Abstract: A method and apparatus for depositing a dielectric material at a rate of at least 3000 Angstroms per minute on a large area substrate that has a surface area of at least about 0.35 square meters is provided. In one embodiment, the dielectric material is silicon oxide. Also provided is a large area substrate having a layer of dielectric material deposited by a process yielding a deposition rate in excess of about 3000 Angstroms per minute and a processing chamber for fabricating the same.

Abstract: The invention provides methods, systems, and drivers for controlling an inkjet printing system. The driver may include logic including a processor, memory coupled to the logic, and a fire pulse generator circuit coupled to the logic. The fire pulse generator includes a connector to facilitate coupling the driver to a print head. The logic is adapted to receive an image and to convert the image to an image data file. The image data file is adapted to be used by the driver to trigger the print head to deposit ink into pixel wells on a substrate as the substrate is moved in a print direction. Numerous other aspects are disclosed.

Abstract: The invention provides methods, systems, and drivers for controlling an inkjet printing system. The driver may include logic including a processor, memory coupled to the logic, and a fire pulse generator circuit coupled to the logic. The fire pulse generator may include a connector to facilitate coupling the driver to a print head. The fire pulse generator circuit may also include a fixed current source circuit adapted to generate a fire pulse with a constant slew rate that facilitates easy adjustment of ink drop size. The logic is adapted to receive an image and to convert the image to an image data file. The image data file is adapted to be used by the driver to trigger the print head to deposit ink into pixel wells on a substrate as the substrate is moved in a print direction. Numerous other aspects are disclosed.

Abstract: In a first aspect, a system is provided for inkjet printing. The system includes (1) at least one apparatus for inkjet printing having (a) a first inkjet print head including a first plurality of nozzles adapted to selectively dispense a first ink; (b) a second inkjet print head including a second plurality of nozzles adapted to selectively dispense a second ink; and (c) a set including the first and second print heads arranged such that the set is adapted to dispense the first and second inks into respective adjacent color wells of a display pixel on a substrate during a printing pass; and (2) a stage adapted to support the substrate and transport the substrate below the at least one apparatus for inkjet printing during the printing pass. Numerous other aspects are provided.

Abstract: Methods and apparatus are provided wherein data representative of an image is received, the data being indicative of a plurality of theoretical ink jetting drop positions. The data may be converted into an image data file, the image data file being indicative of a plurality of actual physical ink jetting drop positions, each physical ink jetting drop position corresponding to a theoretical ink jetting drop position. A print system may be controlled based on the image data file, wherein the actual physical ink jetting drop positions may each be selected based upon being within a predefined percentage of a print resolution in a printing direction of a corresponding one of the theoretical ink jetting drop positions.

Abstract: In some embodiments of the invention, a method for inkjet printing is provided. The method includes providing sets of print heads, each set being disposed along a different axis. The method also includes adjusting each axis relative to different display objects on a substrate. Numerous other aspects are provided.

Abstract: The present invention provides methods and apparatus for controlling the quantity of fluid output (e.g., drop size) by individual nozzles of a print head to a very high precision at a frequency equal to the frequency at which fluid is normally dispensed. This is achieved by mapping fluid quantity control information into the data that represents the image to be printed. Data representative of an image is received and converted into pixel data. In at least one embodiment, the pixel data includes pixels represented by N bits, and the N bits may represent a drop size for the pixel and a union of the N bits may represent a nozzle status. A print head may be controlled based on the pixel data, and the print head may include nozzles that are each adapted to deposit at least one drop size quantity of a fluid on a substrate.

Abstract: In a first aspect, a first apparatus is provided for inkjet printing. The first apparatus includes an inkjet head support that includes a plurality of inkjet heads. A first inkjet head of the plurality of inkjet heads is adapted to be independently moveable in both directions along a lateral axis relative to a second inkjet head of the plurality of inkjet heads. The first apparatus also includes a system controller adapted to control an independent lateral movement of the first inkjet head relative to the second inkjet head. Numerous other aspects are provided.

Abstract: In a first aspect, a system is provided. The system includes (1) a stage adapted to move a substrate relative to print heads during printing; (2) at least one print head suspended from a support above the stage and adapted to be moveable in a plane above the stage; (3) a controller operable to rotate the print head about a center of the print head; and (4) an imaging system adapted to capture an image of the print head and to determine a center point of the print head based upon images of the print head captured as the print head is rotated. Numerous other aspects are provided.

Abstract: A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stamping station is adapted to retain a large area substrate thereon. The stamp has a patterned bottom surface that is adapted for microcontact printing. The prep station is for applying a precursor to the patterned bottom surface of the stamp. In one embodiment, a method for processing large area substrates includes the steps of disposing a large area substrate on a platen, inking a stamp adapted for microcontact printing, and automatically contacting a bottom of the stamp to the large area substrate supported on a platen.

Abstract: A method and apparatus for depositing a dielectric material at a rate of at least 3000 Angstroms per minute on a large area substrate that has a surface area of at least about 0.35 square meters is provided. In one embodiment, the dielectric material is silicon oxide. Also provided is a large area substrate having a layer of dielectric material deposited by a process yielding a deposition rate in excess of about 3000 Angstroms per minute and a processing chamber for fabricating the same.

Abstract: The embodiments of the present invention describe an apparatus and a method of visualizing droplets dispensed from an inkjet printing system. A droplet visualization system is integrated with the inkjet printing system and is capable of measuring the sizes and the speeds of dispensed inkjet droplets and capturing the trajectories of the dispensed inkjet droplets. The measured information regarding the sizes, the speeds and trajectories of the droplets is feedback to the inkjet printing system to monitor and to control the dispense operation of the inkjet printing system. Due to this feedback control, the uniformities of the sizes, the speeds and the trajectories can be monitored and be improved.

Abstract: Embodiments of the invention generally provide an apparatus and a method for providing a uniform thermal profile to a plurality of substrates during heat processing. In one embodiment, a cassette containing one or more heated substrate supports is moveably disposed within a heating chamber having an about uniform thermal profile therein to more uniformly heat the substrates.

Abstract: A substrate support and method for fabricating the same are provided. In one embodiment of the invention, a substrate support includes an electrically conductive body having a substrate support surface that is covered by an electrically insulative coating. At least a portion of the coating centered on the substrate support surface has a surface finish of between about 200 to about 2000 micro-inches. In another embodiment, a substrate support includes an anodized aluminum body having a surface finish on the portion of the body adapted to support a substrate thereon of between about 200 to about 2000 micro-inches. In one embodiment, a substrate support assembly includes an electrically conductive body having a substrate support surface, a substrate support structure that is adapted to support the conductive body and the conductive body is covered by an electrically insulative coating.

Abstract: A shadow frame and framing system for semiconductor fabrication equipment comprising a rectangular frame having four edges, the edges forming an interior lip with a top surface and an bottom engagement surface; and a cross beam disposed between at least two edges of the frame, the cross beam having a top surface and a bottom engagement surface, the engagement surface of the cross beam configured to be flush with the engagement surface of the lip; wherein one or more of the engagement surfaces are configured to cover metal interconnect bonding areas on a carrier disposed below the frame. The shadow frame is particularly useful in plasma enhanced chemical vapor deposition (PECVD) applications used to make active matrix liquid crystal displays (AMLCDs) and solar cells.

Abstract: Provided herein is a method for cleaning a process chamber for semiconductor and/or flat panel display manufacturing. This method comprises the steps of converting a non-cleaning feed gas to a cleaning gas in a remote location and then delivering the cleaning gas to the process chamber for cleaning. Such method may further comprise the step of activating the cleaning gas outside the chamber before the delivery of the gas to the chamber. Also provided is a method of eliminating non-cleaning feed gas from the cleaning gas by cryo condensation.

Abstract: An apparatus and method for holding a substrate on a support layer in a processing chamber. The method includes the steps of positioning the substrate a predetermined distance from the support layer, introducing a plasma in the processing chamber, lowering the substrate to a point where the substrate engages the support layer, and maintaining the plasma for a predetermined time. The apparatus is directed to a susceptor system for a processing chamber in which a substrate is electrostatically held essentially flat. The apparatus includes a substrate support and a support layer composed of a dielectric material disposed on the substrate support. At least one lift pin is used for supporting the substrate relative to the support layer. Means are provided for moving each lift pin relative to the support layer. Means are also provided for producing a plasma within the processing chamber.

Abstract: A method for lifting a substrate from a susceptor. A plurality of lift pins is configured so that they support the substrate without contacting a central portion of the substrate. The processed substrate has a first dimension that is at least 500 millimeters and a second dimension that is at least 500 millimeters. Each lift pin in the plurality of lift pins is configured so that it supports the substrate from a point that is at least 120 millimeters from a center of the substrate. The plurality of lift pins is configured so that each side of the susceptor is supported by at least three lift pins. In some embodiments, a support member overlies at least a subset of the plurality of lift pins.

Abstract: A method for forming color filters for flat panel displays comprising dispensing color inks into a pre-patterned matrix using an inkjet device and curing the dispensed color inks. In one aspect, the color inks are cured in a concave configuration. In another aspect, the color inks are cured using electron beam, laser, X-ray, or other suitable high energy source.

Abstract: In a first aspect, a method of curing ink on a substrate is provided. The method includes the steps of (1) placing a substrate on a support stage of an ink curing chamber; and (2) scanning an electron beam over a surface of the substrate within the ink curing chamber so as to cure ink present on the substrate. Numerous other aspects are provided.