Abstract: There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semiconductor package also includes a second active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The second portion of the first active die and the second portion of the second active die include solder balls mounted on a package substrate, and are configured to communicate electrical signals to the package substrate utilizing the solder balls and without utilizing through-semiconductor vias (TSVs).

Abstract: An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.

Abstract: There are disclosed herein various implementations of semiconductor packages including an interposer without through-semiconductor vias (TSVs). One exemplary implementation includes a first active die situated over an interposer. The interposer includes an interposer dielectric having intra-interposer routing traces. The first active die communicates electrical signals to a package substrate situated below the interposer utilizing the intra-interposer routing traces and without utilizing TSVs. In one implementation, the semiconductor package includes a second active die situated over the interposer, the second active die communicating electrical signals to the package substrate utilizing the intra-interposer routing traces and without utilizing TSVs. Moreover, in one implementation, the first active die and the second active die communicate chip-to-chip signals through the interposer.

Abstract: A touch sensitive pad with a plurality of touch sensitive elements and processing circuitry coupled to a communications interface and to the touch sensitive pad for scanning the plurality of touch sensitive elements to measure a plurality of touch sensitive element values. The plurality of touch sensitive element values is compared to a hovering finger threshold pattern. Upon a favorable comparison, a hovering finger condition is determined, and a position of the hovering finger in three-dimensions is detected with respect to the touch sensitive pad. The plurality of touch sensitive element values is compared to a touching finger threshold pattern. Upon a favorable comparison, a touching finger condition is determined, and a position of the touching finger is detected upon the touch sensitive pad.

Abstract: An integrated communications system. Comprising a substrate having a receiver disposed on the substrate for converting a received signal to an IF signal. Coupled to a VGA for low voltage applications and coupled to the receiver for processing the IF signal. The VGA includes a bank pair having a first bank of differential pairs of transistors and a second bank of differential pairs of transistors. The bank pair is cross-coupled in parallel, the IF signal is applied to the bank pair decoupled from a control signal used to control transconductance output gain of the bank pair over a range of input voltages. A digital IF demodulator is disposed on the substrate and coupled to the VGA for low voltage applications, for converting the IF signal to a demodulated baseband signal. And a transmitter is disposed on the substrate operating in cooperation with the receiver to establish a two way communications path.

Abstract: Power regulator circuitry that can provide a regulated power signal. The power regulator circuitry may include data processing circuitry configured to determine the regulated power signal to arbitrate power supply requirements of first and second powered devices according to power supply information associated with the first and second powered devices. The power regulator circuitry may also include output circuitry configured to output the regulated power signal to one or both of the first and second powered devices.

Abstract: There are disclosed herein various implementations of a shield interposer situated between a top active die and a bottom active die for shielding the active dies from electromagnetic noise. One implementation includes an interposer dielectric layer, a through-silicon via (TSV) within the interposer dielectric layer, and an electromagnetic shield. The TSV connects the electromagnetic shield to a first fixed potential. The electromagnetic shield may include a grid of conductive layers laterally extending across the shield interposer. The shield interposer may also include another electromagnetic shield connected to another fixed potential.

Abstract: One implementation of present disclosure includes a semiconductor package stack. The semiconductor package stack includes an upper package coupled to a lower package by a plurality of solder balls. The semiconductor package stack also includes a lower active die situated in a lower package substrate in the lower package. The lower active die is thermally coupled to a heat spreader in the upper package by a thermal interface material. An upper active die is situated in an upper package substrate in the upper package, the upper package substrate being situated over the heat spreader. The thermal interface material can include an array of aligned carbon nanotubes within a filler material. The heat spreader can include at least one layer of metal or metal alloy. Furthermore, the heat spreader can be connected to ground or a DC voltage source. The plurality of solder balls can be situated under the heat spreader.

Abstract: A system and method for providing power control in a power management integrated circuit. A power management integrated circuit may comprise a communication interface module that receives power supply information from at least one electrical device external to the power management integrated circuit. The power supply information may, for example, comprise information related to a first electrical power. The power management integrated circuit may also comprise a power regulator module that determines a regulated power signal based, at least in part, on a portion of the power supply information. The regulated power signal may correspond to the first electrical power. For example, the regulated power signal may comprise the first electrical power or cause another circuit to output the first electrical power. The power management integrated circuit may then output the regulated power signal to at least one electrical device external to the power management integrated circuit.

Abstract: A game controller with a communications interface includes a touch sensitive pad having a plurality of touch sensitive elements, and processing circuitry coupled to the communications interface and the at least one touch sensitive pad. The processing circuitry enacts touch pad configuration settings that correlate subsets of the plurality of touch sensitive elements to produce distinct user input locations. The processing circuitry receives touch pad input from the at least one touch sensitive pad. The processing circuitry processes the touch pad input to determine user input directions based upon the touch pad configuration settings, and then transmits the touch pad input directions via the communications interface for use as gaming input.

Abstract: Techniques are described herein that are capable of increasing efficiency of wireless power transfer. A wireless power transfer system includes features that allow the system to be deployed in public spaces such as airports or in commercial establishments such as restaurants or hotels to allow a user to recharge one or more portable electronic devices while away from home. To accommodate wireless recharging of a variety of device types and states, the system may receive parameters and/or state information associated with a portable electronic device to be recharged and may control the wireless power transfer in accordance with such parameters and/or state information. For instance, the system may increase efficiency of the wireless power transfer based on such parameters and/or state information. The system may also provide a secure and efficient means for obtaining required payment information from the user prior to the wireless power transfer, thereby facilitating fee-based recharging.

Abstract: Techniques are described herein that are capable of increasing efficiency of wireless power transfer. A wireless power transfer system includes features that allow the system to be deployed in public spaces such as airports or in commercial establishments such as restaurants or hotels to allow a user to recharge one or more portable electronic devices while away from home. To accommodate wireless recharging of a variety of device types and states, the system may receive parameters and/or state information associated with a portable electronic device to be recharged and may control the wireless power transfer in accordance with such parameters and/or state information. For instance, the system may increase efficiency of the wireless power transfer based on such parameters and/or state information. The system may also provide a secure and efficient means for obtaining required payment information from the user prior to the wireless power transfer, thereby facilitating fee-based recharging.

Abstract: There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active die for transmitting a magnetic signal corresponding to a die electrical signal produced by the active die, and an interposer magnetic tunnel junction (MTJ) pad in the interposer for receiving the magnetic signal. A sensing circuit is coupled to the interposer MTJ pad for producing a receive electrical signal corresponding to the magnetic signal. In one implementation, the sensing circuit is configured to sense a resistance of the interposer MTJ pad and to produce the receive electrical signal according to the sensed resistance.

Abstract: There are disclosed herein various implementations of semiconductor packages having a selectively conductive film interposer. In one such implementation, a semiconductor package includes a first active die having a first plurality of electrical connectors on a top surface of the first active die, a selectively conductive film interposer situated over the first active die, and a second active die having a second plurality of electrical connectors on a bottom surface of the second active die. The selectively conductive film interposer may be configured to serve as an interposer and to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors.

Abstract: An exemplary implementation of the present disclosure includes a stacked package having a top die from a top reconstituted wafer situated over a bottom die from a bottom reconstituted wafer. The top die and the bottom die are insulated from one another by an insulation arrangement. The top die and the bottom die are also interconnected through the insulation arrangement. The insulation arrangement can include a top molding compound that flanks the top die and a bottom molding compound that flanks the bottom die. The top die and the bottom die can be interconnected through at least the top molding compound. Furthermore, the top die and the bottom die can be interconnected through a conductive via that extends within the insulation arrangement.

Abstract: An integrated communications system. A substrate having a receiver disposed on the substrate for converting a received signal to an IF signal, a digital IF demodulator disposed on the substrate and coupled to the receiver for converting the IF signal to a demodulated baseband signal, and a transmitter disposed on the substrate operating in cooperation with the receiver to establish a two way communications path.

Abstract: A system and method for controlling performance and/or power based on monitored performance characteristics. Various aspects of the present invention may comprise an integrated circuit comprising a first circuit module that receives electrical power. A second circuit module may monitor one or more performance characteristics of the first circuit module and/or the integrated circuit. A third circuit module may, for example, determine power control information based at least in part on the monitored performance characteristic(s). The power control information may be communicated to power supply circuitry to control various characteristics of the electrical power. Various aspects of the present invention may also comprise an integrated circuit comprising a first module that monitors at least one performance characteristic of a first electrical device.

Abstract: Provided are a method and system for a module for a cable modem termination system. The module includes a digital modulator configured to block up-convert a plurality of digital channels and a digital to analog converter coupled, at least indirectly, to an output of the digital modulator to convert the digital channels to an analog format.

Abstract: A system and method for controlling performance and/or power based on monitored performance characteristics. Various aspects of the present invention may comprise an integrated circuit comprising a first circuit module that receives electrical power. A second circuit module may monitor one or more performance characteristics of the first circuit module and/or the integrated circuit. A third circuit module may, for example, determine power control information based at least in part on the monitored performance characteristic(s). The power control information may be communicated to power supply circuitry to control various characteristics of the electrical power. Various aspects of the present invention may also comprise an integrated circuit comprising a first module that monitors at least one performance characteristic of a first electrical device.

Abstract: An integrated communications system. Comprising a substrate having a receiver disposed on the substrate for converting a received signal to an IF signal. Coupled to a VGA for low voltage applications and coupled to the receiver for processing the IF signal. The VGA includes a bank pair having a first bank of differential pairs of transistors and a second bank of differential pairs of transistors. The bank pair is cross-coupled in parallel, the IF signal is applied to the bank pair decoupled from a control signal used to control transconductance output gain of the bank pair over a range of input voltages. A digital IF demodulator is disposed on the substrate and coupled to the VGA for low voltage applications, for converting the IF signal to a demodulated baseband signal. And a transmitter is disposed on the substrate operating in cooperation with the receiver to establish a two way communications path.