Patents by Inventor Peter Wirtz
Peter Wirtz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140091482Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.Type: ApplicationFiled: March 15, 2013Publication date: April 3, 2014Applicant: STATS CHIPPAC, LTD.Inventors: Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Patent number: 8222722Abstract: An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package.Type: GrantFiled: September 11, 2009Date of Patent: July 17, 2012Assignee: ST-Ericsson SAInventors: Nedyalko Slavov, Heinz-Peter Wirtz, Thomas Villiger, Kwei-Kuan Kuo
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Publication number: 20120117670Abstract: The present invention refers to monoclonal humanized antibodies, which bind to the extracellular domain of the AXL receptor tyrosine kinase and which at least partially inhibit AXL activity.Type: ApplicationFiled: May 11, 2010Publication date: May 10, 2012Applicant: U3 PHARMA GMBHInventors: Peter Wirtz, Jens Ruhe, Takeshi Takilzawa, Tomoko Takayama
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Patent number: 8125074Abstract: A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.Type: GrantFiled: September 11, 2009Date of Patent: February 28, 2012Assignee: ST-Ericsson SAInventors: Nedyalko Slavov, Heinz-Peter Wirtz, Kwei-Kuan Kuo
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Publication number: 20110061917Abstract: A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.Type: ApplicationFiled: September 11, 2009Publication date: March 17, 2011Applicant: ST-ERICSSON SAInventors: Nedyalko Slavov, Heinz-Peter Wirtz, Kwei-Kuan Kuo
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Publication number: 20110064362Abstract: An integrated circuit device or package comprising: a laminated substrate, at least an electro-optical element at least partially inserted in the laminated substrate, and at least an optical wave-guide element at least partially inserted in the laminated substrate and optically coupled to the electro-optical element. An integrated circuit system comprising an integrated circuit device and a mounting plate carrying an optical wave-guide part or fiber.Type: ApplicationFiled: September 11, 2009Publication date: March 17, 2011Applicant: ST-ERICSSON SAInventors: Nedyalko Slavov, Heinz-Peter Wirtz, Kwei-Kuan Kuo
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Publication number: 20110062576Abstract: An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package.Type: ApplicationFiled: September 11, 2009Publication date: March 17, 2011Applicant: ST-ERICSSON SAInventors: Nedyalko Slavov, Heinz-Peter Wirtz, Thomas Villiger, Kwei-Kuan Kuo
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Publication number: 20100330095Abstract: The present invention refers to antibodies, particularly to monoclonal antibodies, which bind to the extracellular domain of the AXL receptor tyrosine kinase and which at least partially inhibit AXL activity.Type: ApplicationFiled: November 12, 2008Publication date: December 30, 2010Applicant: U3 PHARMA GMBHInventors: Thore Hettmann, Jens Niewoehner, Jens Ruhe, Peter Wirtz, Kerstin Selle, Esther Zwick-Wallasch, Mike Rothe
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Patent number: 7692280Abstract: A portable object connectable package for an electronic device comprises: semiconductor die package, having a top surface and an opposite bottom surface, and a connector body mechanically supported by the semiconductor die package. The bottom surface includes a plurality of connection elements for connecting to a printed circuit board. The connector body includes a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO having a contacting area. The portable object connectable package is arranged to be coupled to a portable object positioner for removably positioning the contacting area of the portable object in contact with the plurality of resilient electrical connecting elements when the portable object is present in the portable object positioner.Type: GrantFiled: March 21, 2006Date of Patent: April 6, 2010Assignee: ST-Ericsson SAInventors: Stefan Marco Koch, Heinz-Peter Wirtz, Alexander M. Jooss
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Patent number: 7500617Abstract: Spindle device for the height adjustment and alignment of tracks on a substructure, having a transverse cantilever which is fixed to an elongate nut adjustable in height on a height adjustment spindle and which engages under the rail and which is formed as a horizontal spindle plate which is mounted on the elongate nut pivotably about a horizontal axis and on which a slide provided with a clamping mount device for the rail foot is displaceable by means of a second spindle device transverse to the height adjustment spindle.Type: GrantFiled: November 15, 2003Date of Patent: March 10, 2009Assignee: RAIL.ONE GmbHInventors: Heinz-Peter Wirtz, Arnold Pieringer
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Publication number: 20080224288Abstract: A portable object connectable package 1, 11, 21, 31, 41, 51, 61, 71, 81 for an electronic device comprises: —a semiconductor die package 2, 12, 22, 32, 42, 52, 62, 72, 82 comprising a top surface 2A, 12A, 22A, 32A, 42A, 52A, 62A, 72A, 82A and an opposite bottom surface 2B, 12B, 22B, 32B, 42B, 52B, 62B, 72B, 82B, the bottom surface comprising a plurality of connection elements 3A, 13A, 23A, 33A, 43A, 53A, 63A, 73A, 83A for connecting to a printed circuit board PCB, and—a connector body 4, 14, 24, 34, 44, 54, 64, 74, 84 mechanically supported by the semiconductor die package and comprising a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO, said circuit comprising a contacting area PO1.Type: ApplicationFiled: March 21, 2006Publication date: September 18, 2008Applicant: NXP B.V.Inventors: Stefan Marco Koch, Heinz-Peter Wirtz, Alexander M. Jooss
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Publication number: 20060011792Abstract: The invention relates to a screw device for high-adjusting and aligning rails on a track infrastructure comprising a transversal cantilever beam which clamps the rail on the underside and is fixed to a long nut (4) which is variably high guided along a high-adjusting screw (3). The inventive screw device is characterised in that the transversal cantilever beam is embodied in the form of a horizontal screw plate (7) which is pivotally arranged around a horizontal axis (20) on the long nut and on which a truck provided with a clamp fixing device (10,11) for a rail base can perpendicularly move with respect to the high-adjusting screw with the aid of a second screw device (14,16,17).Type: ApplicationFiled: November 15, 2003Publication date: January 19, 2006Inventors: Heinz-Peter Wirtz, Arnold Pieringer
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Publication number: 20040173521Abstract: In order to develop a filter material composed of stacked grid members, the invention proposes a filter material consisting of two stacked grid members that have a weld joint between them.Type: ApplicationFiled: December 17, 2003Publication date: September 9, 2004Inventor: Peter Wirtz
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Patent number: 6093478Abstract: A composite member has a diecast part and a hub part that consists of a harder material than the diecast part. The diecast part is attached to the hub part by diecasting within a diecast mold. The hub part has at least one end face. The at least one end face has an annular sealing projection that, during diecasting of the diecast part, rests at a surface of the diecast mold and is deformed by the diecast mold.Type: GrantFiled: April 18, 1997Date of Patent: July 25, 2000Assignees: Firma Ford-Werke AG, Firma Druckgusswerk Mossner GmbHInventors: Arthur Jasinetzky, Hans-Peter Wirtz
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Patent number: 5746296Abstract: In a torque converter with a cone-type lock-up clutch having a clutch disc (14) with a conical friction disc area (24) cooperating directly with the conical inner wall of the torque converter housing (1), the inner wall of the torque converter housing (1) has in its jacket part (2) at least two conical areas (K1 and K2) disposed concentrically of one another, the radially inner conical area (K1) having a relatively small angle and the radially outer conical area (K2) having a relatively large angle, and cooperates, with clutch discs (14 and 14') having different radial extents and having friction disc areas (23 and 23') with different cone angles.Type: GrantFiled: September 17, 1996Date of Patent: May 5, 1998Assignee: Ford Global Technologies, Inc.Inventor: Hans-Peter Wirtz
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Patent number: 5611371Abstract: The invention relates to a shift/regulating valve for controlling hydrodynamic torque converters of automatic transmissions, comprising: a shifting component (11); and a valve body (12), which has: an end (13) facing the shifting component; an end (14) remote from the shifting component; a control pressure chamber (15) for a fluid medium; a guide bore extending from the control pressure chamber (15) to the end (13) remote from the shifting component; a control plunger (24) disposed in the guide bore and having at least one control groove (25a, 25b, 25c, 25d); a control pressure outlet (28) for the fluid medium from the control pressure chamber (15); a first pressure connection (29) to the control pressure chamber (15) for the fluid medium; at least one second pressure connection (30, 33, 36) connecting at least one working chamber (17, 18, 19, 20) with at least one outlet (31, 32, 34, 35); and at least one resilient element (26) at the end of the control plunger (24) remote from the shift; wherein at least onType: GrantFiled: April 8, 1996Date of Patent: March 18, 1997Assignee: Ford Motor CompanyInventor: Hans-Peter Wirtz
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Patent number: 5582278Abstract: A pulse width modulated solenoid valve for control of hydrodynamic torque converters of automatic transmissions, comprising an electromagnetic switching element (11) and a valve body (12 ), wherein the valve body (12 ) has: an end (13 ) facing the switching element; an end (14 ) remote from the switching element; a control pressure chamber (15) for a fluid medium; a control spool (28) with at least one control groove (29a); a control pressure connection (20) to the control pressure chamber (15) for the fluid medium; at least one first pressure connection (22) connecting the control pressure chamber (15) to at least one outlet (21); at least one second pressure connection (24, 26) connecting at least one working chamber (16, 17) with at least one outlet (23, 25); at least one counter-pressure chamber (18) located at the opposite end of the valve body (12) to the control pressure chamber (15); at least one pressure connection (20, 22, 24, 26) being capable of being connected to at least one outlet (21, 23, 25)Type: GrantFiled: May 15, 1995Date of Patent: December 10, 1996Assignee: Ford Motor CompanyInventor: Hans-Peter Wirtz
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Patent number: 5553694Abstract: A control system for engaging and releasing a torque converter bypass clutch and for varying the torque capacity of the clutch by adjusting the torque converter torus chamber pressure in accordance with changing operating variables, the bypass clutch including a clutch release pressure chamber that is maintained at a calibrated pressure threshold valve whereby pressure clutch capacity control is achieved by controlling pressure differential in the converter.Type: GrantFiled: September 11, 1995Date of Patent: September 10, 1996Assignee: Ford Motor CompanyInventors: Winfried F. Schulz, Johann Kirchhoffer, Hans-Peter Wirtz
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Patent number: 5476963Abstract: Supported catalyst, process for its preparation and its use for the preparation of vinyl acetateThe invention relates to improved Pd/K/Au, Pd/K/Ba and Pd/K/Cd supported catalysts, their preparation and their use for the preparation of vinyl acetate from ethylene, acetic acid and oxygen in the gas phase. The stated catalysts are prepared by atomizing a solution of corresponding metal salts by means of ultrasonics and then applying them in such limited amounts and within such a limited time to the carrier particles, and beginning to dry them, so that the catalytically active metal salts cannot penetrate into the carrier particles as far as the core but only into a larger or smaller outer part.Type: GrantFiled: February 27, 1995Date of Patent: December 19, 1995Assignee: Hoechst AGInventors: Peter Wirtz, Friedrich Wunder, Karl-Fred Worner
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Patent number: 5422329Abstract: The invention relates to improved Pd/K/Au, Pd/K/Ba and Pd/K/Cd supported catalysts, their preparation and their use for the preparation of vinyl acetate from ethylene, acetic acid and oxygen in the gas phase. The stated catalysts are prepared by atomizing a solution of corresponding metal salts by means of ultrasonics and then applying them in such limited amounts and within such a limited time to the carrier particles, and beginning to dry them, so that the catalytically active metal salts cannot penetrate into the carrier particles as far as the core but only into a larger or smaller outer part.Type: GrantFiled: April 7, 1993Date of Patent: June 6, 1995Assignee: Hoechst AGInventors: Peter Wirtz, Friedrich Wunder, Karl-Fred Worner