Abstract: Primers, essentially consisting of a film former or matrix former, an additive, an ionic and/or colloidal noble metal, a filler and a solvent, are suitable for coating substrate surfaces for subsequent chemical metallization.

Abstract: An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods by treating the surfaces with a primer before activation.The materials produced by the process are eminently suitable for the shielding of electromagnetic waves.

Abstract: Polyhydantoins useful in coating materials, films, adhesives and moldings are prepared by reacting polyfunctional .alpha.-aminocarboxylic acids, organic polyiso(thio)cyanates and carboxylic acid compounds in the presence of a condensed aromatic hydrocarbon at a temperature of 0.degree. to 500.degree. C.

Abstract: Polyhydantoins of the type mentioned may be prepared by reacting initially in a first step, bis-glycine esters with between 1 and 2 moles of diisocyanate per mole of bis-glycine ester in a liquid reaction medium, and after forming the polyurea from this bis-glycine ester and the diisocyanate, by further reacting in a second step with an amount of a monoglycine ester equivalent to the residual amount of isocyanate end groups, and finally by carrying out the cyclocondensation to give the polyhydantoin by removing hydroxyl compounds.

Abstract: Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.

Abstract: The invention relates to a process for antistatic treatment or pretreatment for subsequent surface-coating of materials based on polyamides, polyimides or polyamideimides, where the molded articles of the material are treated with a solution of salt mixtures comprising(a) halides of elements of main groups 1 and/or 2 of the periodic system, in particular CaCl.sub.2, MgCl.sub.2, LiCl, NaCl and/or KCl and(b)(1) salts of weak inorganic bases with strong inorganic acids, in particular AlCl.sub.3, FeCl.sub.3, TiCl.sub.4, SbCl.sub.5, CaCl.sub.2, FeCl.sub.2, CuCl.sub.2, ZnCl.sub.2 and/or MoCl.sub.5(2) and/or the chelate complexes of (b1) with Schiff bases, amines, carboxylic acids, diketones, .alpha.,.beta.-unsaturated ketones and phosphines,(c) in a non-corrosive, organic swelling agent or solvent for the materials mentioned, where appropriate with the addition of water, preferably in an alcohol, at temperatures up to the boiling point of the solvents, preferably at temperatures of from -15.degree. C. to +60.

Abstract: Polyhydantoins of the general formula ##STR1## in which X stands for a bivalent aliphatic, aromatic or araliphatic radical,R.sup.1 denotes --CH.sub.2 --, ##STR2## --O--, --SO.sub.2 --, --C(R.sup.5,R.sup.6) R.sup.2 and R.sup.3 are identical or different and stand for hydrogen, C.sub.1 -C.sub.6 -alkyl or together stand for --(CH.sub.2).sub.4 --or --(CH.sub.2).sub.5 --andR.sup.5 and R.sup.6 are identical or different and stand for C.sub.1 -C.sub.6 -alkyl or together stand for --(CH.sub.2).sub.4 --or --(CH.sub.2).sub.5 --,are valuable high temperature-resistant polymers, which have utility in particular as film materials.

Abstract: Flexible circuits are obtained in an elegant manner, without the customary etching methods, wet-chemically in accordance with the principles of semiadditive or fully additive technology by using for the activation noble metal activators and, as base material, films or flexible boards whose surface has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3/ m.sup.2, (b) an average pore diameter of 0.05-5.0 .mu.m and (c) an average pore depth of 0.05-4.0 .mu.m.

Abstract: An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.

Abstract: Polymer membranes metallized by wet chemistry are highly suitable, for example, for the separation of inert, reactive and fermentation gases.The metallization is carried out after activation with noble-metal complex compounds which have at least two functional groups.Preferred metal coatings are those of Cu, Co and Ni.

Abstract: Electrically conductive or antistatic polymers containing charge transfer complexes corresponding to general formula ID A.sub.n (I)wherein D represents an electron donor; A represents an electron acceptor; and n represents an integer of from 1 to 5; wherein the charge transfer complexes are in the form of fibre- or needle-like crystals having a diameter-to-length ratio of from 1:20 to 1:500, preferably from 1:20 to 1:200, and a process for the production of these polymers wherein a solution of the donor or a donor salt in a suitable solvent and a solution of the acceptor or an acceptor salt are successively added in this order or in the reverse order to a monomer, a soluble polymer preliminary stage or a polymer solution and the solid charge transfer complexes thus produced in the polymer or its preliminary stage.

Abstract: A mild and simple process of activating substrate surfaces for the purpose of currentless metallization comprises using organometallic compounds of elements of the groups 1B and 8 of the Periodic System of Elements whose organic moiety has at least one functional group over and above the groups required for binding the metal are used for activation.

Abstract: Electrical printed circuit boards are obtained in an elegant manner without the usual etching methods and without using bonding agent layers in a wet chemical manner on the basis of the principles of the semi or fully additive technique by using precious metal compounds for activation and base material of a type which has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3 /m.sup.2, (b) a mean pore diameter of 0.05-5.0 .mu.m and (c) a mean pore depth of 0.05-4.0 .mu.m.

Abstract: The invention relates to laminates of polyhydantoins.

Abstract: New tris-hydroxyalkyl triazolidine-3,5-diones are obtained by reacting triazolidine-3,5-dioxy with alkylene oxides.

Abstract: Activation baths containing an organometallic compound based on elements of sub-group 1 or 8 of the periodic table with a "guest/host" interrelationship are outstandingly suitable for electroless metallization of preferably non-metallic substrates. Activators of palladium compounds and cyclic crown ethers are particularly suitable.

Abstract: Metallized laminated materials are obtained by coating a solder-resistant core material with a non-conductive polymer film, and subsequent activation and wet-chemical metallization of the polymer film, the activation being carried out, without oxidative pretreatment, on the polymer film before it has hardened completely, and the final hardening only being effected after the metallization. The materials thus metallized are suitable for the production of printed circuits.

Abstract: Black-metallized substrate surfaces which are characterized by the fact that they reflect at most 20% of electromagnetic radiation within the wavelength range from 200 to 5,000 nm and at least 50% within the wavelength range from 7,000 to 24,000 nm, the percentages being relative to the mean value over the entire wavelength range in each case, and which can be used as sunlight collectors are obtained by metallizing activated substrate surfaces without current in metallizing baths which contain a polymeric surface-active compound.

Abstract: The present invention relates to new N,N'-bis-(2,3-epoxypropyl) derivatives of cyclic dicarboxylic acid hydrazides and to a process for their production.

Abstract: For the electroless metallization of base carriers for the manufacture of printed circuit boards, those carrier materials are outstandingly suitable on which complex compounds are built up in which the ligands and the ions to be complexed have entered a "host-guest interrelationship". Examples of such activator compounds are complexes of crown ethers, cryptands and the like. The resulting printed circuit boards are distinguished by the high adhesive strengths of the metals deposited on them.