 2009
    Publication date: March 17, 2011
    Applicant: ST-ERICSSON SA
    Inventors: Nedyalko Slavov, Heinz-Peter Wirtz, Thomas Villiger, Kwei-Kuan Kuo
  • Publication number: 20100330095
    Abstract: The present invention refers to antibodies, particularly to monoclonal antibodies, which bind to the extracellular domain of the AXL receptor tyrosine kinase and which at least partially inhibit AXL activity.
    Type: Application
    Filed: November 12, 2008
    Publication date: December 30, 2010
    Applicant: U3 PHARMA GMBH
    Inventors: Thore Hettmann, Jens Niewoehner, Jens Ruhe, Peter Wirtz, Kerstin Selle, Esther Zwick-Wallasch, Mike Rothe
  • Patent number: 7692280
    Abstract: A portable object connectable package for an electronic device comprises: semiconductor die package, having a top surface and an opposite bottom surface, and a connector body mechanically supported by the semiconductor die package. The bottom surface includes a plurality of connection elements for connecting to a printed circuit board. The connector body includes a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO having a contacting area. The portable object connectable package is arranged to be coupled to a portable object positioner for removably positioning the contacting area of the portable object in contact with the plurality of resilient electrical connecting elements when the portable object is present in the portable object positioner.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: April 6, 2010
    Assignee: ST-Ericsson SA
    Inventors: Stefan Marco Koch, Heinz-Peter Wirtz, Alexander M. Jooss
  • Patent number: 7500617
    Abstract: Spindle device for the height adjustment and alignment of tracks on a substructure, having a transverse cantilever which is fixed to an elongate nut adjustable in height on a height adjustment spindle and which engages under the rail and which is formed as a horizontal spindle plate which is mounted on the elongate nut pivotably about a horizontal axis and on which a slide provided with a clamping mount device for the rail foot is displaceable by means of a second spindle device transverse to the height adjustment spindle.
    Type: Grant
    Filed: November 15, 2003
    Date of Patent: March 10, 2009
    Assignee: RAIL.ONE GmbH
    Inventors: Heinz-Peter Wirtz, Arnold Pieringer
  • Publication number: 20080224288
    Abstract: A portable object connectable package 1, 11, 21, 31, 41, 51, 61, 71, 81 for an electronic device comprises: —a semiconductor die package 2, 12, 22, 32, 42, 52, 62, 72, 82 comprising a top surface 2A, 12A, 22A, 32A, 42A, 52A, 62A, 72A, 82A and an opposite bottom surface 2B, 12B, 22B, 32B, 42B, 52B, 62B, 72B, 82B, the bottom surface comprising a plurality of connection elements 3A, 13A, 23A, 33A, 43A, 53A, 63A, 73A, 83A for connecting to a printed circuit board PCB, and—a connector body 4, 14, 24, 34, 44, 54, 64, 74, 84 mechanically supported by the semiconductor die package and comprising a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO, said circuit comprising a contacting area PO1.
    Type: Application
    Filed: March 21, 2006
    Publication date: September 18, 2008
    Applicant: NXP B.V.
    Inventors: Stefan Marco Koch, Heinz-Peter Wirtz, Alexander M. Jooss
  • Publication number: 20060011792
    Abstract: The invention relates to a screw device for high-adjusting and aligning rails on a track infrastructure comprising a transversal cantilever beam which clamps the rail on the underside and is fixed to a long nut (4) which is variably high guided along a high-adjusting screw (3). The inventive screw device is characterised in that the transversal cantilever beam is embodied in the form of a horizontal screw plate (7) which is pivotally arranged around a horizontal axis (20) on the long nut and on which a truck provided with a clamp fixing device (10,11) for a rail base can perpendicularly move with respect to the high-adjusting screw with the aid of a second screw device (14,16,17).
    Type: Application
    Filed: November 15, 2003
    Publication date: January 19, 2006
    Inventors: Heinz-Peter Wirtz, Arnold Pieringer
  • Publication number: 20040173521
    Abstract: In order to develop a filter material composed of stacked grid members, the invention proposes a filter material consisting of two stacked grid members that have a weld joint between them.
    Type: Application
    Filed: December 17, 2003
    Publication date: September 9, 2004
    Inventor: Peter Wirtz
  • Patent number: 6093478
    Abstract: A composite member has a diecast part and a hub part that consists of a harder material than the diecast part. The diecast part is attached to the hub part by diecasting within a diecast mold. The hub part has at least one end face. The at least one end face has an annular sealing projection that, during diecasting of the diecast part, rests at a surface of the diecast mold and is deformed by the diecast mold.
    Type: Grant
    Filed: April 18, 1997
    Date of Patent: July 25, 2000
    Assignees: Firma Ford-Werke AG, Firma Druckgusswerk Mossner GmbH
    Inventors: Arthur Jasinetzky, Hans-Peter Wirtz
  • Patent number: 5746296
    Abstract: In a torque converter with a cone-type lock-up clutch having a clutch disc (14) with a conical friction disc area (24) cooperating directly with the conical inner wall of the torque converter housing (1), the inner wall of the torque converter housing (1) has in its jacket part (2) at least two conical areas (K1 and K2) disposed concentrically of one another, the radially inner conical area (K1) having a relatively small angle and the radially outer conical area (K2) having a relatively large angle, and cooperates, with clutch discs (14 and 14') having different radial extents and having friction disc areas (23 and 23') with different cone angles.
    Type: Grant
    Filed: September 17, 1996
    Date of Patent: May 5, 1998
    Assignee: Ford Global Technologies, Inc.
    Inventor: Hans-Peter Wirtz
  • Patent number: 5611371
    Abstract: The invention relates to a shift/regulating valve for controlling hydrodynamic torque converters of automatic transmissions, comprising: a shifting component (11); and a valve body (12), which has: an end (13) facing the shifting component; an end (14) remote from the shifting component; a control pressure chamber (15) for a fluid medium; a guide bore extending from the control pressure chamber (15) to the end (13) remote from the shifting component; a control plunger (24) disposed in the guide bore and having at least one control groove (25a, 25b, 25c, 25d); a control pressure outlet (28) for the fluid medium from the control pressure chamber (15); a first pressure connection (29) to the control pressure chamber (15) for the fluid medium; at least one second pressure connection (30, 33, 36) connecting at least one working chamber (17, 18, 19, 20) with at least one outlet (31, 32, 34, 35); and at least one resilient element (26) at the end of the control plunger (24) remote from the shift; wherein at least on
    Type: Grant
    Filed: April 8, 1996
    Date of Patent: March 18, 1997
    Assignee: Ford Motor Company
    Inventor: Hans-Peter Wirtz
  • Patent number: 5582278
    Abstract: A pulse width modulated solenoid valve for control of hydrodynamic torque converters of automatic transmissions, comprising an electromagnetic switching element (11) and a valve body (12 ), wherein the valve body (12 ) has: an end (13 ) facing the switching element; an end (14 ) remote from the switching element; a control pressure chamber (15) for a fluid medium; a control spool (28) with at least one control groove (29a); a control pressure connection (20) to the control pressure chamber (15) for the fluid medium; at least one first pressure connection (22) connecting the control pressure chamber (15) to at least one outlet (21); at least one second pressure connection (24, 26) connecting at least one working chamber (16, 17) with at least one outlet (23, 25); at least one counter-pressure chamber (18) located at the opposite end of the valve body (12) to the control pressure chamber (15); at least one pressure connection (20, 22, 24, 26) being capable of being connected to at least one outlet (21, 23, 25)
    Type: Grant
    Filed: May 15, 1995
    Date of Patent: December 10, 1996
    Assignee: Ford Motor Company
    Inventor: Hans-Peter Wirtz
  • Patent number: 5553694
    Abstract: A control system for engaging and releasing a torque converter bypass clutch and for varying the torque capacity of the clutch by adjusting the torque converter torus chamber pressure in accordance with changing operating variables, the bypass clutch including a clutch release pressure chamber that is maintained at a calibrated pressure threshold valve whereby pressure clutch capacity control is achieved by controlling pressure differential in the converter.
    Type: Grant
    Filed: September 11, 1995
    Date of Patent: September 10, 1996
    Assignee: Ford Motor Company
    Inventors: Winfried F. Schulz, Johann Kirchhoffer, Hans-Peter Wirtz
  • Patent number: 5476963
    Abstract: Supported catalyst, process for its preparation and its use for the preparation of vinyl acetateThe invention relates to improved Pd/K/Au, Pd/K/Ba and Pd/K/Cd supported catalysts, their preparation and their use for the preparation of vinyl acetate from ethylene, acetic acid and oxygen in the gas phase. The stated catalysts are prepared by atomizing a solution of corresponding metal salts by means of ultrasonics and then applying them in such limited amounts and within such a limited time to the carrier particles, and beginning to dry them, so that the catalytically active metal salts cannot penetrate into the carrier particles as far as the core but only into a larger or smaller outer part.
    Type: Grant
    Filed: February 27, 1995
    Date of Patent: December 19, 1995
    Assignee: Hoechst AG
    Inventors: Peter Wirtz, Friedrich Wunder, Karl-Fred Worner
  • Patent number: 5422329
    Abstract: The invention relates to improved Pd/K/Au, Pd/K/Ba and Pd/K/Cd supported catalysts, their preparation and their use for the preparation of vinyl acetate from ethylene, acetic acid and oxygen in the gas phase. The stated catalysts are prepared by atomizing a solution of corresponding metal salts by means of ultrasonics and then applying them in such limited amounts and within such a limited time to the carrier particles, and beginning to dry them, so that the catalytically active metal salts cannot penetrate into the carrier particles as far as the core but only into a larger or smaller outer part.
    Type: Grant
    Filed: April 7, 1993
    Date of Patent: June 6, 1995
    Assignee: Hoechst AG
    Inventors: Peter Wirtz, Friedrich Wunder, Karl-Fred Worner