Patents by Inventor Rikihiro Maruyama
Rikihiro Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9466509Abstract: A method of manufacturing a semiconductor device, includes preparing a molding die for molding a resin case for a semiconductor device, the molding die having protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position; conforming and holding each of the plurality of terminals to the corresponding protrusions in the molding die; and injecting resin into the molding die to integrally mold the plurality of terminals and the resin case.Type: GrantFiled: May 18, 2015Date of Patent: October 11, 2016Assignee: FUJI ELECTRIC CO., LTD.Inventors: Kazunaga Onishi, Rikihiro Maruyama, Masafumi Tezuka, Masahiro Kikuchi
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Publication number: 20160118310Abstract: A semiconductor module includes a plurality of insulating circuit boards including semiconductor chips, each of the plurality of insulating circuit boards including a first outer edge among outer edges of the insulating circuit board facing an adjacent insulating circuit board of the plurality of insulating circuit boards, and a second outer edge among the outer edges excluding the first outer edge; a resin frame body having a crosspiece abutting against the first outer edges, and a frame element abutting against the second outer edges; a conductive component striding over the crosspiece to electrically connect the insulating circuit boards to each other; and an upper lid having a lid element covering an opening disposed at an upper part of the resin frame body and a partition protruding from a face of the lid element facing the insulating circuit boards to abut against a part of the crosspiece.Type: ApplicationFiled: January 7, 2016Publication date: April 28, 2016Inventors: Rikihiro MARUYAMA, Takahito HARADA
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Publication number: 20160050764Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.Type: ApplicationFiled: October 27, 2015Publication date: February 18, 2016Inventors: Rikihiro MARUYAMA, Kenshi KAI, Nobuyuki KANZAWA, Mitsutoshi SAWANO
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Patent number: 9204559Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.Type: GrantFiled: March 11, 2014Date of Patent: December 1, 2015Assignee: FUJI ELECTRIC CO., LTD.Inventors: Rikihiro Maruyama, Kenshi Kai, Nobuyuki Kanzawa, Mitsutoshi Sawano
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Publication number: 20150249023Abstract: A method of manufacturing a semiconductor device, includes preparing a molding die for molding a resin case for a semiconductor device, the molding die having protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position; conforming and holding each of the plurality of terminals to the corresponding protrusions in the molding die; and injecting resin into the molding die to integrally mold the plurality of terminals and the resin case.Type: ApplicationFiled: May 18, 2015Publication date: September 3, 2015Inventors: Kazunaga ONISHI, Rikihiro MARUYAMA, Masafumi TEZUKA, Masahiro KIKUCHI
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Patent number: 9070696Abstract: In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.Type: GrantFiled: April 11, 2014Date of Patent: June 30, 2015Assignee: FUJI ELECTRIC CO., LTD.Inventors: Kazunaga Onishi, Rikihiro Maruyama, Masafumi Tezuka, Masahiro Kikuchi
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Publication number: 20140317896Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.Type: ApplicationFiled: March 11, 2014Publication date: October 30, 2014Applicant: FUJI ELECTRIC CO., LTD.Inventors: Rikihiro MARUYAMA, Kenshi KAI, Nobuyuki KANZAWA, Mitsutoshi SAWANO
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Publication number: 20140312464Abstract: In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.Type: ApplicationFiled: April 11, 2014Publication date: October 23, 2014Applicant: FUJI ELECTRIC CO., LTD.Inventors: Kazunaga ONISHI, Rikihiro MARUYAMA, Masafumi TEZUKA, Masahiro KIKUCHI
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Publication number: 20130306296Abstract: When insulating substrates of different shapes are soldered to a radiator plate, a third concave curve is previously formed on an insulating substrate side of the radiator plate. The third curve is determined by adding a second concave curve which is expected at the time of actually soldering the insulating substrates to the radiator plate to a first concave curve obtained by moving upside down a convex curve which appears at the time of soldering the insulating substrates to a flat radiator plate. A bottom of the third curve is positioned under the large insulating substrate, and a curvature of a portion where the distance between the bottom and a reference point of the radiator plate is longer is made smaller than a curvature of a portion where the distance between the bottom and a reference point of the radiator plate is shorter.Type: ApplicationFiled: July 25, 2013Publication date: November 21, 2013Applicant: FUJI ELECTRIC CO., LTD.Inventors: Yoshinori Uezato, Masayuki Soutome, Rikihiro Maruyama, Tomoaki Goto
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Patent number: 7985630Abstract: A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, and the semiconductor device; pouring a resin in a paste form into the case to fill a space relative to the first metal foil, insulating sheet, the second metal foil and the semiconductor device; and heat-curing the resin. A bottom end of a peripheral wall of the case is located above a bottom surface of the first metal. The bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.Type: GrantFiled: November 9, 2010Date of Patent: July 26, 2011Assignee: Fuji Electric Device Technology Co., Ltd.Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
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Patent number: 7944042Abstract: A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.Type: GrantFiled: February 12, 2008Date of Patent: May 17, 2011Assignee: Fuji Electric Device Technology Co., Ltd.Inventors: Katsuhiko Yoshihara, Rikihiro Maruyama, Masaaki Chino, Eiji Mochizuki, Motokiyo Yokoyama, Tatsuo Nishizawa, Tomonobu Sugiyama
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Publication number: 20110059581Abstract: A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, and the semiconductor device; pouring a resin in a paste form into the case to fill a space relative to the first metal foil, insulating sheet, the second metal foil and the semiconductor device; and heat-curing the resin. A bottom end of a peripheral wall of the case is located above a bottom surface of the first metal. The bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.Type: ApplicationFiled: November 9, 2010Publication date: March 10, 2011Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
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Patent number: 7902653Abstract: A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.Type: GrantFiled: April 28, 2008Date of Patent: March 8, 2011Assignee: Fuji Electric Systems Co., Ltd.Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
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Publication number: 20080284007Abstract: A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.Type: ApplicationFiled: April 28, 2008Publication date: November 20, 2008Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.Inventors: Masafumi Horio, Tatsuo Nishizawa, Eiji Mochizuki, Rikihiro Maruyama
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Publication number: 20080217760Abstract: A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.Type: ApplicationFiled: February 12, 2008Publication date: September 11, 2008Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.Inventors: Katsuhiko Yoshihara, Rikihiro Maruyama, Masaaki Chino, Eiji Mochizuki, Motokiyo Yokoyama, Tatsuo Nishizawa, Tomonobu Sugiyama
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Patent number: 6262474Abstract: A semiconductor device is formed of a casing, a substrate situated in the casing, at least one semiconductor chip fixed on the substrate, and at least one lead-out terminal for connecting the semiconductor chip to outside. The lead-out terminal includes a soldered portion soldered to the substrate, and a fixed portion fixed to the casing. A stress relaxing device or cutout is formed between the soldered portion and the fixed portion of the lead-out terminal to relieve stress along three axial directions orthogonal to each other. Thus, the crack formation is prevented in the soldered portion of the lead-out terminal while the resistance and impedance of the lead-out terminal are maintained at low values.Type: GrantFiled: April 29, 1999Date of Patent: July 17, 2001Assignee: Fuji Electric Co., Ltd.Inventors: Takatoshi Kobayashi, Souichi Okita, Rikihiro Maruyama
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Patent number: D364385Type: GrantFiled: September 16, 1994Date of Patent: November 21, 1995Assignee: Fuji Electric Co., Ltd.Inventors: Tomio Shimizu, Akira Nakahira, Rikihiro Maruyama, Toshifusa Yamada, Takao Nagasawa