Abstract: An electric packaging including a board and a mechanical component attached to the board. The mechanical component includes a first end attached to the board, a second end opposite the first end, and a seat interposed between the first end and the second end. The mechanical component also includes an upper portion extending from the second end to the seat, the upper portion having a first width and a lower portion extending from the seat to the first end. The lower portion having a second width that is less than the first width. The electric packaging also includes a connector attached to the board. The connector includes a first surface attached to the board and a second surface located opposite the first surface. The second surface includes a plug connection area sized to receive a plug and located completely radially outside of the first width.

Abstract: An electric packaging including a board and a mechanical component attached to the board. The mechanical component includes a first end attached to the board, a second end opposite the first end, and a seat interposed between the first end and the second end. The mechanical component also includes an upper portion extending from the second end to the seat, the upper portion having a first width and a lower portion extending from the seat to the first end. The lower portion having a second width that is less than the first width. The electric packaging also includes a connector attached to the board. The connector includes a first surface attached to the board and a second surface located opposite the first surface. The second surface includes a plug connection area sized to receive a plug and located completely radially outside of the first width.

Abstract: A peripheral component interconnect includes a cable with a header. The header includes a cable connector and a heat sink. The heat sink has a cross-section that is reduced at an end that is opposite of the cable connector. In addition or in the alternative, a peripheral component interconnect card includes a circuit board and a bracket, an electrical component, a board connector, and a rail mounted to the circuit board. The bracket includes a port for a cable to pass through, and the rail is configured to engage the cable and define a pathway that rotates between the bracket and the board connector. In addition or in the alternative an electrical connection system includes a chassis with a guide, a card, and a cable. The cable includes a guiding feature that engages the guide which directs the cable connector from being misaligned to being aligned with the board connector.

Abstract: A peripheral component interconnect includes a cable with a header. The header includes a cable connector and a heat sink. The heat sink has a cross-section that is reduced at an end that is opposite of the cable connector. In addition or in the alternative, a peripheral component interconnect card includes a circuit board and a bracket, an electrical component, a board connector, and a rail mounted to the circuit board. The bracket includes a port for a cable to pass through, and the rail is configured to engage the cable and define a pathway that rotates between the bracket and the board connector. In addition or in the alternative an electrical connection system includes a chassis with a guide, a card, and a cable. The cable includes a guiding feature that engages the guide which directs the cable connector from being misaligned to being aligned with the board connector.

Abstract: A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.

Abstract: An apparatus for cooling warm air, including a rack containing one or more ventilation slots; a reservoir connected to the rack that contains a cooling solution; and a plurality of components, located within the rack, that receive and distribute the cooling solution from the reservoir. The plurality of components consist of at least one of the following structures: one or more hollow vertical louvers, one or more hollow horizontal louvers, one or more hollow diagonal louvers, and one or more hollow cylindrical louvers. Additionally, the plurality of components may comprise a flexible material that descends from a top portion of the rack, directly below the reservoir, at the same time that an activation component causes the cooling solution to flow from the reservoir into the flexible material.

Abstract: A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.

Abstract: An electronic interconnect includes a board, a rotatable connector, and a heat sink. The board extends along a plane, and the rotatable connector is connected to the board. The rotatable connector is configured to allow rotation about an axis parallel to the plane, between a first position and a second position. The heat sink is connected to the rotatable connector and extends a first distance from the board in the first position and a second, greater distance from the board in the second position.

Abstract: In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer comprising a gap filler material and a second thermal interface material layer comprising a solid thermal pad. The TIM structure has one or more overlapping regions associated with partial overlap of a surface of the gap filler material by the solid thermal pad such that a portion of the surface is exposed.

Abstract: In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer comprising a gap filler material and a second thermal interface material layer comprising a solid thermal pad. The TIM structure has one or more overlapping regions associated with partial overlap of a surface of the gap filler material by the solid thermal pad such that a portion of the surface is exposed.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.

Abstract: An airflow sensor for a heat sink has a substantially flat base portion and a deformable upper portion electrically coupled to the base portion that contacts a conductive strip. As airflow increases, the deformable upper portion deforms and moves away from the source of airflow, which moves the point of contact between the deformable upper portion and the conductive strip farther away from the source of the airflow. The difference in the point of contact is measured, and is used to characterize the airflow sensor for different airflows. Data from the airflow sensor can then be logged during system operation. When needed, the data from the airflow sensor can be read from the log and converted to airflow using the airflow sensor characterization data. In this manner the airflow through a heat sink may be dynamically measured, allowing analysis and correlation between system events and airflow through the heat sink.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: An electromagnetic radiation (EMR) receiver is located upon a printed circuit board (PCB) glass security layer. EMR flux is transmitted by the glass security layer and received by the EMR receiver. When the PCB is subject to a tamper event the EMR transmitted by glass security layer is increased. A monitoring device that monitors the flux or interference pattern of the EMR received by the EMR receiver detects a change in flux or interference pattern and passes a tamper signal to one or more computer system devices to respond to the tamper event. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.