Patents by Inventor Russell Rapport
Russell Rapport has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6940729Abstract: The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs or with monolithic or stacked leaded packages into modules that conserve PWB or other board surface area. The present invention can be used to advantage with CSP or leaded packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element IC and a support element IC are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two IC elements.Type: GrantFiled: May 2, 2002Date of Patent: September 6, 2005Assignee: Staktek Group L.P.Inventors: James W. Cady, James Wilder, David L. Roper, Russell Rapport, James Douglas Wehrly, Jr., Jeffrey Alan Buchle
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Patent number: 6914324Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard is disposed between the flex circuitry and the IC package over which a portion of the flex circuitry is laid. The form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.Type: GrantFiled: June 3, 2003Date of Patent: July 5, 2005Assignee: Staktek Group L.P.Inventors: Russell Rapport, James W. Cady, James Wilder, David L. Roper, James Douglas Wehrly, Jr., Jeff Buchle
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Publication number: 20050067683Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard is disposed between the flex circuitry and the IC package over which a portion of the flex circuitry is laid. The form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.Type: ApplicationFiled: October 29, 2004Publication date: March 31, 2005Inventors: Russell Rapport, James Cady, James Wilder, David Roper, James Wehrly, Jeff Buchle
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Publication number: 20050062144Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard is disposed between the flex circuitry and the IC package over which a portion of the flex circuitry is laid. The form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.Type: ApplicationFiled: October 12, 2004Publication date: March 24, 2005Inventors: Russell Rapport, James Cady, James Wilder, David Roper, James Wehrly, Jeff Buchle
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Publication number: 20050057911Abstract: The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance. In a preferred embodiment of the memory addressing system, a high speed switching system selects a data line associated with each level of a stacked module to reduce the loading effect upon data signals in memory access.Type: ApplicationFiled: March 19, 2004Publication date: March 17, 2005Inventors: Russell Rapport, James Cady, James Wilder, David Roper, James Wehrly, Jeff Buchle
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Publication number: 20050041403Abstract: The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element CSP integrated circuit and a support element CSP integrated circuit are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two CSP elements. A portion of the flex circuit connected to the support element is folded over the base element to dispose the support element above the base element while reducing the overall footprint. The flex circuit provides a thermal and electrical connection path between the module and an application environment such as a printed wiring board (PWB).Type: ApplicationFiled: October 5, 2004Publication date: February 24, 2005Inventors: James Cady, James Wilder, David Roper, Russell Rapport, James Wehrly, Jeffrey Buchle
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Publication number: 20050041402Abstract: The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element CSP integrated circuit and a support element CSP integrated circuit are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two CSP elements. A portion of the flex circuit connected to the support element is folded over the base element to dispose the support element above the base element while reducing the overall footprint. The flex circuit provides a thermal and electrical connection path between the module and an application environment such as a printed wiring board (PWB).Type: ApplicationFiled: October 5, 2004Publication date: February 24, 2005Inventors: James Cady, James Wilder, David Roper, Russell Rapport, James Wehrly, Jeffrey Buchle
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Publication number: 20050041404Abstract: The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs or with monolithic or stacked leaded packages into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element CSP and a support element CSP are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two CSP elements.Type: ApplicationFiled: October 5, 2004Publication date: February 24, 2005Inventors: James Cady, James Wilder, David Roper, Russell Rapport, James Wehrly, Jeffrey Buchle
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Publication number: 20040245615Abstract: With the use of stacked modules, a system and method for point to point addressing of multiple integrated memory circuits is provided. A single memory expansion board is populated with stacked modules of integrated circuits. The single memory expansion board is located at the terminus of a transmission line, thus, effectively placing at a relative single point in the addressing system, added memory capacity that would otherwise have required multiple memory expansion boards and, consequently, a longer bus. Therefore, signal degradation issues are mitigated and the system has improved tolerance for higher signal speeds with added memory capacity. In a preferred embodiment, a four DIMM socket memory access bus that does not employ stacking is replaced with a single DIMM socket bus that supports stacking up to four high on a single DIMM.Type: ApplicationFiled: July 21, 2003Publication date: December 9, 2004Applicant: Staktek Group, L.P.Inventors: James W. Cady, Russell Rapport, Julian Partridge, James Douglas Wehrly, James Wilder, David L. Roper, Jeff Buchle
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Publication number: 20040197956Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard is disposed between the flex circuitry and the IC package over which a portion of the flex circuitry is laid. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance. In a preferred embodiment, a high speed switching system selects a data line associated with each level of a stacked module to reduce the loading effect upon data signals in memory access. This favorably changes the impedance characteristics exhibited by a DIMM board populated with stacked modules.Type: ApplicationFiled: May 25, 2004Publication date: October 7, 2004Applicant: Staktek Group L.P.Inventors: Russell Rapport, James W. Cady, James Wilder, David L. Roper, James Douglas Wehrly, Jeff Buchle
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Publication number: 20040178496Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard is disposed between the flex circuitry and the IC package over which a portion of the flex circuitry is laid. The form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.Type: ApplicationFiled: March 31, 2004Publication date: September 16, 2004Applicant: Staktek Grop, L.P.Inventors: Russell Rapport, James W. Cady, James Wilder, David L. Roper, James Douglas Wehrly, Jeff Buchle
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Publication number: 20040000708Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard is disposed between the flex circuitry and the IC package over which a portion of the flex circuitry is laid. The form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.Type: ApplicationFiled: June 3, 2003Publication date: January 1, 2004Applicant: Staktek Group, L.P.Inventors: Russell Rapport, James W. Cady, James Wilder, David L. Roper, James Douglas Wehrly, Jeff Buchle
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Publication number: 20030081392Abstract: The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs or with monolithic or stacked leaded packages into modules that conserve PWB or other board surface area. The present invention can be used to advantage with CSP or leaded packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element IC and a support element IC are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two IC elements.Type: ApplicationFiled: May 2, 2002Publication date: May 1, 2003Applicant: Staktek Group, L.P.Inventors: James W. Cady, James Wilder, David L. Roper, Russell Rapport, James Douglas Wehrly, Jeffrey Alan Buchle
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Patent number: 6404662Abstract: The RAMBUS compatible configuration of the present invention is achieved by stacking one of the two modules in the stacked configuration in an upside-down position with respect to the other. This way, the corresponding electrical leads of each memory module will extend on opposite sides of the stacked package and will be securably connected to vertical rails. The vertical rails are electrically and securably connected to the bonding pads which electrically connect to the RAMBUS signal channel. In this embodiment, the electrical leads of one memory module electrically connect to the signal channel at points located on one side of the stacked package and the electrical leads of the other memory module connect to the signal channel at points located on the opposite side of the stacked package. The resulting distance between the points of contact between corresponding leads of each memory module in the stacked package is sufficient to satisfy the requirements of the RAMBUS signal channel.Type: GrantFiled: March 7, 2001Date of Patent: June 11, 2002Assignee: Staktek Group, L.P.Inventors: James W. Cady, Russell Rapport
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Patent number: 6282210Abstract: A clock driver providing a clock signal, from an input clock signal, that has instantaneously selectable phase and methods for synchronizing data transfers in a multi-signal bus communication system. A clock driver of the present invention generates an output clock signal from an input clock signal having a periodic wave form and provides the flexibility for selecting or changing the magnitude of the phase-offset of the output clock signal, in relationship to the input clock signal, for desired clock periods and optionally desired half-clock periods. A method is provided for the self-calibration of critical delay elements. The present invention also includes a method for synchronizing data transfers between a bus master device that is clocked by a system clock and a plurality of synchronous DRAM devices (SDRAM) that are clocked by a local clock; the local clock has, in relationship to the system clock signal, a first phase-offset for read cycles and a second phase-offset for write cycles.Type: GrantFiled: August 12, 1998Date of Patent: August 28, 2001Assignee: Staktek Group L.P.Inventors: Russell Rapport, Jeff Buchle