Patents by Inventor Richard Hamilton SEWELL
Richard Hamilton SEWELL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967657Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: April 6, 2020Date of Patent: April 23, 2024Assignee: Maxeon Solar Pte. Ltd.Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Publication number: 20240088317Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: RICHARD HAMILTON SEWELL, DAVID FREDRIC JOEL KAVULAK, LEWIS ABRA, THOMAS P. PASS, TAESEOK KIM, MATTHIEU MOORS, BENJAMIN IAN HSIA, GABRIEL HARLEY
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Patent number: 11923474Abstract: A solar cell can include a conductive foil having a first portion with a first yield strength coupled to a semiconductor region of the solar cell. The solar cell can be interconnected with another solar cell via an interconnect structure that includes a second portion of the conductive foil, with the interconnect structure having a second yield strength greater than the first yield strength.Type: GrantFiled: December 7, 2017Date of Patent: March 5, 2024Assignee: Maxeon Solar Pte. Ltd.Inventors: Thomas P. Pass, Gabriel Harley, David Fredric Joel Kavulak, Richard Hamilton Sewell
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Patent number: 11901470Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a string of solar cells includes a plurality of back-contact solar cells, wherein each of the plurality of back-contact solar cells includes P-type and N-type doped diffusion regions. A plurality of conductive wires is disposed over a back surface of each of the plurality of solar cells, wherein each of the plurality of conductive wires is substantially parallel to the P-type and N-type doped diffusion regions of each of the plurality of solar cells. One or more of the plurality of conductive wires adjoins a pair of adjacent solar cells of the plurality of solar cells and has a relief feature between the pair of adjacent solar cells.Type: GrantFiled: September 25, 2020Date of Patent: February 13, 2024Assignee: Maxeon Solar Pte. Ltd.Inventors: Richard Hamilton Sewell, Matthieu Minault Reich, Andrea R. Bowring, Arbaz Shakir, Ryan Reagan, Matthew Matsumoto
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Publication number: 20240047595Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.Type: ApplicationFiled: October 16, 2023Publication date: February 8, 2024Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Douglas Rose, Lewis Abra
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Patent number: 11894472Abstract: Approaches for fabricating foil-based metallization of solar cells based on a leave-in etch mask, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes metal foil portions in alignment with corresponding ones of the alternating N-type and P-type semiconductor regions. A patterned wet etchant-resistant polymer layer is disposed on the conductive contact structure. Portions of the patterned wet etchant-resistant polymer layer are disposed on and in alignment with the metal foil portions.Type: GrantFiled: October 28, 2020Date of Patent: February 6, 2024Assignee: Maxeon Solar Pte. Ltd.Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Taeseok Kim, Gabriel Harley
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Patent number: 11862745Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: GrantFiled: January 13, 2020Date of Patent: January 2, 2024Assignee: Maxeon Solar Pte. Ltd.Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Patent number: 11742446Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.Type: GrantFiled: December 6, 2021Date of Patent: August 29, 2023Assignee: Maxeon Solar Pte. Ltd.Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Douglas Rose, Lewis Abra
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Patent number: 11646387Abstract: A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.Type: GrantFiled: April 5, 2019Date of Patent: May 9, 2023Assignee: Maxeon Solar Pte. Ltd.Inventors: Pei Hsuan Lu, Benjamin I. Hsia, David Aaron Randolph Barkhouse, David C. Okawa, David F. Kavulak, Lewis C. Abra, George G. Correos, Richard Hamilton Sewell, Ryan Reagan, Tamir Lance, Thierry Nguyen
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Publication number: 20230070805Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also involves forming a paste between adjacent ones of the alternating N-type and P-type semiconductor regions. The method also involves curing the paste to form non-conductive material regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The method also involves adhering a metal foil to the alternating N-type and P-type semiconductor regions. The method also involves laser ablating through the metal foil in alignment with the locations between the alternating N-type and P-type semiconductor regions to isolate regions of remaining metal foil in alignment with the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: November 3, 2022Publication date: March 9, 2023Inventors: Benjamin Ian Hsia, GABRIEL HARLEY, TAESEOK KIM, RICHARD HAMILTON SEWELL, SUNG DUG KIM
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Publication number: 20220367738Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: June 9, 2022Publication date: November 17, 2022Inventors: Richard Hamilton Sewell, Robert Woehl, Jens Dirk Moschner, Nils-Peter Harder
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Publication number: 20220352397Abstract: Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: July 13, 2022Publication date: November 3, 2022Inventors: Richard Hamilton Sewell, Gabriel Harley, Nils-Peter Harder
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Patent number: 11424373Abstract: Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.Type: GrantFiled: April 1, 2016Date of Patent: August 23, 2022Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Gabriel Harley, Nils-Peter Harder
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Publication number: 20220190179Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.Type: ApplicationFiled: December 6, 2021Publication date: June 16, 2022Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Douglas Rose, Lewis Abra
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Publication number: 20220020895Abstract: Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.Type: ApplicationFiled: August 23, 2021Publication date: January 20, 2022Inventors: Richard Hamilton Sewell, Gabriela Elena Bunea
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Patent number: 11227962Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.Type: GrantFiled: March 29, 2019Date of Patent: January 18, 2022Assignee: SunPower CorporationInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Douglas Rose, Lewis Abra
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Publication number: 20210384366Abstract: Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.Type: ApplicationFiled: August 17, 2021Publication date: December 9, 2021Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Junbo Wu, Michael Cudzinovic, Paul Loscutoff, Joseph Behnke, Michel Arsène Olivier Ngamo Toko
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Patent number: 11127866Abstract: Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.Type: GrantFiled: June 1, 2016Date of Patent: September 21, 2021Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Junbo Wu, Michael Cudzinovic, Paul Loscutoff, Joseph Behnke, Michel Arséne Olivier Ngamo Toko
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Patent number: 11101401Abstract: Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.Type: GrantFiled: March 13, 2020Date of Patent: August 24, 2021Assignee: SunPower CorporationInventors: Richard Hamilton Sewell, Gabriela Elena Bunea
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Patent number: 11004987Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: GrantFiled: March 13, 2020Date of Patent: May 11, 2021Assignees: SunPower Corporation, Total Marketing Services and Total Energies Nouvelles Activites USAInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose