Patents by Inventor Richard Hamilton SEWELL
Richard Hamilton SEWELL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11004987Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: GrantFiled: March 13, 2020Date of Patent: May 11, 2021Assignees: SunPower Corporation, Total Marketing Services and Total Energies Nouvelles Activites USAInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Publication number: 20210098641Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a string of solar cells includes a plurality of back-contact solar cells, wherein each of the plurality of back-contact solar cells includes P-type and N-type doped diffusion regions. A plurality of conductive wires is disposed over a back surface of each of the plurality of solar cells, wherein each of the plurality of conductive wires is substantially parallel to the P-type and N-type doped diffusion regions of each of the plurality of solar cells. One or more of the plurality of conductive wires adjoins a pair of adjacent solar cells of the plurality of solar cells and has a relief feature between the pair of adjacent solar cells.Type: ApplicationFiled: September 25, 2020Publication date: April 1, 2021Inventors: Richard Hamilton Sewell, Matthieu Minault Reich, Andrea R. Bowring, Arbaz Shakir, Ryan Reagan, Matthew Matsumoto
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Publication number: 20210057593Abstract: Approaches for fabricating foil-based metallization of solar cells based on a leave-in etch mask, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes metal foil portions in alignment with corresponding ones of the alternating N-type and P-type semiconductor regions. A patterned wet etchant-resistant polymer layer is disposed on the conductive contact structure. Portions of the patterned wet etchant-resistant polymer layer are disposed on and in alignment with the metal foil portions.Type: ApplicationFiled: October 28, 2020Publication date: February 25, 2021Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Taeseok Kim, Gabriel Harley
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Patent number: 10923616Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: GrantFiled: March 9, 2020Date of Patent: February 16, 2021Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Publication number: 20210020794Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: April 6, 2020Publication date: January 21, 2021Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Patent number: 10737475Abstract: A thermo-compression bonding tool with a high temperature elastic element, and methods of bonding a metal sheet to a substrate using a thermo-compression bonding tool are described. In an example, a system for bonding a metal sheet to a substrate includes a stage to support the substrate and an elastic roller located above the stage. The elastic roller includes a high temperature material. The system also includes a heated backing plate located above the elastic roller. The backing plate is configured to apply pressure and heat to the elastic roller as the elastic roller rolls across a metal sheet disposed above the substrate.Type: GrantFiled: April 12, 2018Date of Patent: August 11, 2020Assignee: SunPower CorporationInventors: Richard Hamilton Sewell, Thomas P. Pass
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Patent number: 10727369Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.Type: GrantFiled: October 29, 2018Date of Patent: July 28, 2020Assignee: SunPower CorporationInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse
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Publication number: 20200220040Abstract: Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.Type: ApplicationFiled: March 13, 2020Publication date: July 9, 2020Inventors: Richard Hamilton Sewell, Gabriela Elena Bunea
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Publication number: 20200220031Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: ApplicationFiled: March 13, 2020Publication date: July 9, 2020Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Publication number: 20200212248Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: ApplicationFiled: March 9, 2020Publication date: July 2, 2020Inventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Patent number: 10672924Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: GrantFiled: January 2, 2019Date of Patent: June 2, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Publication number: 20200152813Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: January 13, 2020Publication date: May 14, 2020Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Patent number: 10644170Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.Type: GrantFiled: August 21, 2018Date of Patent: May 5, 2020Assignees: SunPower Corporation, Total Marketing Services and Total Energies Nouvelles Activites USAInventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
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Patent number: 10622505Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: GrantFiled: November 27, 2018Date of Patent: April 14, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Patent number: 10622227Abstract: A multi-axis flattening tool and method are described. In an example, the multi-axis flattening tool includes a support structure to constrain a bowed wafer along a support perimeter, and a pair of flattening structures independently movable relative to the support structure. For example, a first flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a first plane, and a second flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a second plane orthogonal to the first plane. The multi-axis bending of the wafer may flatten the wafer.Type: GrantFiled: July 1, 2016Date of Patent: April 14, 2020Assignee: SunPower CorporationInventor: Richard Hamilton Sewell
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Patent number: 10615296Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: August 30, 2018Date of Patent: April 7, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Patent number: 10593825Abstract: Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.Type: GrantFiled: December 27, 2018Date of Patent: March 17, 2020Assignee: SunPower CorporationInventors: Richard Hamilton Sewell, Gabriela Elena Bunea
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Patent number: 10535790Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: GrantFiled: June 25, 2015Date of Patent: January 14, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Publication number: 20190312166Abstract: A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.Type: ApplicationFiled: April 5, 2019Publication date: October 10, 2019Inventors: Pei Hsuan Lu, Benjamin I. Hsia, David Aaron Randolph Barkhouse, David C. Okawa, David F. Kavulak, Lewis C. Abra, George G. Correos, Richard Hamilton Sewell, Ryan Reagan, Tamir Lance, Thierry Nguyen
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Publication number: 20190305167Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.Type: ApplicationFiled: March 29, 2019Publication date: October 3, 2019Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Douglas Rose, Lewis Abra