Abstract: A multichannel connector assembly includes a plug connector comprising an insulation body, a plurality of conductive terminals, and a shield housing enclosing outside the insulation body, and a socket connector comprising an insulation base, a plurality of docking terminals housed in the insulation base, and a shell enclosing outside the insulation base. The shell includes an inter-buckling portion elastically deformable and provided with an inter-buckling protruding portion and an inter-contacting protruding portion. The inter-buckling protruding portion is capable of engaging with an opposite connector, and the inter-contacting protruding portion is capable of forming a grounded potential connection to the opposite connector by elastically deforming. A ring side portion provided by the shield housing, the base portion and the side end portions provided by the insolation body encircle to form a cut-off region where the conductive terminal soldering portion is arranged.

Abstract: A system and method are described for performing authentication on a computing device using a mobile device connected over an audio channel to the computing device, in scenarios where smart card authentication may have been traditionally used. An application executing on the computing device receives a request from a user, which request requires authentication of the user before being allowed by the application. An audio transmission containing encoded data including information authenticating the user is received at the computing device from the user's mobile device via a microphone. The audio transmission is decoded and the information authenticating the user is extracted. The information authenticating the user is verified and the request is allowed in the application.

Abstract: A VPN tunnel policy is defined on a per-application basis. The VPN tunnel policy may specify that a particular application is permitted to transmit data on a specific VPN tunnel. Subsequently, the specified application is delivered to one or more virtual machines and an application tunnel manager creates a new virtual network interface card (NIC) on the VM, corresponding to the delivered application. The newly created virtual NIC is attached to a specified subnet. The subnet may be a VPN transition network with a connection to a VPN gateway device. The subnet may have been previously defined or generated at the time of assigning the application to the VPN tunnel. Once the virtual NIC has been created on the VM, an OS script is executed to force the delivered application to use the newly created virtual NIC and to prevent users from changing the application and virtual NIC linkage.

Abstract: Embodiments of the present disclosure relate to techniques for providing a remoted application to a client device over a network. Certain embodiments involve receiving, by a web server and from the client device, a request for the remoted application. The request may comprise a tag which identifies one or more attributes of the remoted application. Embodiments further involve launching, by the web server and based on the tag, the remoted application. Embodiments further involve providing, by the web server and to the client device, a video stream of the remoted application. The video stream of the remoted application may comprise one or more images rendered based on raw data of the remoted application. Embodiments further involve receiving, by the web server and from the client device, user input and providing, by the web server and based on the user input, application input to the remoted application.

Abstract: One or more VPN tunnels are established in a site-to-site configuration. A VPN transition subnet is defined and associated with each VPN tunnel. Once the VPN tunnel(s) and the LAN(s) have been configured, a per-application VPN policy can be specified for any applications that require site-to-site VPN access. Whenever a new application is launched, a container is created for executing the VM. The VPN management system reads the VPN policy to determine whether the application is permitted to access any VPN tunnels. If the application is permitted to access a VPN tunnel, a vNIC is generated on the VM for the container of the application and/or a new IP address on the vNIC is assigned to the container. The new IP address and/or the new vNIC are then added to the VPN transition subnet associated with the VPN tunnel to enable the application to access the VPN tunnel.

Abstract: A VPN tunnel policy is defined on a per-application basis. The VPN tunnel policy may specify that a particular application is permitted to transmit data on a specific VPN tunnel. Subsequently, the specified application is delivered to one or more virtual machines and an application tunnel manager creates a new virtual network interface card (NIC) on the VM, corresponding to the delivered application. The newly created virtual NIC is attached to a specified subnet. The subnet may be a VPN transition network with a connection to a VPN gateway device. The subnet may have been previously defined or generated at the time of assigning the application to the VPN tunnel. Once the virtual NIC has been created on the VM, an OS script is executed to force the delivered application to use the newly created virtual NIC and to prevent users from changing the application and virtual NIC linkage.

Abstract: Disclosed herein are systems, apparatuses, and methods for locating wireless-enabled components, and applications thereof. Such an apparatus includes a wireless-enabled component (WEC), which may be a functional block of an integrated circuit (IC), an IC, or a device that includes an IC. The WEC includes a functional module (e.g., a processing resource or a memory resource) and an antenna element coupled to the functional module. The antenna element is configured to (i) transmit a search signal to locate a proximally situated WEC and (ii) transmit a communication signal to communicate with the proximally situated WEC. The antenna element may be a phased array, an electrically steered phased array, a mechanically steered phased array, a directional antenna, a mechanically steered directional antenna, an RF antenna, an optical antenna, and/or any combination thereof.

Abstract: A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more walls at least partially laterally surround the flip chip die and/or the substrate. The walls can completely laterally surround the flip chip die to define a cavity in the heat spreader. The flip chip package can further include an encapsulate. For example, the encapsulate can be injected between the one or more walls of the heat spreader and the flip chip die and/or other components of the flip chip package. The encapsulate and/or the one or more walls of the heat spreader can protect one or more components of the flip chip package against moisture, corrosives, heat, or radiation, to provide some examples.

Abstract: Methods and apparatus for improved thermal performance and electromagnetic interference (EMT) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a heat spreader cap defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. A planar rim portion of the cap that surrounds the cavity is coupled to the leadframe. The cap and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Abstract: Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a heat spreader cap defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. A planar rim portion of the cap that surrounds the cavity is coupled to the leadframe. The cap and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Abstract: An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface.

Abstract: Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to conform to surfaces of the integrated circuit package and/or heat sink, prior to hardening, such as by curing the adhesive material.

Abstract: Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. A substrate has a surface, wherein the surface has an opening therein. A stiffener has a surface coupled to the surface of the substrate. An area of the surface of the stiffener can be greater than, equal to, or less than an area of the surface of the substrate. A thermal connector is coupled to the surface of the stiffener through the opening. A surface of the thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. The thermal connector can have a height such that the thermal connector extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. Alternatively, the stiffener and thermal connector may be combined into a single piece stiffener, wherein the stiffener has a protruding portion.

Abstract: A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The flip chip package can further include an encapsulate. The encapsulate can protect the flip chip die and/or other components of the flip chip package from the environment. The heat spreader can include one or more recessed edge portions to facilitate injection of the encapsulate into the flip chip package.

Abstract: A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more walls at least partially laterally surround the flip chip die and/or the substrate. The walls can completely laterally surround the flip chip die to define a cavity in the heat spreader. The flip chip package can further include an encapsulate. For example, the encapsulate can be injected between the one or more walls of the heat spreader and the flip chip die and/or other components of the flip chip package. The encapsulate and/or the one or more walls of the heat spreader can protect one or more components of the flip chip package against moisture, corrosives, heat, or radiation, to provide some examples.

Abstract: A cavity or die down ball grid array package includes an interposer substrate structure attached to the die. In an example, the interposer substrate reduces the interconnect length from a board to which the package mounts to power and ground pads on a top layer of the semiconductor or integrated circuit (IC) die. In this example, the interposer substrate also removes the requirement that power and ground pads be located on a periphery of the die. Power and ground pads can be located in an interior region on a top metal layer where they can be interconnected to the interposer substrate using electrically conductive bumps or wire bond(s).

Abstract: An apparatus and method for enhancing thermal performance and electromagnetic interference (EMI) shielding in die-up array integrated circuit (IC) device packages is presented. A die-up array package includes an IC die mounted to a first stiffener surface. The package further includes a cap body having first and second surfaces. A first portion of the second surface has a cavity formed therein, and a planar second portion of the second surface is coupled to the first stiffener surface. The package further includes a substrate having a first surface coupled to a second stiffener surface. A plurality of contact pads on the first substrate surface are electrically connected to an array of electrically conductive terminals on a second substrate surface. The stiffener and cap body form a die enclosure that dissipates heat during operation of the IC die, and shields EMI emanating from and radiating toward the IC die.

Abstract: A die-up array integrated circuit (IC) device package and method of making the same is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first and second surfaces. The second frame body surface is mounted to a first stiffener surface. An IC die is mounted to the first stiffener surface within the central opening through the frame body. A planar lid has opposing first and second surfaces. The second lid surface is coupled to the first frame body surface. A first substrate surface is coupled to a second stiffener surface. An array of electrically conductive terminals is coupled to a second substrate surface. The stiffener, frame body, and lid form an enclosure structure substantially enclosing the IC die. The die enclosure spreads heat from the IC die, and shields EMI emanating from and radiating toward the IC die.

Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.

Abstract: Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. An IC die is mounted in a centrally located cavity of a substantially planar first surface of a stiffener. The first surface of a substrate is attached to a substantially planar second surface of the stiffener. The second surface of the stiffener is opposed to the first surface of the stiffener. A centrally located protruding portion on the second surface of the stiffener is opposed to the centrally located cavity. The protruding portion extends through an opening in the substrate. A wire bond is coupled from a bond pad of the IC die to a contact pad on the first surface of the substrate through a through-pattern in the stiffener. The through-pattern in the stiffener is one of an opening through the stiffener, a recessed portion in an edge of the stiffener, a notch in an edge of the recessed portion, and a notch in an edge of the opening.