Abstract: An electrosurgical device comprising an elongate probe member having proximal and distal extremities and a passage extending from the proximal extremity to an opening at the distal extremity. The elongate probe member is provided with an elongate cutout adjacent the opening so that the elongate probe member is formed with an elongate extension projecting alongside the cutout beyond the opening. A guide canula is mounted in the passage of the elongate probe member and has proximal and distal extremities and a lumen extending therethrough. A radio frequency electrode is disposed in the lumen and an insulating sleeve is coaxially disposed on the radio frequency electrode. A handle is secured to the proximal extremity of the guide canula for advancing and retracting the radio frequency electrode and the insulating sleeve with respect to the guide canula and for causing bending of the distal extremity of the guide cannula into the cutout.

Abstract: An optical component installation apparatus adapted to assemble a plurality of components onto a plurality of fiber optic cables being processed within a multistage integrated optical component processing system. The component installation apparatus includes at least one component dispensing tool, and a component transfer tool rotatably coupled to at least one robot. The component transfer tool and at least one robot are configured to cooperatively receive at least one of the plurality of components from the at least one component dispensing tool, rotate the at least one of the plurality of components to a transfer position, and transfer the at least one of the plurality of components onto at least one of the plurality of fiber optic cables.

Abstract: Embodiments of the invention generally provide a fiber trim apparatus and method. The apparatus and method are generally configured to trim an exposed fiber optic cable segment protruding from at least one optical interface being processed within a multi-stage integrated optical component processing system. The fiber trim apparatus generally includes a laser cutting tool adapted to direct at least one laser beam to the optical interface to trim at least some of an excess of fiber optic cladding and core extending from the at least one optical interface, and a trim positioning apparatus adapted to position the excess fiber optic cladding and core extending from the at least one optical interface between a pre-processing and processing position with respect to the laser cutting tool.

Abstract: An optical component attachment apparatus adapted to attach a plurality of optical components to a plurality of mating optical fibers being processed within a multi-stage integrated optical component processing system. The component attachment apparatus generally includes an insertion robot adapted to position the plurality of the optical components and the plurality of mating optical fibers within a component insertion tool, wherein the component insertion tool is configured to insert a plurality of mating optical components to a plurality of mating fiber optic cables held in a processing position relative the longitudinal axis of the mating optical components.

Abstract: The invention provides a method and apparatus to process and assemble optical subsystems. In one aspect, the optical subsystems are placed on a carrier apparatus adapted to support a plurality of the optical subsystems in a desired process orientation and with a desired spacing to provide high process throughput. In one aspect of the invention, optical components are assembled and sequentially processed in various steps, such as component installation, optical fiber preparation, component attachment, fiber trim, optical fiber polishing, and optical component testing to produce a finished optical subsystem.

Abstract: Embodiments of the invention provide an apparatus for transporting one or more optical components between a plurality of optical component processing stages of an assembly system. The carrier transport apparatus is generally adapted to move at least one optical component carrier between at least two optical component processing stages and position the at least one optical component carrier between a plurality of a processing positions with respect to each of the at least two optical component processing stages.

Abstract: An optical component installation apparatus adapted to assemble a plurality of components onto a plurality of fiber optic cables being processed within a multistage integrated optical component processing system. The component installation apparatus includes a fiber preparation apparatus adapted to remove an outer protective coating from a fiber optic cable to expose a fiber optic cladding and core for processing in a multi-stage integrated optical component processing system.

Abstract: Embodiments of the invention provide an optical component carrier apparatus adapted to hold a plurality of fiber optic cables and optical components. The carrier apparatus generally includes a body having a top, bottom, and sidewall members that cooperatively define an optical component storage region. A plurality of component storage apparatuses disposed within the component storage region are provided, and at least one clamp apparatus coupled to at least one of the sidewall members and adapted to grip at least one of the optical components and the plurality of fiber optic cables is provided.

Abstract: Embodiments of the invention provide methods and apparatuses to process optical subsystems. In one aspect, the optical subsystems are polished using an orbital polishing apparatus adapted to polish and clean an optical subsystem interconnect surface. The orbital polishing apparatus is adapted to incrementally advance a movable web of polishing material to provide polishing uniformity and consistent polishing performance device to device.

Abstract: A chemical mechanical planarization system for planarizing wafers is provided. The system generally includes a transfer corridor, at least one corridor robot, one or more polishing modules and at least one loading device. The corridor robot is disposed in the transfer corridor and is positionable between a first end and a second end of the transfer corridor. The loading device is adapted to transfer workpieces between the transfer corridor and the polishing modules. Generally, the loading device includes at least one load cup. The one or more polishing modules each include one or more polishing heads for holding workpieces during processing.

Abstract: Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen is adapted to support the web of polishing media that is disposed between the first and the second lift members. A method includes supporting a web of polishing media on a platen between a first lift member and a second lift member and moving at least the first lift member or the second lift member to an extended position relative the platen that places the web in a spaced-apart relation with the platen.

Abstract: A linear drive mechanism for chemical mechanical polishing includes a substrate carrier and support system which employs at least one linear motor to drive the substrate carrier through polishing motions. An additional driver for driving at least a portion of the carrier in directions perpendicular to the motions supplied by the linear motor(s) is also included. A clamping flexure is provided to selectively lock the substrate carrier in a vertical position. The substrate carrier, in one embodiment is mounted to a vertical driver via a column. The column is guided by spiral flexures to prevent motion in directions normal to vertical. An air mount is provided to support the majority of the mass of the substrate carrier, so that only a small force need be applied by the additional driver for movements in the vertical direction. Another, linear drive mechanism is described as using a “Sawyer motor” for both polishing motions as well as vertical force application.

Abstract: Embodiments of the invention provide methods and apparatuses to process optical subsystems. In one aspect, the optical subsystems are polished using an orbital polishing apparatus adapted to polish and clean an optical subsystem interconnect surface. The orbital polishing apparatus is adapted to incrementally advance a movable web of polishing material to provide polishing uniformity and consistent polishing performance device to device.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: Generally, a processing system for polishing a workpiece, such as a semiconductor substrate or wafer, is provided. The system generally includes a first set of load cups that are nested with a second set of load cups. The second set of load cups are disposed adjacent one or more polishing pads. A first and a second polishing head are coupled to a carrier. The carrier is coupled to a drive system that is adapted to move the first and second polishing heads between positions above the first set of load cups, the second set of load cups and a polishing media.

Abstract: A semiconductor wafer processing system, more specifically, a chemical mechanical planarization system including a polishing media reconditioning system. In one embodiment, the polishing media reconditioning system comprises at least a first and second conditioning roller that contact a working surface of a polishing media while rotating in opposite directions. Other embodiments include conditioning plates disposed on a carrier that includes the polishing head, a conditioning roller or disk that traverses the surface of the polishing media and a conditioning disk that conditions the polishing media while retained in the polishing head. Alternatively, the polishing media may be conditioned utilizing the devices embodied above remotely from the processing system.

Abstract: A chemical mechanical planarization system and method for planarizing wafers is provided. The system generally includes a transfer corridor, at least one corridor robot, one or more polishing modules and at least one loading device. The corridor robot is disposed in the transfer corridor and is positionable between a first end and a second end of the transfer corridor. The loading device is adapted to transfer workpieces between the transfer corridor and the polishing modules. Generally, the loading device includes at least one load cup. The one or more polishing modules each include one or more polishing heads for holding workpieces during processing.

Abstract: Apparatus and method of polishing substrates using a carrier that does not contact the backside of the substrate during polishing. The apparatus preferably forms an air bearing between the substrate and the carrier plate during polishing. Alternatively, liquids, or combinations of liquids and gases may be used to form the bearing layer. When a water layer is formed, at least a portion of the carrier plate is formed as a microporous force applicator. The apparatuses are also capable of adjusting the force profile that is applied to the substrate so as to differentially polish different areas of the substrate. A containment ring is provided for horizontal containment of the substrate during polishing and to define an area within which the substrate precesses during polishing. A containment ring or barrier is also provided for precessing with a substrate during polishing.

Abstract: A medical device for the treatment by radio frequency ablation of a target volume in tissue of a prostate comprising an elongate probe member having proximal and distal extremities and having a passage therein extending from the proximal extremity to the distal extremity. The elongate probe member is sized so that it can be introduced into the urethra. At least one guide tube having proximal and distal extremities is mounted in the passage of the elongate probe member for nonlongitudinal movement therein. The at least one guide tube has a lumen extending therethrough from the proximal extremity to the distal extremity. A radio frequency conductive electrode is disposed in the lumen. A handle is coupled to the proximal extremity of the elongate probe member and includes a finger actuatable mechanism secured to the radio frequency electrode for advancing and retracting the radio frequency electrode with respect to the at least one guide tube.