Abstract: A vehicle monitoring device includes a camera or other optical sensor configured to be disposed at a trailing end of a first vehicle system. The camera or other optical sensor is configured to output one or more images or video of a field of view behind the first vehicle system. The monitoring device also includes a controller configured to receive output from one or more sensors and to activate the camera or other optical sensor to output the one or more images or video based on the output from the one or more sensors. The output from the one or more sensors indicates one or more of a change in movement of the first vehicle system, a temperature, an acoustic sound, or movement of a second vehicle system.

Abstract: This disclosure provides recombinant DNA constructs and transgenic plants having enhanced traits such as increased yield, increased nitrogen use efficiency, and enhanced drought tolerance or water use efficiency. Transgenic plants may include field crops as well as plant propagules and progeny of such transgenic plants. Methods of making and using such transgenic plants are also provided. This disclosure also provides methods of producing seed from such transgenic plants, growing such seed, and selecting progeny plants with enhanced traits. Also disclosed are transgenic plants with altered phenotypes which are useful for screening and selecting transgenic events for the desired enhanced trait.

Abstract: Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.

Abstract: A refuse vehicle includes a chassis, an energy storage device supported by the chassis and configured to provide electrical power to a prime mover, wherein activation of the prime mover selectively drives the refuse vehicle, a body for storing refuse therein supported by the chassis, a first hydraulic pump configured to convert electrical power into hydraulic power, a second first hydraulic pump configured to convert electrical power into hydraulic power, and a motor coupled to at least one of the body or the chassis and configured to drive the first hydraulic pump and drive the second hydraulic pump.

Abstract: An electronic device manufacturing system includes a mainframe including a transfer chamber and facets defining side walls of the transfer chamber. The facets include first facet, second facet, third facet, and fourth facet that form the transfer chamber. The first facet has a first number of substrate access ports. The second facet has a second number of substrate access ports. A first substrate access port of the first facet has a first side dimension and a second substrate access port of the second facet has a second side dimension that is different from the first side dimension. The second facet is adjacent to the first facet. The third facet is adjacent to the second facet. The fourth facet has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

Abstract: A semiconductor processing system includes a first component forming a first chamber. A first sealed environment in the first chamber is at a first state prior to a door being opened. A load port structure is disposed between the first component and a second component. The load port structure includes walls disposed around an opening of the load port structure. The load port structure is separate from the first component and the second component. A third component is configured to change at least one of the first state of the first sealed environment within the first chamber or a second state of a second sealed environment within a second chamber formed by the second component to cause the first state and the second state to be substantially similar before the door between the first sealed environment and the second sealed environment is opened.

Abstract: Systems and methods for item acquisition by selection of a virtual object placed in digital environment are disclosed. A processor(s) and memory may be configured to receive a coordinate for placement of a 2D or 3D virtual object in a 3D digital environment, including a digital twin of a real-world location, control the display to display the virtual object when a position corresponding to the received coordinate is within a field of view of the image capture device. The system receives an input via the user interface for selecting virtual objects which are then tracked in both the real-world and 3D digital environment simultaneously. The system enabling the accurate updating and display of all augmented reality and virtual reality content and digital twin data for a seamless blend of both to provide a shared cross-modal experience for all users.

Abstract: A semiconductor processing system includes a first component and a second component. The first component forms a first chamber with a first sealed environment at a first state within the first chamber. The second component is coupled to the first component. The second component forms a second chamber with a second sealed environment at a second state within the second chamber. A third component is to change the first state of the first sealed environment within the first chamber to cause the first state to be substantially similar to the second state of the second sealed environment within the second chamber. The second sealed environment is at the second state prior to changing of the first state of the first sealed environment to be substantially similar to the second state.

Abstract: An electronic device manufacturing system includes a mainframe that includes a first transfer chamber and facets defining first side walls of the first transfer chamber. The facets include a first facet that has a first number of substrate access ports, a second facet that has a second number of substrate access ports, and a third facet that has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

Abstract: Systems and methods for item acquisition by selection of a virtual object placed in digital environment are disclosed. A processor(s) and memory may be configured to receive a coordinate for placement of a virtual object in a digital environment; control the display to display the virtual object when a position corresponding to the received coordinate is within a field of view of the image capture device; receive an input via the user interface for selecting the virtual object; and associate with a user a credit for acquisition of an item associated with the virtual object in response to receipt of the input. Rights created in a virtual goods object are made equal to rights existing in or created in a real-world asset. Ownership of the virtual goods object conveys ownership or other property rights in the real-world asset.

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

Abstract: Systems and methods for item acquisition by selection of a virtual object placed in digital environment are disclosed. According to an aspect, a system may include a display, a user interface, an image capture device, and at least one processor and memory. The processor(s) and memory may be configured to receive a coordinate for placement of a virtual object in a digital environment; control the display to display the virtual object when a position corresponding to the received coordinate is within a field of view of the image capture device; receive an input via the user interface for selecting the virtual object; and associate with a user a credit for acquisition of an item associated with the virtual object in response to receipt of the input.

Abstract: A system and process scans a target area at a distance of 3-30 m for one or more materials. Scanning is performed by a coherent transmit beam aimed with the help of a thermal camera. The active source of the beam is a supercontinuum (SC) laser. The transmitted source beam is modulated by a high-speed Fourier-transform spectrometer prior to interaction with the target. Target reflected source beam is detected by an infrared detector, along with a reference portion of the transmitted source beam, as a series of interferograms; passed through a digitizer for digitizing the interferograms; and processed to producing spectrograms, wherein the spectrograms are indicative of one or more materials on the target.

Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.

Abstract: A system and process scans a target area at a distance of 3-30 m for one or more materials. Scanning is performed by a coherent transmit beam aimed with the help of a thermal camera. The active source of the beam is a supercontinuum (SC) laser. The transmitted source beam is modulated by a high-speed Fourier-transform spectrometer prior to interaction with the target. Target reflected source beam is detected by an infrared detector, along with a reference portion of the transmitted source beam, as a series of interferograms; passed through a digitizer for digitizing the interferograms; and processed to producing spectrograms, wherein the spectrograms are indicative of one or more materials on the target.

Abstract: An electronic device manufacturing system includes a mainframe that includes a first transfer chamber and facets defining first side walls of the first transfer chamber. The facets include a first facet that has a first number of substrate access ports, a second facet that has a second number of substrate access ports, and a third facet that has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

Abstract: A system and process scans a target area at a distance of 3-30 m for one or more materials. Scanning is performed by a coherent transmit beam aimed with the help of a thermal camera. The active source of the beam is a supercontinuum (SC) laser. The transmitted source beam is modulated by a high-speed Fourier-transform spectrometer prior to interaction with the target. Target reflected source beam is detected by an infrared detector, along with a reference portion of the transmitted source beam, as a series of interferograms; passed through a digitizer for digitizing the interferograms; and processed to producing spectrograms, wherein the spectrograms are indicative of one or more materials on the target.

Abstract: A semiconductor processing system includes a first component and a second component. The first component forms a first chamber with a first sealed environment at a first state within the first chamber. The second component is coupled to the first component. The second component forms a second chamber with a second sealed environment at a second state within the second chamber. A third component is to change the first state of the first sealed environment within the first chamber to cause the first state to be substantially similar to the second state of the second sealed environment within the second chamber. The second sealed environment is at the second state prior to changing of the first state of the first sealed environment to be substantially similar to the second state.