Abstract: An electronic module, comprising: a conductive-pattern layer; an insulating-material layer supporting the conductive-pattern layer; at least one component inside the insulating-material layer, the at least one component comprising a first surface and contact zones on the first surface; a first hardened adhesive layer on the first surface of the at least one component; a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer; holes in the first and second hardened adhesive layer at the locations of the contact zones; and conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer.

Abstract: The document describes a circuit board and an electronic module, comprising a conductor-pattern layer, an insulating-material layer supporting the conductor-pattern layer, and at least one component inside the insulating-material layer. The component has a plurality of contact areas and the circuit board or electronic module comprises contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component such that at least two of the contact elements are in direct contact with a common contact area.

Abstract: A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconductor component having flat contact zones; and solid contact pillars containing copper and solderlessly, metallurgically and electrically connecting the flat contact zones to the single conductive-pattern layer.

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

Abstract: A method for manufacturing a circuit-board layer on a base surface (2), which base surface (2) includes conductor patterns (19). The circuit-board layer being manufactured comprises a conductor-pattern layer (14), an insulating layer (1), and at least one component (6) inside the insulating-material layer (1). According to the invention, the component (6) is attached to the conductor layer (4), the conductor layer (4) is aligned relative to the base surface (2) attached with the aid of an insulating material (1) to the base surface (2). An insulating-material layer (1) is thus formed between the conductor layer (4) and the base surface (2), on which the said at least one component (6) is located. Electrical contacts are formed between the contact areas (7) of the component (6) and the conductor layer (4), in such a way that contact openings (17) are opened at the positions of the contact areas (7) of the component (6) and conductive material is made in the contact openings (17).

Abstract: A circuit board structure and a method for manufacturing a circuit board structure comprising an electrical component. The method comprises the steps of fabricating a conductive pattern on the surface of an essentially plane-like layer on the back side of the plane-like layer, and forming an electrical contact between at least one electrical component and the conductive pattern.

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

Abstract: An electronic module in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

Abstract: A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.

Abstract: A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line.

Abstract: This publication discloses a method for manufacturing a circuit-board structure.1. The structure comprises a conductor pattern (3) and at least one component (6), which is surrounded by an insulating-material layer (10), attached to it by means of a contact bump (5). According to the invention, the contact bumps (5) are made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5). After attaching, the component (6) is surrounded with an insulating-material layer (10).

Abstract: A method for manufacturing a circuit-board layer on a base surface (2), which base surface (2) includes conductor patterns (19). The circuit-board layer being manufactured comprises a conductor-pattern layer (14), an insulating layer (1), and at least one component (6) inside the insulating-material layer (1). According to the invention, the component (6) is attached to the conductor layer (4), the conductor layer (4) is aligned relative to the base surface (2) attached with the aid of an insulating material (1) to the base surface (2). An insulating-material layer (1) is thus formed between the conductor layer (4) and the base surface (2), on which the said at least one component (6) is located. Electrical contacts are formed between the contact areas (7) of the component (6) and the conductor layer (4), in such a way that contact openings (17) are opened at the positions of the contact areas (7) of the component (6) and conductive material is made in the contact openings (17).

Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6), which is connected electrically to a conductor-pattern layer (14). In the method contact openings (17) are made in the conductor layer (4), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6). After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17), and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4). After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14).

Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil (2) and a conductor pattern (6) on the surface of the conductor foil.

Abstract: This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

Abstract: An electronic module in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

Abstract: An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the to which the component (6) is attached.

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. A conductive adhesive, preferably an anisotropically conductive adhesive, is used in the gluing. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.