Patents by Inventor Robert Nickerson
Robert Nickerson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240030116Abstract: Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra-fine pitch (e.g., a pitch that is greater than or equal to 150 ?m, etc.); (ii) a large die-to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.Type: ApplicationFiled: September 29, 2023Publication date: January 25, 2024Inventors: Debendra MALLIK, Robert L. SANKMAN, Robert NICKERSON, Mitul MODI, Sanka GANESAN, Rajasekaran SWAMINATHAN, Omkar KARHADE, Shawna M. LIFF, Amruthavalli ALUR, Sri Chaitra J. CHAVALI
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Publication number: 20230264805Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: ApplicationFiled: April 25, 2023Publication date: August 24, 2023Inventors: Carlos Thomas Miralles, Robert Nickerson Plumb, Tony Shuo Tao, Nathan Olson
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Publication number: 20230197659Abstract: A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising a second solder material deposited on the solder layer, the second solder material having a second melting temperature that is less than the first melting temperature.Type: ApplicationFiled: December 20, 2021Publication date: June 22, 2023Inventors: Mukund Ayalasomayajula, Dinesh Padmanabhan Ramalekshmi Thanu, Rui Zhang, Xiao Lu, Robert Nickerson, Patrick Neel Stover
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Patent number: 11667373Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: GrantFiled: February 17, 2021Date of Patent: June 6, 2023Assignee: AEROVIRONMENT, INC.Inventors: Carlos Thomas Miralles, Robert Nickerson Plumb, Tony Shuo Tao, Nathan Olson
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Publication number: 20230150649Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: ApplicationFiled: January 12, 2023Publication date: May 18, 2023Inventors: Tony Shuo Tao, Nathan Olson, Carlos Thomas Miralles, Robert Nickerson Plumb
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Publication number: 20230138543Abstract: Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra-fine pitch (e.g., a pitch that is greater than or equal to 150 ?m, etc.); (ii) a large die-to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.Type: ApplicationFiled: December 30, 2022Publication date: May 4, 2023Inventors: Debendra MALLIK, Robert L. SANKMAN, Robert NICKERSON, Mitul MODI, Sanka GANESAN, Rajasekaran SWAMINATHAN, Omkar KARHADE, Shawna M. LIFF, Amruthavalli ALUR, Sri Chaitra J. CHAVALI
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Patent number: 11577818Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: GrantFiled: February 12, 2021Date of Patent: February 14, 2023Assignee: AEROVIRONMENT, INC.Inventors: Tony Shuo Tao, Nathan Olson, Carlos Thomas Miralles, Robert Nickerson Plumb
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Publication number: 20220344247Abstract: Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra-fine pitch (e.g., a pitch that is greater than or equal to 150 ?m, etc.); (ii) a large die-to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.Type: ApplicationFiled: July 11, 2022Publication date: October 27, 2022Inventors: Debendra MALLIK, Robert L. SANKMAN, Robert NICKERSON, Mitul MODI, Sanka GANESAN, Rajasekaran SWAMINATHAN, Omkar KARHADE, Shawna M. LIFF, Amruthavalli ALUR, Sri Chaitra J. CHAVALI
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Patent number: 11462527Abstract: Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.Type: GrantFiled: July 30, 2018Date of Patent: October 4, 2022Assignee: Intel CorporationInventors: Kumar Abhishek Singh, Zhaozhi Li, Thomas J. Debonis, Robert Nickerson, Rees Winters
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Patent number: 11430724Abstract: Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra fine pitch (e.g., a pitch that is greater than or equal to 150 ?m, etc.); (ii) a large die to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.Type: GrantFiled: December 30, 2017Date of Patent: August 30, 2022Assignee: Intel CorporationInventors: Debendra Mallik, Robert L. Sankman, Robert Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan, Omkar Karhade, Shawna M. Liff, Amruthavalli Alur, Sri Chaitra J. Chavali
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Publication number: 20210261234Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: ApplicationFiled: February 12, 2021Publication date: August 26, 2021Inventors: Tony Shuo Tao, Nathan Olson, Carlos Thomas Miralles, Robert Nickerson Plumb
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Publication number: 20210261235Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: ApplicationFiled: February 17, 2021Publication date: August 26, 2021Inventors: Carlos Thomas Miralles, Robert Nickerson Plumb, Tony Shuo Tao, Nathan Olson
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Patent number: 11040766Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: GrantFiled: January 21, 2020Date of Patent: June 22, 2021Assignee: AEROVIRONMENT, INC.Inventors: Tony Shuo Tao, Nathan Olson, Carlos Thomas Miralles, Robert Nickerson Plumb
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Patent number: 10960968Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: GrantFiled: May 15, 2020Date of Patent: March 30, 2021Assignee: AEROVIRONMENT, INC.Inventors: Carlos Thomas Miralles, Robert Nickerson Plumb, Tony Shuo Tao, Nathan Olson
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Patent number: 10953976Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) including: a fuselage; a first pair of airfoils rotatable between a retracted position and a deployed position, the deployed position extending out from the fuselage and the retracted position extending substantially along a first portion on an exterior of the fuselage; a second pair of airfoils rotatable between a second retracted position and a second deployed position, the second deployed position extending out from the fuselage and the second retracted position extending substantially along the first portion on the exterior of the fuselage; and a rudder foldable against the fuselage in a pre-deployment position.Type: GrantFiled: March 2, 2015Date of Patent: March 23, 2021Assignee: AEROVIRONMENT, INC.Inventors: Tony Shuo Tao, Nathan Olson, Carlos Thomas Miralles, Robert Nickerson Plumb
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Patent number: 10796339Abstract: Disclosed are various embodiments for generating a content page with markup language corresponding to user interface widgets. A user interface widget can generate markup language to be incorporated into the content page. The markup language can be analyzed to determine whether it contains a content identifier. The content identifier can be embedded within a portion of a URL. An analysis of the content identifier can be performed to determine whether the content identifier corresponds to expired content.Type: GrantFiled: August 30, 2018Date of Patent: October 6, 2020Assignee: AMAZON TECHNOLOGIES, INC.Inventors: Brandon Ross Ikaika Chang, Adam Lloyd Days, Henry Robert Nickerson, Steven Howard Tarcza, II
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Publication number: 20200307763Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: ApplicationFiled: May 15, 2020Publication date: October 1, 2020Inventors: Carlos Thomas Miralles, Robert Nickerson Plumb, Tony Shuo Tao, Nathan Olson
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Publication number: 20200273784Abstract: Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra fine pitch (e.g., a pitch that is greater than or equal to 150 ?m, etc.); (ii) a large die to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.Type: ApplicationFiled: December 30, 2017Publication date: August 27, 2020Inventors: Debendra MALLIK, Robert L. SANKMAN, Robert NICKERSON, Mitul MODI, Sanka GANESAN, Rajasekaran SWAMINATHAN, Omkar KARHADE, Shawna M. LIFF, Amruthavalli ALUR, Sri Chaitra J. CHAVALI
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Publication number: 20200251462Abstract: An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.Type: ApplicationFiled: November 11, 2019Publication date: August 6, 2020Inventors: Russell Mortensen, Robert Nickerson, Nicholas R. Watts
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Patent number: 10696375Abstract: A system comprising an aerial vehicle or an unmanned aerial vehicle (UAV) configured to control pitch, roll, and/or yaw via airfoils having resiliently mounted trailing edges opposed by fuselage-house deflecting actuator horns. Embodiments include one or more rudder elements which may be rotatably attached and actuated by an effector member disposed within the fuselage housing and extendible in part to engage the one or more rudder elements.Type: GrantFiled: July 10, 2015Date of Patent: June 30, 2020Assignee: AEROVIRONMENT, INC.Inventors: Carlos Thomas Miralles, Robert Nickerson Plumb, Tony Shuo Tao, Nathan Olson