Abstract: A micromechanical yaw rate sensor includes a substrate and a rotationally oscillating mass having a rotationally oscillating mass bearing. The rotationally oscillating mass bearing includes a rocker bar, a rocker spring rod which resiliently connects the rocker bar to the substrate, and two support spring rods which resiliently connect, on opposite sides of the rocker spring rod, the rocker bar to the rotationally oscillating mass.

Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

Abstract: A concept is provided which permits the implementation of MEMS microphone elements having a very good SNR, high microphone sensitivity and a large frequency bandwidth. The microphone structure of the MEMS element is implemented in a layer structure and includes at least one sound pressure-sensitive diaphragm (210), an acoustically permeable counter element (220) and a capacitor system for detecting the diaphragm deflections, the diaphragm (210) and the counter element (220) being situated on top of each other and a distance apart from one another in the layer structure and each bring equipped with at least one electrode of the capacitor system. According to the invention, the layer structure of the diaphragm (210) includes at least one thin closed layer (1) and at least one thick structured layer (2), a grid structure (100) covering the entire diaphragm area being provided in the thick layer (2), which determines the stiffness of the diaphragm (210).

Abstract: A rotation rate sensor for detecting a rotational movement of the rotation rate sensor about a rotational axis extending within a drive plane of the rotation rate sensor include: a first rotational element, a second rotational element and a drive structure moveable in parallel to the drive plane, the first rotational element being drivable about a first center of rotation to achieve a first rotational vibration in parallel to the drive plane, the second rotational element being drivable about a second center of rotation to achieve a second rotational vibration in parallel to the drive plane, the drive structure being (i) coupled to the first and second rotational elements, and (ii) configured to generate a drive mode in phase opposition of the first and second rotational vibrations.

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

Abstract: A rotation-rate sensor having a substrate with main extension plane, for detecting a rotation rate, extending in a direction parallel/orthogonal to the main plane; the sensor including a primary/secondary pair of seismic masses; the primary pair having first/second primary masses; the secondary pair having first/second secondary masses; the first/second primary masses being movable relative to the substrate along a primary deflection direction extending parallel to the main plane; the first/second secondary masses being movable relative to the substrate along a secondary deflection direction extending parallel to the main plane; the first/second primary masses and the first/second primary masses being movable antiparallel or parallel to one another corresponding to the deflection direction, essentially extending orthogonally to the secondary deflection direction; and the primary pair and/or secondary pair being drivable so that, based on sensor rotation, the Coriolis force leads to deflection of the first/sec

Abstract: Measures for reducing parasitic capacitances in the layer structure of capacitive MEMS sensor elements, in which parasitic capacitances between bond pads for electrically contacting measuring capacitor electrodes and an electrically conductive layer lying underneath are reduced by these measures. The sensor structure having the measuring capacitor electrodes and bond pads of such MEMS components are in a layer structure on a semiconductor substrate. The carrier layer directly underneath the bond pad structure is uninterrupted in the bond pad region, and the layer structure includes at least one insulation layer by which at least one of the bond pads is electrically insulated from an electrically conductive layer lying underneath. At least one layer under the carrier layer is structured in the region of this bond pad, so that hollow spaces are situated in the layer structure underneath this bond pad, by which the parasitic capacitance between this bond pad and the conductive layer lying underneath is reduced.

Abstract: A yaw-rate sensor, having a substrate which has a main extension plane, for detecting a yaw rate about a first direction extending either parallel to the main extension plane or perpendicular to the main extension plane. The yaw-rate sensor has a drive device, a first Coriolis mass and a second Coriolis mass, the drive device being configured to drive at least one part of the first Coriolis mass and at least one part of the second Coriolis mass in a direction parallel to a drive direction extending perpendicular to the first direction.

Abstract: A micromechanical sound transducer system and a corresponding manufacturing method, in which the micromechanical sound transducer system includes a substrate having a front side and a back side, the substrate having a through opening extending between the back side and the front side, and a coil configuration on the front side having a coil axis, which runs essentially parallel to the front side, the coil configuration covering the through opening at least partially. Also provided is a magnet device, which is situated so as to allow for an axial magnetic flux to be generated through the coil configuration. The coil configuration has a winding device which has at least first winding sections made from at least one layer of a low-dimensional conductive material, the coil configuration being configured to inductively detect and/or generate sound.

Abstract: A capacitive MEMS microphone element is described which may be used optionally for detecting acoustic signals (microphone mode) or for detecting ultrasound signals in a defined frequency range (ultrasound mode). In the layered structure of the MEMS microphone element, at least two carrier elements for the two electrode sides of a capacitor system are formed one above the other and at a distance from one another for signal detection. At least one of the two carrier elements is sound pressure-sensitive and at least one of the two electrode sides includes at least two electrode segments which are electrically contactable independent of one another, which together with the at least one electrode of the other electrode side form partial capacitances which are independent of one another.

Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

Abstract: A micromechanical sound transducer system and a corresponding manufacturing method, in which the micromechanical sound transducer system includes a substrate having a front side and a back side, the substrate having a through opening extending between the back side and the front side, and a coil configuration on the front side having a coil axis, which runs essentially parallel to the front side, the coil configuration covering the through opening at least partially. Also provided is a magnet device, which is situated so as to allow for an axial magnetic flux to be generated through the coil configuration. The coil configuration has a winding device which has at least first winding sections made from at least one layer of a low-dimensional conductive material, the coil configuration being configured to inductively detect and/or generate sound.

Abstract: A sensor drive includes at least one first seismic mass and an operating apparatus. The operating apparatus is configured to put the first seismic mass into oscillatory motion such that (i) a projection of the oscillatory motion of the first seismic mass onto a first spatial direction is a first harmonic oscillation of the first seismic mass at a first frequency, and (ii) a projection of the oscillatory motion of the first seismic mass onto a second spatial direction oriented at an angle to the first spatial direction is a second harmonic oscillation of the first seismic mass at a second frequency not equal to the first frequency. A method includes operating such a sensor device having at least one seismic mass.

Abstract: The disclosure relates to a micro-electromechanical membrane arrangement with a substrate, which has a multiplicity of recesses on a surface, a first electrically conductive electrode layer, which is arranged on the surface of the substrate and has a multiplicity of first depressions coinciding with the recesses, and an electrically conductive membrane layer, which can be deflected in a direction perpendicular to the active surface of the substrate, is arranged over the first electrode layer and is kept at a distance therefrom by a first distance value.

Abstract: A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

Abstract: Measures for reducing parasitic capacitances in the layer structure of capacitive MEMS sensor elements, in which parasitic capacitances between bond pads for electrically contacting measuring capacitor electrodes and an electrically conductive layer lying underneath are reduced by these measures. The sensor structure having the measuring capacitor electrodes and bond pads of such MEMS components are in a layer structure on a semiconductor substrate. The carrier layer directly underneath the bond pad structure is uninterrupted in the bond pad region, and the layer structure includes at least one insulation layer by which at least one of the bond pads is electrically insulated from an electrically conductive layer lying underneath. At least one layer under the carrier layer is structured in the region of this bond pad, so that hollow spaces are situated in the layer structure underneath this bond pad, by which the parasitic capacitance between this bond pad and the conductive layer lying underneath is reduced.

Abstract: A MEMS component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level.