Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.

Abstract: A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.

Abstract: An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/?m.

Abstract: The present invention discloses a micro-LED with vertical structure, display device, electronics apparatus and manufacturing method. The micro-LED with vertical structure comprises: a bottom electrode bonded on a display substrate; a first type doped region provided above the bottom electrode; a second type doped region provided above the first type doped region; and a side-contact electrode covering at least one part of a peripheral of the second type doped region.

Abstract: A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.

Abstract: A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.

Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.

Abstract: A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil, wherein a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.

Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device includes a light source scanner and a MEMS scanning mirror, the light source scanner including micro laser diodes; and the micro laser diodes are used to provide laser beams needed for image projection, and the laser beams are projected to the MEMS scanning mirror, and then reflected by the MEMS scanning mirror to a predetermined area to form a projection image. By providing the micro laser diodes in the laser projection device and initiatively emitting laser by exciting the micro laser diodes, the present disclosure does not need an external laser source and facilitates the reduction of the size of the laser projection device, as compared with the prior art.

Abstract: It is disclosed a micro-LED transfer method, manufacturing method and display device. The method for transferring a micro-LED array comprises: patterning conductive resist on a receiving substrate to cover electrodes for the micro-LED array to be transferred; bonding the micro-LED array on a first substrate with the receiving substrate through the conductive resist, wherein the first substrate is laser transparent; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate. According to an embodiment, the performance of a micro-LED device may be improved.

Abstract: A micro laser diode transfer method and a manufacturing method comprise: forming a bonding layer (515) on a receiving substrate (513), wherein first type electrodes (514) are connected to the bonding layer (515); bringing a first side of the micro laser diodes (500r) on a carrier substrate (520) into contact with the bonding layer (515), wherein the carrier substrate (520) is laser-transparent; and irradiating selected micro laser diodes (500r) with laser from the side of the carrier substrate (520) to lift-off the selected micro laser diodes (500r) from the carrier substrate (520). This method may improve yield.

Abstract: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.

Abstract: A micro-LED transfer method and manufacturing method. The micro-LED (303) transfer method comprises: bringing pickup units (305) of a transfer head in contact with micro-LEDs (303) on a carrier substrate (301), wherein the pickup units (305) are able to apply current to the micro-LEDs (303); applying current to the micro-LEDs (303) via the pickup units (305) to heat up bonding layers (302) between the micro-LEDs (303) and the carrier substrate (301) to be melted; picking up the micro-LEDs (303) from the carrier substrate (301) with the transfer head; bonding the micro-LEDs (303) onto a receiving substrate (307); and removing the transfer head from the micro-LEDs.

Abstract: A display device and an electronics apparatus, the display device comprises: a display substrate; and at least two stacked layers on the display substrate, wherein each stacked layer includes one micro-LED array.

Abstract: A micro-LED transfer method, manufacturing method and device are provided. The micro-LED transfer method comprises: obtaining a laser-transparent carrier substrate having a first surface and a second surface with micro-LEDs; forming a protection layer on at least one of the first surface and the second surface and a third surface of a receiving substrate, wherein the third surface is to receive the micro-LEDs to be transferred via pads; bringing the micro-LEDs to be transferred into contact with the pads on the third surface; and irradiating the micro-LEDs to be transferred with laser from the first surface to lift-off the micro-LEDs to be transferred from the carrier substrate wherein the protection layer configured to protect the third surface from the irradiation of the laser.

Abstract: The present disclosure discloses a micro-LED transfer method, a manufacturing method, device and an electronic apparatus. The transfer method comprises: in accordance with a sequence of micro-LEDs of blue, green and red, epitaxially growing micro-LEDs of two or all of the three colors on a single GaAs original substrate; epitaxially growing bumping electrodes corresponding to the micro-LEDs on a receiving substrate; bonding the micro-LEDs of the two or all of the three colors with the bumping electrodes on the receiving substrate; and removing the GaAs original substrate. The method can be used to transfer micro-LEDs of a variety of colors, in order to improve the production efficiency.

Abstract: A display device and an electronics apparatus are provided. The display device comprises: a display substrate; and arrays of light-emitting elements on the display substrate, wherein the light-emitting elements include at least two types of electroluminescent quantum-dot LED, photoluminescent quantum-dot LED and micro-LED, wherein at least one type of the light-emitting elements is an electroluminescent quantum-dot LED, or at least two types of the light-emitting elements are micro-LED.

Abstract: Disclosed a micro-LED transfer method and manufacturing method. The micro-LED transfer method comprises: bringing pickup units (305, 605, 705) of a transfer head in contact with micro-LEDs (303, 603, 703) on a carrier substrate (301, 601, 701), wherein the pickup units (305, 605, 705) are able to apply current to the micro-LEDs (303, 603, 703); applying current to the micro-LEDs (303, 603, 703) via the pickup units (305, 605, 705) to obtain I-V characteristics of the micro-LEDs (303, 603, 703); determining known-good-die micro-LEDs based on the I-V characteristics; and transferring the known-good-die micro-LEDs from the carrier substrate to a receiving substrate (307, 608, 708) by using the transfer head.

Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device comprises an optical fiber scanner and a MEMS scanning mirror; an optical fiber is disposed on the optical fiber scanner and the optical fiber is used to deliver laser beams needed by projection; the optical fiber scanner drives the optical fiber to scan in a first plane and enables the laser beam to project to the MEMS scanning mirror; and the MEMS scanning mirror makes scanning movement about a first axis and reflects the laser beam to a predetermined area to form a projection image; wherein the first axis is located in the first plane, or the first axis is parallel to the first plane. The present disclosure achieves laser projection by enabling the optical fiber scanner and the MEMS scanning mirror to scan simultaneously in different directions.

Abstract: Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: firstly forming a metal seed layer on a polymer protective layer; forming a mask on a surface of the metal seed layer; forming a coiled metal coating on the exposed metal seed layer; removing the mask and the metal seed layer in the coiled metal coating to obtain a metal coil; forming an encapsulation layer on the metal coil to encapsulate the metal coil; and attaching the encapsulation layer to an adhesive tape, and transmitting laser through a laser-transmitting substrate to act on the polymer protective layer, such that the laser-transmitting substrate is detached.