Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A computer system may determine a target position of the electronic component. The computer system may also determine a current position of the electronic component. The computer system may compare the current position to the target to position to determine whether the electronic component is in the target position. If the electronic component is not in the target position, the computer system may use an electroactive polymer to adjust the position of the electronic component to move the electronic component into the target position.

Abstract: An airflow sensor for a heat sink has a first portion having a first electrical point of contact, a second portion have a second electrical point of contact, and a deformable portion made of an electroactive material electrically coupled to the first and second portions. The deformable portion has first electrical properties measured between the first and second electrical points of contact when there is no airflow and the deformable portion is in a first position, and has second electrical properties different than the first electrical properties when a source of airflow blows air against the deformable portion, thereby causing the deformable portion to extend to a second position farther away from the source of airflow than the first position. The airflow sensor can be incorporated into a heat sink for an electronic component.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.

Abstract: Vibration shock mitigation for components in a server rack includes a server rack comprising: a first server component chassis and a second server component chassis installed in adjacent locations within the server rack; and a chassis gap filler comprising: an elastic dampening sheet configured for placement between the first server component chassis and the second server component chassis, wherein the elastic dampening sheet is further configured to cover a portion of one side of the first server component chassis; and at least two attachment points configured to secure the elastic dampening sheet to the server rack.

Abstract: In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer comprising a gap filler material and a second thermal interface material layer comprising a solid thermal pad. The TIM structure has one or more overlapping regions associated with partial overlap of a surface of the gap filler material by the solid thermal pad such that a portion of the surface is exposed.

Abstract: A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.

Abstract: Cooling systems employing adjacent fan cages having cage walls with interflow passages are disclosed. A cooling system includes cooling fans disposed in adjacent fan cages. Cage walls of the fan cages direct flows from the fans to the outlet ports of the fan cages which are in fluid communication with electrical components within an electronics-containing enclosure. By forming an interflow passage between the adjacent fan cages, upon occurrence of an inoperable fan, a portion of the flow from an adjacent operable fan can pass to the outlet port of the fan cage of the inoperable fan via the passage and provide better cooling of the components impacted by the inoperable fan. In this manner, thermal damage is avoided while minimizing fan noise associated with higher fan speeds.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer and a second thermal interface material layer. The second thermal interface material layer at least partially overlaps the first thermal interface material layer.

Abstract: An apparatus can dynamically adjust, in a card edge connector including first and second positions, an opening configured to receive a printed-circuit card. The apparatus may also include a set of contacts configured to connect with a set of edges of the printed-circuit card in the second position. The apparatus may also include a set of electroactive polymers configured to adjust the set of contacts between the first position and the second position by changing thickness in response to voltages applied to electrodes positioned adjacent to opposing faces of the set of electroactive polymers. The set of electroactive polymers can also include an electroactive polymer configured to control a single contact of the set of contacts.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

Abstract: A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.

Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

Abstract: An airflow sensor for a heat sink has a substantially flat base portion and a deformable upper portion electrically coupled to the base portion that contacts a conductive strip. As airflow increases, the deformable upper portion deforms and moves away from the source of airflow, which moves the point of contact between the deformable upper portion and the conductive strip farther away from the source of the airflow. The difference in the point of contact is measured, and is used to characterize the airflow sensor for different airflows. Data from the airflow sensor can then be logged during system operation. When needed, the data from the airflow sensor can be read from the log and converted to airflow using the airflow sensor characterization data. In this manner the airflow through a heat sink may be dynamically measured, allowing analysis and correlation between system events and airflow through the heat sink.

Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.