Abstract: A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.

Abstract: Complex compounds of elements of sub-groups 1 and 8 of the periodic table in oxidation stages 1-4 with unsaturated ketones of the formula ##STR1## wherein R.sub.1 and R.sub.4 denote alkyl, cycloalkyl or aryl andR.sub.2 and R.sub.3 denote hydrogen or alkyl, are outstandingly suitable for activating substrate surfaces for electroless metallization since these complexes are distinguished by a high storage stability. The palladium complexes of but-3-en-2-one and hept-3-en-2-one are preferred.

Abstract: A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl.sub.2, LiCl and/or MgCl.sub.2 with AlCl.sub.3, FeCl.sub.3 and/or TiCl.sub.4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formulaM.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ]in whichM represents two hydrogen or alkali metal atoms or one alkaline earth metal atom,Hal represents a halogen, preferably Cl, andE represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z (z-m=n),or with customary colloidal or ionic systems of these noble metals.

Abstract: The metallization of porous solid bodies, such as, for example, ion exchange materials, by loading the surfaces of the metal-free substrates with transition metal ions and subsequently treating them with reducing agents can be improved by activating the substrates, before or after the loading with metal ions, with elements of group 1 or 8 of the periodic table or compounds thereof and sensitizing any activating ions still present. The metallization products are useful hydrogenation catalysts.

Abstract: A mild activation process for the electroless metallization of polyamide mouldings comprises treating the mouldings with a solution of a mixture of halides of elements of the 1st and 2nd main group of the Periodic Table (for example CaCl.sub.2) with salts of weak inorganic bases and strong inorganic acids (for example AlCl.sub.3) in a swelling agent or solvent for polyamides and with a metal-organic complex compound of elements of the 1st or 8th sub-group of the Periodic Table. The sequence is here immaterial.

Abstract: Use of compounds of the formula ##STR1## in which R.sup.1 designates hydrogen, an organic radical, the bonds R.sup.1 --N being C--N bonds, and, in the case in which m is 1, also acyl,R.sup.2 and R.sup.3 designate hydrogen, an organic radical, the bonds R.sup.2 --N and R.sup.3 --N being C--N bonds, and acyl, andm is an integer equal to the indicated valence of R.sup.1,the compounds of the formula I furthermore containing at least one acyl group, as activators for per compounds, bleaching agents and detergents containing these activators, and new triazolidine-3,5-diones.

Abstract: This invention relates to certain new aliphatic-aromatic polyamidoimides suitable for use as non-clouding electroinsulating lacquers and duroplasts.

Abstract: The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.

Abstract: Black-metallized substrate surfaces which are characterized by the fact that they reflect at most 20% of electromagnetic radiation within the wavelength range from 200 to 5,000 nm and at least 50% within the wavelength range from 7,000 to 24,000 nm, the percentages being relative to the mean value over the entire wavelength range in each case, and which can be used as sunlight collectors are obtained by metallizing activated substrate surfaces without current in metallizing baths which contain a polymeric surface-active compound.

Abstract: Polyamide moulding compositions containing triazolidine-3,5-diones or reaction products thereof as flame retarding agents.

Abstract: This invention relates to a process for the preparation of compounds containing at least one hydantoin ring in the molecule from carbodiimides having acylurea end groups and .alpha.,.beta.-unsaturated carboxylic acid derivatives and to their further reaction with carboxylic acids containing at least one other reactive group.

Abstract: Fumaric acid monoesters can be prepared by introducing a hydroxyl compound at a rate corresponding to the progress of the reaction into a solution or a melt of maleic anhydride, which may optionally be substituted, if appropriate in the presence of a cis-trans catalyst. New fumaric acid monoesters can be formed by the process.

Abstract: Polymer granules having a single particle volume of 0.01 mm.sup.3 to 150 mm.sup.3 and a metal layer of 0.5 to 35% by weight, relative to polymer, can be processed by the customary methods of the plastics industry into shaped articles which have permanent antistatic properties and screen off electromagnetic waves.

Abstract: A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.

Abstract: Increasing the electrical conductivity of conjugated polymers by partial oxidation (doping) with a compound of tetravalent titanium or tetravalent tin.

Abstract: A process for the production of sheet structure, including fibres from plastics solutions containing deped, burr-shaped or fibrous polyacetylene particles, in which process the solution is shaped to form a sheet and the solvent is removed and the sheet structure thus prepared.

Abstract: The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the IB and VIIIB Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallizing without current.

Abstract: The condensation of organic polyisocyanates, lactams, and cyclic polycarboxylic acid anhydrides in the presence of mono- or disubstituted imidazole catalyst results in a polyamide imide having an increased softening temperature.

Abstract: Glycidyl-1,2,4-triazolidine-3,5-diones corresponding to the general formula I ##STR1## wherein R.sup.1 represents a mono- to pentavalent substituted or unsubstituted straight-chain or branched-chain C.sub.1 -C.sub.3 O aliphatic group, a mono- to pentavalent substituted or unsubstituted C.sub.5 -C.sub.21 cycloaliphatic group, a mono- to pentavalent substituted C.sub.7 -C.sub.17 aliphatic-aromatic group or a mono- to pentavalent substituted or unsubstituted C.sub.6 -C.sub.21 aromatic group, the above mentioned aliphatic group being optionally interrupted by one or more oxygen atoms or tertiary nitrogen atoms, and the above mentioned aliphatic-aromatic, polynuclear and cycloaliphatic polynuclear aromatic groups being optionally interrupted by at least one oxygen or tertiary nitrogen atom or by at least one C.sub.1 -C.sub.4 alkylene group or by at least one sulphonyl group ##STR2## R.sup.2 and R.sup.

Abstract: Self-extinguishing thermoplastic polyamide moulding compositions containing barbituric acid and/or reaction products thereof as flameproofing agent.