Patents by Inventor Robert E. Davenport
Robert E. Davenport has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958162Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 17, 2020Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Patent number: 10875145Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 22, 2015Date of Patent: December 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10821573Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 19, 2015Date of Patent: November 3, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Publication number: 20200147750Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: January 17, 2020Publication date: May 14, 2020Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Patent number: 10537974Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 22, 2018Date of Patent: January 21, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Patent number: 10384330Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 16, 2015Date of Patent: August 20, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Publication number: 20180161954Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: January 22, 2018Publication date: June 14, 2018Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Patent number: 9873180Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: April 24, 2015Date of Patent: January 23, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Publication number: 20160114458Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: October 22, 2015Publication date: April 28, 2016Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava REDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
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Publication number: 20160107290Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: April 24, 2015Publication date: April 21, 2016Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Publication number: 20160107295Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: October 16, 2015Publication date: April 21, 2016Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
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Publication number: 20160107287Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: October 19, 2015Publication date: April 21, 2016Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
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Patent number: 6509069Abstract: The present invention pertains to an apparatus and method useful in semiconductor processing. The apparatus and method can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure. The sealing apparatus and method enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other.Type: GrantFiled: May 1, 1997Date of Patent: January 21, 2003Assignee: Applied Materials, Inc.Inventors: Robert E. Davenport, Avi Tepman
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Patent number: 6506693Abstract: A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system.Type: GrantFiled: March 6, 2002Date of Patent: January 14, 2003Assignee: Applied Materials, Inc.Inventors: Roger V. Heyder, Thomas B. Brezocsky, Robert E. Davenport
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Patent number: 6450750Abstract: A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system. In one embodiment, the holding chamber has a transfer robot which holds a stack of wafers for subsequent transfer to the processing chambers of the mainframe processing system.Type: GrantFiled: October 28, 1999Date of Patent: September 17, 2002Assignee: Applied Materials, Inc.Inventors: Roger V. Heyder, Thomas B. Brezocsky, Robert E. Davenport
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Publication number: 20020094696Abstract: A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system.Type: ApplicationFiled: March 6, 2002Publication date: July 18, 2002Applicant: Applied Materials, Inc.Inventors: Roger V. Heyder, Thomas B. Brezoczky, Robert E. Davenport
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Publication number: 20010040029Abstract: Apparatus for promoting heat transfer between a first volume (chamber volume) and a second volume (expandable, substrate support platform volume). Specifically, the apparatus comprises: a chamber defining a chamber volume that contains a chamber atmosphere, e.g., a partial vacuum; a substrate support platform that defines an expandable volume that contains a heat transfer medium, e.g., air; and a seal that isolates the chamber volume from the heat transfer medium. The substrate support platform further comprises: a substrate support platen that has a first surface located within the chamber volume and a second surface located within the expandable volume; a housing sealed to the second surface of the substrate support platen; and a expandable member such as a bellows, attached to the housing, to provide for expansion of the expandable volume that is defined by the housing and the bellows. The housing is typically fabricated of metal and the substrate support is typically fabricated of ceramic.Type: ApplicationFiled: November 4, 1997Publication date: November 15, 2001Applicant: donald verplanckenInventors: ROBERT E. DAVENPORT, AVI TEPMAN
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Publication number: 20010014498Abstract: An inlaid capacitor and method of forming the same on a semiconductor wafer provides for polishing a layer formed within a cavity and on a top surface of the semiconductor wafer. The layer may include a bottom electrode layer of the capacitor. The cavity, which remains open since a sacrificial material is not used to protect the cavity during polishing, contains residual particles after the polish process is completed. The particles are loosened from the surfaces of the bottom electrode layer by a megasonic cleaning process. In order to remove the loosened residual particles, the semiconductor wafers is subjected to a double-sided brush scrubbing. Following the removal of substantially all of the residual particles from within the cavity, and the surface of the bottom electrode layer, formation of the capacitor completed by the deposition of a dielectric material and a top electrode layer.Type: ApplicationFiled: April 30, 1999Publication date: August 16, 2001Inventors: GREGORY M. AMICO, ROBERT E. DAVENPORT
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Patent number: 6241477Abstract: An apparatus for removing an undesirable gas in a processing chamber includes one or more getter materials disposed between a process gas inlet and a substrate support member in the processing chamber, and one or more temperature control elements disposed in thermal communication with the one or more getter materials. Preferably, a controller is connected to the one or more temperature control elements to regulate the temperature of the one or more getter materials, and a gas analyzer is disposed within the processing chamber to provide signals to the controller and indicate the presence of undesirable gases. Another aspect of the invention provides a method for removing a gas from a processing chamber comprising pumping the gas using a getter material disposed between a process gas inlet and a substrate support member in the processing chamber, wherein the getter material is activated by a temperature control element disposed in thermal communication with the getter material.Type: GrantFiled: August 25, 1999Date of Patent: June 5, 2001Assignee: Applied Materials, Inc.Inventors: Thomas Brezoczky, Roger Heyder, Robert E. Davenport
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Patent number: 6222991Abstract: A semiconductor processing apparatus and process is disclosed which is capable of degassing a semiconductor substrate and also orienting the substrate in the same vacuum chamber. The apparatus includes an electrostatic clamping structure for retaining the entire undersurface of a semiconductor substrate in thermal communication therewith in the vacuum chamber, a heater located within the electrostatic clamping structure for heating the electrostatically clamped substrate to degas it, a rotation mechanism for imparting rotation to the substrate in the vacuum chamber, and a detector for detecting the rotational alignment of the substrate in response to the rotation of the substrate. In a preferred embodiment, the substrate is rotated to rotationally align it as it is being heated to degas it.Type: GrantFiled: July 23, 1999Date of Patent: April 24, 2001Assignee: Applied Materials Inc.Inventor: Robert E. Davenport