Abstract: An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.

Abstract: A substrate with differing dielectric constant materials is provided. The substrate includes a first ground plane, a second ground plane, a first conductive trace, a first material having a first dielectric constant, and a second material having a second dielectric constant. The first material is disposed between the first ground plane and the first conductive trace, and the second material is disposed between the second ground plane and at least part of the first conductive trace. The first dielectric constant is different from the second dielectric constant.

Abstract: A semiconductor device with a hybrid bonded interface having microfluidic channels is provided. The semiconductor device includes a first die comprising a first passivation layer, wherein the first passivation layer includes one or more first trenches, and a second die comprising a second passivation layer, wherein the second passivation layer includes one or more second trenches. The first die is bonded to the second die via hybrid copper-to-copper bonding, wherein the one or more first trenches and the one or more second trenches form one or more channels.

Abstract: An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.

Abstract: Novel tools and techniques are provided for implementing a substrate with an elastomer layer. The substrate might include one or more interconnects and an elastomer layer comprising at least one conductor. In some instances, the at least one conductor of the elastomer layer couples to at least one of the one or more interconnects of the substrate. Additionally, the at least one conductor is configured to couple at least one of the one or more interconnects of the substrate to a circuit board.

Abstract: Novel tools and techniques are provided for implementing edge seal for bonded stacks of different size semiconductor devices. In various embodiments, a semiconductor device is provided that includes a composite structure and a sealant material. The composite structure includes two or more semiconductor devices that form a stacked configuration with one semiconductor device being disposed on or over each of one or more other semiconductor devices (of different size compared with that of the one semiconductor device) and with interface components of the one semiconductor device being bonded with corresponding interface components to each of the one or more other semiconductor devices in the stacked configuration. The sealant material is disposed along one or more surface portions of the composite structure to cover a region including at least portions of side surfaces of the composite structure that extend to cover at least each interface portion between stacked semiconductor devices.

Abstract: Novel tools and techniques are provided for implementing novel semiconductor package interconnection structure(s) between package substrate and PCB. In various embodiments, a semiconductor device comprises: a substrate; a plurality of posts; a plurality of solder anchor portions; and a plurality of solder balls. Each post is coupled at a proximal end to a conductive point on a layer of the substrate, and has a length extending along its axis between its proximal and distal ends and a width orthogonal to the length. Each solder anchor portion is coupled to the distal end of a corresponding post, and has a width that is larger than the width of a distal end of a pillar portion of the corresponding post. Each solder ball is disposed on and around a corresponding solder anchor portion, the solder balls and corresponding posts forming conductive interconnects between corresponding substrate conductive points and corresponding PCB contact points.

Abstract: A semiconductor package with integrated side wall antennas is provided. An apparatus includes two or more die layers that are bonded together, each of the two or more die layers comprising a top surface, bottom surface, and one or more side walls. A first side wall of the one or more side walls includes a first antenna array, the first antenna array comprising a first plurality of antenna array elements formed in at least one of the two or more die layers, wherein the first plurality of antenna array elements is at least partially exposed at the first side wall.

Abstract: Tools and techniques for a semiconductor package providing side wall interconnections are provided. An apparatus includes two or more die layers that are bonded together, the first 3D stacked die package comprising a top surface, bottom surface, and one or more side walls. A first side wall of the one or more side walls includes two or more side wall pads, wherein each side wall pad of the two or more side wall pads is coupled to an interconnect of a respective die layer of the two or more die layers.

Abstract: Novel tools and techniques are provided for implementing mixed dielectric materials for improving signal integrity of integrated electronics packages or semiconductor packages. In various embodiments, a substrate for a semiconductor device includes: a first layer made of a first material; a second layer made of a second material; and a third layer disposed between the first and second layers, and that is made of a third material different from the first and second materials. In some cases, the first, second, and third layers each contains a plurality of gas-filled regions (e.g., but not limited to, an aerogel core of the third layer and/or polymer resin matrix embedded with hollow silica spheres or aerogel spheres of the first and second layers, or the like). Coaxial ground shields around signal lines in the substrate can be used to improve signal integrity. High dielectric constant lossy lines between signal lines can reduce crosstalk.

Abstract: Novel tools and techniques are provided for implementing cantilevered power planes to provide a return current path for high-speed signals. In various embodiments, a semiconductor package includes a substrate core, a plurality of layers, and an AC coupler(s). The plurality of layers includes power, ground, and signal layers each layer disposed on or above the substrate core, each signal layer being disposed between a power layer and a ground layer, the power layer and the ground layer each providing a return path for high frequency (e.g., 1 kHz or greater) signals carried by each signal layer. Each dielectric layer is disposed between and in contact with a pair of power, ground, or signal layer. The AC coupler(s) is coupled to each of a power layer(s) and a ground layer(s), without any portion of any power layer that is near an edge of the substrate core being anchored to the substrate core.

Abstract: An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.

Abstract: An apparatus includes an interposer comprising one or more area array interconnections, the one or more area array interconnections including a first type of area array interconnection and a second type of area array interconnection. The apparatus further includes a first die coupled to the interposer via the first type of area array interconnection, and a second die coupled to the interposer via the second type of area array interconnection, wherein the first type of area array interconnection is different from the second type of area array interconnection.

Abstract: Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly, for implementing a semiconductor package or a chip package including a core or a multilayer core having one or more variable width vias or one or more offset vias. In various embodiments, an apparatus includes a substrate. The substrate includes a core. The core may include one or more vias extending through the core. At least one via of the one or more vias includes a cross-section that varies along a length of the at least one via as the via extends through the core. The cross-section of the via may vary based on at least one of varying a width of the at least one via or offsetting a first portion of the at least one via from a second portion of the at least one via.

Abstract: Embodiments of the present disclosure relate to techniques for providing a remoted application to a client device over a network. Certain embodiments involve receiving, by a web server and from the client device, a request for the remoted application. The request may comprise a tag which identifies one or more attributes of the remoted application. Embodiments further involve launching, by the web server and based on the tag, the remoted application. Embodiments further involve providing, by the web server and to the client device, a video stream of the remoted application. The video stream of the remoted application may comprise one or more images rendered based on raw data of the remoted application. Embodiments further involve receiving, by the web server and from the client device, user input and providing, by the web server and based on the user input, application input to the remoted application.

Abstract: Systems and methods are provided for dynamic GPU-enabled VM provisioning across cloud service providers. An example method can include providing a VM pool that includes a GPU-optimized VM and a non-GPU-optimized VM operating in different clouds. A control plane can receive an indication that a user has submitted a machine-learning workload request, determine whether a GPU-optimized VM is available and instruct the non-GPU-optimized VM to send the workload to the GPU-optimized VM in a peer-to-peer manner. The GPU-optimized VM computes the workload and returns a result to the requesting VM. The control plane can instantiate a new GPU-optimized VM (or terminate it when the workload is complete) to dynamically maintain a desired number of available GPU-optimized VMs.

Abstract: It is described a interconnect array device (e.g., Ball Grid Array (BGA) device) comprising (a) a substrate having a substrate body and a main surface; (b) an array of solder connection elements formed at the main surface; and (c) a support structure formed at the main surface. The support structure is configured for maintaining, during a soldering process, a predefined spacing between the main surface of the substrate and a further main surface of a component carrier onto which the Ball Grid Array is mounted. The support structure comprises at least one support element. Further described is an electronic package with such a Ball Grid Array device and a method for manufacturing an electronic assembly comprising such an electronic package mounted on a component carrier.

Abstract: A system and method are described for performing authentication on a computing device using a mobile device connected over an audio channel to the computing device, in scenarios where smart card authentication may have been traditionally used. An application executing on the computing device receives a request from a user, which request requires authentication of the user before being allowed by the application. An audio transmission containing encoded data including information authenticating the user is received at the computing device from the user's mobile device via a microphone. The audio transmission is decoded and the information authenticating the user is extracted. The information authenticating the user is verified and the request is allowed in the application.

Abstract: A multichannel connector assembly includes a plug connector comprising an insulation body, a plurality of conductive terminals, and a shield housing enclosing outside the insulation body, and a socket connector comprising an insulation base, a plurality of docking terminals housed in the insulation base, and a shell enclosing outside the insulation base. The shell includes an inter-buckling portion elastically deformable and provided with an inter-buckling protruding portion and an inter-contacting protruding portion. The inter-buckling protruding portion is capable of engaging with an opposite connector, and the inter-contacting protruding portion is capable of forming a grounded potential connection to the opposite connector by elastically deforming. A ring side portion provided by the shield housing, the base portion and the side end portions provided by the insolation body encircle to form a cut-off region where the conductive terminal soldering portion is arranged.

Abstract: One or more VPN tunnels are established in a site-to-site configuration. A VPN transition subnet is defined and associated with each VPN tunnel. Once the VPN tunnel(s) and the LAN(s) have been configured, a per-application VPN policy can be specified for any applications that require site-to-site VPN access. Whenever a new application is launched, a container is created for executing the VM. The VPN management system reads the VPN policy to determine whether the application is permitted to access any VPN tunnels. If the application is permitted to access a VPN tunnel, a vNIC is generated on the VM for the container of the application and/or a new IP address on the vNIC is assigned to the container. The new IP address and/or the new vNIC are then added to the VPN transition subnet associated with the VPN tunnel to enable the application to access the VPN tunnel.