Patents by Inventor Ryo Tokumaru

Ryo Tokumaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8158517
    Abstract: An object of the present invention is to provide a method for manufacturing a display device by improving the utilization efficiency of materials and simplifying manufacturing process. Another object of the invention is to provide a technique for forming a pattern such as a wiring having a predetermined shape included in a display device with good controllability. A method for manufacturing a wiring substrate of the invention includes the steps of: forming a first region having a subject material; modifying the surface of the subject material partly to form a second region having a boundary with respect to the first region; continuously discharging a composition containing a conductive material to a part of the first region across the boundary and the second region; solidifying the composition to form a conductive layer; and removing the conductive layer formed in a part of the first region across the boundary.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: April 17, 2012
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hiroko Yamamoto, Ryo Tokumaru
  • Publication number: 20120021570
    Abstract: A seed crystal including mixed phase grains having high crystallinity with a low grain density is formed under a first condition, and a microcrystalline semiconductor film is formed over the seed crystal under a second condition which allows the mixed phase grains in the seed crystal to grow to fill a space between the mixed phase grains. In the first condition, the flow rate of hydrogen is 50 times or greater and 1000 times or less that of a deposition gas containing silicon or germanium, and the pressure in a process chamber is greater than 1333 Pa and 13332 Pa or less. In the second condition, the flow rate of hydrogen is 100 times or greater and 2000 times or less that of a deposition gas containing silicon or germanium, and the pressure in the process chamber is 1333 Pa or greater and 13332 Pa or less.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 26, 2012
    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Ryota TAJIMA, Tetsuhiro TANAKA, Takashi OHTSUKI, Ryo TOKUMARU, Yuji EGI, Erika KATO, Miyako MORIKUBO
  • Publication number: 20110053358
    Abstract: An object of one embodiment of the present invention is to provide a technique for manufacturing a dense crystalline semiconductor film (e.g., a microcrystalline semiconductor film) without a cavity between crystal grains. A plasma region is formed between a first electrode and a second electrode by supplying high-frequency power of 60 MHz or less to the first electrode under a condition where a pressure of a reactive gas in a reaction chamber of a plasma CVD apparatus is set to 450 Pa to 13332 Pa, and a distance between the first electrode and the second electrode of the plasma CVD apparatus is set to 1 mm to 20 mm; crystalline deposition precursors are formed in a gas phase including the plasma region; a crystal nucleus of 5 nm to 15 nm is formed by depositing the deposition precursors; and a microcrystalline semiconductor film is formed by growing a crystal from the crystal nucleus.
    Type: Application
    Filed: August 20, 2010
    Publication date: March 3, 2011
    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Satoshi TORIUMI, Ryota TAJIMA, Takashi OHTSUKI, Tetsuhiro TANAKA, Ryo TOKUMARU, Mitsuhiro ICHIJO, Kazutaka KURIKI, Tomokazu YOKOI, Toshiya ENDO, Shunpei YAMAZAKI
  • Publication number: 20110020989
    Abstract: A microcrystalline semiconductor film having a high crystallinity is formed. Further, a thin film transistor having preferable electric characteristics and high reliability and a display device including the thin film transistor are manufactured with high mass productivity. A step in which a deposition gas containing silicon or germanium is introduced at a first flow rate and a step in which the deposition gas containing silicon or germanium is introduced at a second flow rate are repeated while hydrogen is introduced at a fixed rate, so that the hydrogen and the deposition gas containing silicon or germanium are mixed, and a high-frequency power is supplied. Therefore, a microcrystalline semiconductor film is formed over a substrate.
    Type: Application
    Filed: July 16, 2010
    Publication date: January 27, 2011
    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Ryota TAJIMA, Tetsuhiro TANAKA, Ryo TOKUMARU, Hidekazu MIYAIRI, Mitsuhiro ICHIJO, Taichi NOZAWA
  • Patent number: 7777232
    Abstract: A display device having a first light-emitting element, a second light-emitting element, a constant current source, and an amplifier is provided. Each of the first light-emitting element and the second light-emitting element has a first layer including an organic compound and an inorganic compound and a second layer including a light-emitting substance, which are stacked between a pair of electrodes. The first layer is provided over the second layer. Alternatively, the second layer is provided over the first layer.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: August 17, 2010
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masahiko Hayakawa, Shuhei Yoshitomi, Ryo Tokumaru
  • Publication number: 20060228822
    Abstract: A display device having a first light-emitting element, a second light-emitting element, a constant current source, and an amplifier is provided. Each of the first light-emitting element and the second light-emitting element has a first layer including an organic compound and an inorganic compound and a second layer including a light-emitting substance, which are stacked between a pair of electrodes. The first layer is provided over the second layer. Alternatively, the second layer is provided over the first layer.
    Type: Application
    Filed: March 27, 2006
    Publication date: October 12, 2006
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masahiko Hayakawa, Shuhei Yoshitomi, Ryo Tokumaru
  • Publication number: 20050287721
    Abstract: An object of the present invention is to provide a method for manufacturing a display device by improving the utilization efficiency of materials and simplifying manufacturing process. Another object of the invention is to provide a technique for forming a pattern such as a wiring having a predetermined shape included in a display device with good controllability. A method for manufacturing a wiring substrate of the invention includes the steps of: forming a first region having a subject material; modifying the surface of the subject material partly to form a second region having a boundary with respect to the first region; continuously discharging a composition containing a conductive material to a part of the first region across the boundary and the second region; solidifying the composition to form a conductive layer; and removing the conductive layer formed in a part of the first region across the boundary.
    Type: Application
    Filed: June 22, 2005
    Publication date: December 29, 2005
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hiroko Yamamoto, Ryo Tokumaru