Abstract: A ply placement device uses a ply guide to place plies on a curved substrate surface. The ply guide includes a guide surface and a guide edge that are each curved to match the contour of the substrate so that the ply transitions smoothly from its planar form to a curved form as the ply is placed onto the substrate. The ply guide may be flexible or segmented to allow reconfiguration of the guide surfaces to match various substrate contours.

Abstract: Method and apparatus for use in curing of a composite charge having an internal cavity. Apparatus includes a flexible bladder adapted to be placed in the cavity for applying pressure on the composite charge during curing. An end fitting is operatively coupled to the flexible bladder. The end fitting defining a bolt bore and a horizontal bore. When a vent bolt is operatively coupled to the bolt bore of the end fitting, the vent bolt and the horizontal bore define a pressure passageway that allows an interior of the bladder to become subjected to external pressure.

Abstract: Radius fillers for composite structures, composite structures that include radius fillers, and systems and methods of forming the same are disclosed herein. The methods include determining a transverse cross-sectional shape of an elongate void space, which extends within a transition region that is defined by a plurality of plies of composite material, and determining a material property field of the transition region. The methods further include forming the radius filler by combining a plurality of lengths of composite tape to define a radius filler cross-sectional shape, which corresponds to the transverse cross-sectional shape of the elongate void space, and orienting a plurality of lengths of reinforcing fiber in each of the plurality of lengths of composite tape based, at least in part, on the material property field of the transition region. The radius fillers include radius fillers with selectively oriented reinforcing fibers. The composite structures include the radius fillers.

Abstract: Radius fillers for composite structures, composite structures that include the radius fillers, and systems and methods of forming the radius fillers. The systems and methods may be configured to create a pre-form that may be utilized to form a radius filler and/or create a radius filler from the pre-form. Creating the pre-form may include extending a plurality of lengths of composite tape from a composite tape source and receiving the plurality of lengths of composite tape in a pre-form forming structure, converging and/or otherwise combining the plurality of lengths of composite tape within the pre-form forming structure to produce the pre-form, and/or withdrawing the pre-form from the pre-form forming structure. Creating the radius filler from the pre-form may include receiving the pre-form in a radius filler forming structure and producing the radius filler from the radius filler forming structure.

Abstract: The combined toothpaste container cap and dental floss dispenser of the present disclosure and related inventions includes a cap structure configured to fit with a toothpaste dispenser in the form of a tube, a floss container and an access panel. The floss container is configured to fit within the cap body and has a floss containment cavity in which a supply of dental floss is stored. A floss lead opening is located on the floss container through which the dental floss is accessed. An access panel is attached to the floss container which covers the floss lead opening.

Abstract: A ply placement device uses a ply guide to place plies on a curved substrate surface. The ply guide includes a guide surface and a guide edge that are each curved to match the contour of the substrate so that the ply transitions smoothly from its planar form to a curved form as the ply is placed onto the substrate. The ply guide may be flexible or segmented to allow reconfiguration of the guide surfaces to match various substrate contours.

Abstract: A ply placement device uses a ply guide to place plies on a curved substrate surface. The ply guide includes a guide surface and a guide edge that are each curved to match the contour of the substrate so that the ply transitions smoothly from its planar form to a curved form as the ply is placed onto the substrate. The ply guide may be flexible or segmented to allow reconfiguration of the guide surfaces to match various substrate contours.

Abstract: A ratcheting pulley device is shown and described. In one embodiment, the device includes a sheave rotatably mounted in a housing. The housing defines an opening for ingress and egress of a rope or cord into the housing and around the sheave. The device includes a releasable ratchet mechanism, which, when engaged, permits rotation of the sheave in one direction but not the other, and which, when released, permits free rotation of the sheave. A loading-disk is mounted on the exterior of the housing and is in rotational communication with the sheave. The loading-disk allows rope or cord to be operably and quickly loaded into the device.

Abstract: A ply placement device uses a ply guide to place plies on a curved substrate surface. The ply guide includes a guide surface and a guide edge that are each curved to match the contour of the substrate so that the ply transitions smoothly from its planar form to a curved form as the ply is placed onto the substrate. The ply guide may be flexible or segmented to allow reconfiguration of the guide surfaces to match various substrate contours.

Abstract: An electromechanical system includes a structural plate in contact with a stop and an actuator activated by a force for creating a movement of the stop relative to the structural plate, wherein the movement is sufficient to overcome stiction forces between the structural plate and the stop.

Abstract: Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations, and while reducing the amount of fluid used to support the polishing pad. Platen configuration provides fluid pressure control to reduce leakage of fluid from beneath the polishing pad, and contributes to control of a location of an inflection point of the removal rate characteristic. Another configuration controls a shape of a section of the removal rate characteristic between the inflection point and a leading wafer edge.

Abstract: A number of methods and systems for overcoming stiction are provided. The systems include electro-mechanical systems capable of exerting a variety of forces upon areas prone to stiction. The systems can be MEMS arrays or other types of devices where stiction related forces occur. The methods include a variety of ways of causing movement in areas prone to stiction forces. Such movement can be vibrational in nature and is sufficient to overcome stiction, allowing a trapped element to be moveed to a desired location.

Abstract: A method and apparatus for protecting a conductor in an integrated circuit. A protective covering can be disposed over a conductor for a substantial length along the conductor while allowing a portion of the conductor to be exposed. The protective covering can be configured as a tunnel which runs for a substantial length along the conductor and can be operable to prevent the occurrence of electrical shorts during operation of the integrated circuit. According to one embodiment of the invention the integrated circuit can be configured as a micromachined device with active mechanical components exposed to the atmosphere.

Abstract: A number of methods and systems for overcoming stiction are provided. The systems include electromechanical systems capable of exerting a variety of forces upon areas prone to stiction. The systems can be MEMS arrays or other types of devices where stiction related forces occur. The methods include a variety of ways of causing movement in areas prone to stiction forces. Such movement can be vibrational in nature and is sufficient to overcome stiction, allowing a trapped element to be moveed to a desired location.

Abstract: A number of methods and systems for overcoming stiction are provided. The systems include electro-mechanical systems capable of exerting a variety of forces upon areas prone to stiction. The systems can be MEMS arrays or other types of devices where stiction related forces occur. The methods include a variety of ways of causing movement in areas prone to stiction forces. Such movement can be vibrational in nature and is sufficient to overcome stiction, allowing a trapped element to be moved to a desired location.

Abstract: A number of methods and systems for overcoming stiction are provided. The systems include electro-mechanical systems capable of exerting a variety of forces upon areas prone to stiction. The systems can be MEMS arrays or other types of devices where stiction related forces occur. The methods include a variety of ways of causing movement in areas prone to stiction forces. Such movement can be vibrational in nature and is sufficient to overcome stiction, allowing a trapped element to be moveed to a desired location.

Abstract: A method and apparatus for protecting a conductor in an integrated circuit. A protective covering can be disposed over a conductor for a substantial length along the conductor while allowing a portion of the conductor to be exposed. The protective covering can be configured as a tunnel which runs for a substantial length along the conductor and can be operable to prevent the occurrence of electrical shorts during operation of the integrated circuit. According to one embodiment of the invention the integrated circuit can be configured as a micromachined device with active mechanical components exposed to the atmosphere.

Abstract: A method and apparatus for protecting a conductor in an integrated circuit. A protective covering can be disposed over a conductor for a substantial length along the conductor while allowing a portion of the conductor to be exposed. The protective covering can be configured as a tunnel which runs for a substantial length along the conductor and can be operable to prevent the occurrence of electrical shorts during operation of the integrated circuit. According to one embodiment of the invention the integrated circuit can be configured as a micromachined device with active mechanical components exposed to the atmosphere.

Abstract: A number of methods and systems for overcoming stiction are provided. The systems include electro-mechanical systems capable of exerting a variety of forces upon areas prone to stiction. The systems can be MEMS arrays or other types of devices where stiction related forces occur. The methods include a variety of ways of causing movement in areas prone to stiction forces. Such movement can be vibrational in nature and is sufficient to overcome stiction, allowing a trapped element to be moveed to a desired location.

Abstract: A number of methods and systems for overcoming stiction are provided. The systems include electro-mechanical systems capable of exerting a variety of forces upon areas prone to stiction. The systems can be MEMS arrays or other types of devices where stiction related forces occur. The methods include a variety of ways of causing movement in areas prone to stiction forces. Such movement can be vibrational in nature and is sufficient to overcome stiction, allowing a trapped element to be moveed to a desired location.