Abstract: The present invention provides a vacuum chamber that reduces the amount of time required to draw a vacuum after replacing consumables or performing routine maintenance by preserving the vacuum in a portion of the chamber. More particularly, the chamber isolates a frequently replaced consumable or component in a first portion of the chamber so that only the first portion of the chamber is exposed to the surrounding environment and the volume of gas or air that must be re-evacuated is reduced. A gate valve is provided to form a seal with a valve seat that is either formed into the chamber wall or provided by a valve body. Once the second portion is sealed, a lid to the first portion may be opened for access.

Abstract: A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system.

Abstract: A semiconductor processing apparatus and process is capable of degassing a semiconductor substrate and also orienting the substrate in the same vacuum chamber. The apparatus includes an electrostatic clamping structure for retaining the entire undersurface of a semiconductor substrate in thermal communication therewith in the vacuum chamber, a heater located within the electrostatic clamping structure for heating the electrostatically clamped substrate to degas it, a rotation mechanism for imparting rotation to the substrate in the vacuum chamber, and a detector for detecting the rotational alignment of the substrate in response to the rotation of the substrate. In a preferred embodiment, the substrate is rotated to rotationally align it as it is being heated to degas it.

Abstract: A readily removable deposition shield assembly for processing chambers such as chemical vapor deposition (CVD), ion implantation, or physical vapor deposition (PVD) or sputtering chambers, is disclosed. The shield assembly includes a shield member which is mounted to the chamber for easy removal, such as by screws, and defines a space along the periphery of the substrate support. A shield ring is inserted into the peripheral space and is thus mounted in removable fashion and is automatically centered about the substrate. The shield ring overlaps the cylindrical shield and a deposition ring. The deposition ring removably rests upon a flange extending from the outer periphery of a substrate support pedestal. Collectively, these components prevent deposition on the chamber and hardware outside the processing region.

Abstract: A hand box sealing tape applicator for dispensing and applying a length of tape from a roll of tape to an object includes a frame comprising a support portion and an angled nose portion. A tape roll support means is provided on the support portion of the frame for rotatably supporting a roll of tape thereon and for providing a gripping surface for a user to hold and manipulate the hand tape applicator.

Abstract: Apparatus for promoting heat transfer between a first volume (chamber volume) and a second volume (expandable, substrate support platform volume). Specifically, the apparatus comprises: a chamber defining a chamber volume that contains a chamber atmosphere, e.g., a partial vacuum; a substrate support platform that defines an expandable volume that contains a heat transfer medium, e.g., air; and a seal that isolates the chamber volume from the heat transfer medium. The substrate support platform further comprises: a substrate support platen that has a first surface located within the chamber volume and a second surface located within the expandable volume; a housing sealed to the second surface of the substrate support platen; and a expandable member such as a bellows, attached to the housing, to provide for expansion of the expandable volume that is defined by the housing and the bellows. The housing is typically fabricated of metal and the substrate support is typically fabricated of ceramic.

Abstract: The present invention pertains to an apparatus and method useful in semiconductor processing. The apparatus and method can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure.The sealing apparatus and method enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other.

Abstract: The present invention pertains to an apparatus useful in semiconductor processing. The apparatus can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure. The sealing apparatus enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other.

Abstract: The present invention pertains to an apparatus and method useful in semiconductor processing. The apparatus and method can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure.The sealing apparatus and method enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other.

Abstract: An improved clamping ring, useful for securing a semiconductor wafer during wafer processing, for example in a physical vapor deposition system, is made of a thermally nonconductive material having a low thermal coefficient of expansion, for example a ceramic material, such as alumina. Such material, by exhibiting only slight expansion or contraction during thermal cycling, allows the production of a clamping ring having the largest possible inner diameter, such that more wafer surface area is available for device fabrication, and such that wafer shadowing that results from metal film build-up on the clamping ring is mitigated, thereby extending the useful life of the clamp ring and reducing system downtime. Additionally, the thermal stability provided by the present invention improves wafer temperature uniformity, and therefore also improves per wafer device yield while increasing device reliability.

Abstract: A bow sight member includes a mounting plate secured to a bow in an orthogonal relationship, with the mounting plate including an L-shaped front sight support member projecting forwardly of the bow, with an L-shaped rear sight member positioned rearwardly of the bow, wherein each sight member includes a mounting plate arranged in a coplanar relationship to slidably secure respective front and rear sight plates thereon, with the front and rear sight plates respectively mounting respective front and rear sights.