Abstract: Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising a conductive layer and an electrical grounding. The conductive layer may include a signal pad region and a signal trace region. A distance between at least one section of the signal pad region and the electrical grounding may be greater than a distance between at least a section of the signal trace region and the electrical grounding.

Abstract: A camera includes a camera actuator having autofocus (AF) voice coil motor (VCM) with a lens carrier mounting attachment moveably mounted to a base, magnets mounted to the base, and an AF coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of a lens of the lens carrier. The magnets may include a pair of first magnets laterally spaced along a first side of the camera and a pair of second magnets laterally spaced along a second side of the camera opposite the first side. The optical image stabilization (OIS) VCM includes an image sensor carrier moveably mounted to the base, and OIS coils moveably mounted to the image sensor carrier within the magnetic fields of the magnets, for producing forces for moving the image sensor carrier in directions orthogonal to the optical axis.

Abstract: A method includes generating, external to a radio frequency (RF) environment and based on a process recipe, a first signal and a second signal. The method further includes converting the first signal into an alternative signal and transmitting, over a non-conductive communication link, the alternative signal to a converter within the RF environment within a processing chamber of a substrate processing system. The method further includes converting the alternative signal into a third signal by the converter inside the RF environment within the processing chamber. The method further includes controlling a first plurality of elements disposed within the RF environment within the processing chamber via one or more first devices disposed within the RF environment within the processing chamber using the third signal and controlling a second plurality of elements of the substrate processing system via one or more second devices of the substrate processing system using the second signal.

Abstract: Various embodiments include flex circuit arrangements for a camera with sensor shift actuation. Some embodiments include a flexure-circuit hybrid structure. Some embodiments include an actuation-module flex circuit hybrid structure. In some embodiments, the hybrid structures may include different portions that share multiple layers of a plurality of stacked layers. In some embodiments, one portion of a hybrid structure may include one or more layers that are different from the layers in another portion of the hybrid structure.

Abstract: Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.

Abstract: Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.

Abstract: Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising an electrical grounding portion that has an additional conductive layer adjacent to a base layer, which may reduce the overall resistivity of a ground current return path. In some embodiments, the flexure may additionally or alternatively include an impedance adjusting feature configured to adjust the impedance of an electrical signal pad used to connect the flexure with another component of the camera.

Abstract: A camera may include at least one suspension assembly as part of optical image stabilization and/or autofocus systems of the camera. The suspension assembly may include an inner frame, an outer frame, and one or more flexure arms. Electrical traces may be deposited at both sides of the suspension assembly. A connection may be created, for electrical traces at the different sides of the suspension assembly, through the suspension assembly by removing (e.g., using an etching process) one or more parts in the body of the suspension assembly to create one or more cavities. A remaining part of the suspension assembly surrounded (and thus isolated) by the cavities may thus form at least a part of the connection for the electrical traces. The connection may further include one or more filled trenches connecting the electrical traces to the remaining part of the suspension assembly.

Abstract: A suspension assembly of a camera, with electrical traces, may be formed using one or more electroforming processes. The suspension assembly may include one or more flexure arms connecting an inner frame to an outer frame of the camera. The inner frame may be moveable relative to the outer frame to implement autofocus and/or optical image stabilization functions for the camera. The electrical traces may be formed at a first side of a substrate, using one or more electroforming processes. Next, one or more cavities in various shapes may be created in one or more dry film photoresist (DFR) layers at a second side of the substrate by exposing the DFR layers to ultraviolet light. One or more electroforming processes may be used to deposit one or more materials in to the cavities to form one or more components, e.g., a flexure arm, of the suspension assembly.

Abstract: A camera includes a camera actuator having autofocus (AF) voice coil motor (VCM) with a lens carrier mounting attachment moveably mounted to a base, magnets mounted to the base, and an AF coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of a lens of the lens carrier. The magnets may include a pair of first magnets laterally spaced along a first side of the camera and a pair of second magnets laterally spaced along a second side of the camera opposite the first side. The optical image stabilization (OIS) VCM includes an image sensor carrier moveably mounted to the base, and OIS coils moveably mounted to the image sensor carrier within the magnetic fields of the magnets, for producing forces for moving the image sensor carrier in directions orthogonal to the optical axis.

Abstract: A suspension assembly of a camera, with electrical traces, may be formed using one or more electroforming processes. The suspension assembly may include one or more flexure arms connecting an inner frame to an outer frame of the camera. The inner frame may be moveable relative to the outer frame to implement autofocus and/or optical image stabilization functions for the camera. The electrical traces may be formed at a first side of a substrate, using one or more electroforming processes. Next, one or more cavities in various shapes may be created in one or more dry film photoresist (DFR) layers at a second side of the substrate by exposing the DFR layers to ultraviolet light. One or more electroforming processes may be used to deposit one or more materials in to the cavities to form one or more components, e.g., a flexure arm, of the suspension assembly.

Abstract: A camera may include at least one suspension assembly as part of optical image stabilization and/or autofocus systems of the camera. The suspension assembly may include an inner frame, an outer frame, and one or more flexure arms. Electrical traces may be deposited at both sides of the suspension assembly. A connection may be created, for electrical traces at the different sides of the suspension assembly, through the suspension assembly by removing (e.g., using an etching process) one or more parts in the body of the suspension assembly to create one or more cavities. A remaining part of the suspension assembly surrounded (and thus isolated) by the cavities may thus form at least a part of the connection for the electrical traces. The connection may further include one or more filled trenches connecting the electrical traces to the remaining part of the suspension assembly.

Abstract: Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.

Abstract: A method includes generating, external to a radio frequency (RF) environment and based on a process recipe, a first signal and a second signal. The method further includes converting the first signal into an alternative signal and transmitting, over a non-conductive communication link, the alternative signal to a converter within the RF environment within a processing chamber of a substrate processing system. The method further includes converting the alternative signal into a third signal by the converter inside the RF environment within the processing chamber. The method further includes controlling a first plurality of elements disposed within the RF environment within the processing chamber via one or more first devices disposed within the RF environment within the processing chamber using the third signal and controlling a second plurality of elements of the substrate processing system via one or more second devices of the substrate processing system using the second signal.

Abstract: A heating system includes a first plurality of heating elements disposed within an electrostatic chuck and an electrically conductive housing. The heating system further includes one or more switching devices to control temperatures output by the first plurality of heating elements. The heating system further includes a converter that is electrically coupled to the one or more switching devices and disposed within the electrically conductive housing. The electrically conductive housing and the first plurality of heating elements are to operate in a radio frequency (RF) environment. A second plurality of elements are to operate outside of the RF environment. The converter is to communicate with a controller outside of the RF environment via a non-conductive communication link. The controller is to receive a process recipe and is to control the first plurality of heating elements and the second plurality of elements substantially simultaneously based on the process recipe.

Abstract: A method includes generating, based on a process recipe, a first electrical control signal by a processing device external to a particular radio frequency (RF) environment. The method further includes converting the first electrical control signal into an alternative control signal, transmitting the alternative control signal to a converter within the particular RF environment over a non-conductive communication link, and converting the alternative control signal into a second electrical control signal by the converter. The method further includes controlling a first plurality of elements via one or more switching devices using the second electrical control signal. The method further includes generating, based on the process recipe, a third signal by the processing device and controlling a second plurality of elements disposed outside of the RF environment using the third signal.

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.

Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.