Abstract: An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is attached to the surface of a conductive layer and electrical and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.