Abstract: Megasonic cleaning system for use in cleaning of electronic or other items such as semiconductor wafers or semiconductor substrates in a wafer carrier. Formed piezoelectric transducers are bonded to a tubular envelope at a low temperature and are excited at a first frequency or a second higher frequency for cleaning of items in a cleaning tank. A novel sealing assembly accommodates tubular envelopes of varying diameters.

Abstract: A process for etching oxide films on the semiconductor, or other substrates, in a sealed photochemical reactor. Anhydrous hydrogen fluoride (AHF) gas, or other halogen containing gases, and alcohol vapor carried by an inert gas, such as nitrogen, are passed over the oxides to be etched. The UV radiation shines through a window, which passes the UV radiation onto the oxides while the gases are flowing, and enhances and controls etching of the oxides. The UV window is impervious to the etch process gases. The etch rates are modified, providing for improved oxide etching characteristics.

Abstract: A cluster tool module for dry process cleaning of substrates. A substrate process reactor body assembly includes a gas inlet and gas outlet on opposing sides of a ceramic reactor body. A linear xenon flash lamp in a light bar provides a UV source for uniform distribution over a substrate by use of a light filter. Infrared heating is also provided by a plurality of infrared lamps in the light box. A moisturizer is provided for safe introduction of water vapor into the gas flow.

Abstract: A single substrate high frequency sonic processing module uses a substrate chamber dimensionally sized to the substrate for immersing the substrate in processing solution. Sonic wave permeable membranes form two ends of the substrate chamber along a sonic wave path therethrough. A sonic wave generated by a transducer external to the substrate chamber, travels through sonic wave conducting liquid in contact with the first membrane, external to the substrate chamber. The liquid is shaped by a sonic wave guide of continuously diminishing cross sectional area along the sonic wave path therethrough, thus intensifying and concentrating the sonic wave entering the substrate chamber. The sonic wave passes through the second membrane to a sonic absorbing and dissipating ante chamber. A method for sonic processing of substrates is disclosed. The individual sonic processing modules are combined into a single system for simultaneously processing plural substrates.

Abstract: A fluid dispensing and metering unit is described for dispensing fluids into a system without the introduction of microcontaminants into the fluid flow. This unit includes a block with a fluid conducting duct axially extending from the block's proximal face to the block's distal face. In communication with the fluid conducting duct is a combined dispensing and modulating means for regulating the amount of fluid entering the fluid conducting duct. A plurality of these units can be assembled to construct a flow control manifold, creating a single continuous duct for carrying all dispensed fluids.

Abstract: The rotary fluid coupling decreases the possibility of microcontaminates entering the fluid flow line and is thus especially suitable for processing equipment in manufacturing of wafers and other components for the microcomputer industry. The rotary fluid coupling interconnects a fluid conveying passageway and a spindle element to a duct in a second element such that the two elements are rotatable with respect to each other. An axial channel is provided along the length of the spindle. A planar faced plate is mounted on the spindle. A bore in the spindle plate is in axial alignment with the spindle channel, generally forming a single continuous fluid conveying passageway. A second element has a generally planar distal faced plate. A fluid conducting duct extends from an aperture on the distal face of the second plate to a fluid source with the two faces generally aligned in parallel relationship to each other creating a fluid permeable gap.

Abstract: A cover for a fluid processing chamber is formed of a resilient, heat and chemical resistant laminate of at least three layers. The first layer is a Teflon sheath, the second layer is a blanket heater, and the third layer is a plurality of thin sheets of silicone rubber. The laminate is formed by vacuum formation of the Teflon sheath onto the blanket heater which is supported by the silicone rubber. The opening to the chamber is formed with a rigid lip. The laminate is contained in a stainless steel housing which has an opening therein sized to encompass the perimeter of the chamber lip. Pressure on the cover housing achieves a fluid tight seal with the chamber. No fluid seeps between the cover and the lip even when processing requiring vigorous fluid agitation is carried out in the sealed chamber.

Abstract: A bung connection for a rigid container has a bung body which threads into the bung opening, and has a base wall with two or more access openings which are connected to tubes extending to the flowable material in the container. A tube mounting is removably inserted into the bung body and has flow ports which connect with the access ports in the base wall. Flow tubes connect to the tube mounting. The tube mounting and bung body have a coded pattern of interfitting lugs and recesses which prevent full assembly of the tube mounting and bung body if the coding is wrong. A clamp ring secures the tube mounting in the bung body. A shipping plug and liner replace the tube mounting in the bung body for shipping the container to be refilled and then returned for use again.

Abstract: A fluid flow regulating valve for controlling the flow of a corrosive fluid, the valve including an axially unrestrained movement of the piston in accordance with the fluid flow varies the effective size of a flow control orifice to regulate the fluid flow.