Patents by Inventor Rabindra N. Das

Rabindra N. Das has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7384856
    Abstract: A method of forming a capacitive substrate in which first and second conductors are formed opposite a dielectric, with one of these electrically coupled to a thru-hole connection. Each functions as an electrode for the resulting capacitor. The substrate is then adapted for being incorporated within a larger structure to form a circuitized substrate such as a printed circuit board or a chip carrier. Additional capacitors are also possible.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: June 10, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich, James T. Matthews
  • Publication number: 20070275525
    Abstract: A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.
    Type: Application
    Filed: May 23, 2006
    Publication date: November 29, 2007
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, Frank D. Egitto, John M. Lauffer, How T. Lin, Voya R. Markovich
  • Patent number: 7235745
    Abstract: A material for use as part of an internal resistor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. A circuitized substrate adapted for using such a material and resistor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: June 26, 2007
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich
  • Patent number: 7025607
    Abstract: A material for use as part of an internal capacitor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, the ferroelectric ceramic component nano-particles having a particle size substantially in the range of between about 0.01 microns and about 0.9 microns and a surface within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: April 11, 2006
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich, Mark D. Poliks