Patents by Inventor Sang-Hwan Kim

Sang-Hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11512152
    Abstract: A method of preparing an acrylic adhesive, in which the durability of an adhesive film may be improved through additional photocuring and the residual components according to solution photopolymerization are efficiently removed, and an adhesive film prepared therefrom.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: November 29, 2022
    Inventors: Jun Man Choi, Sang Hwan Kim, Jang Soon Kim, Kwang Su Seo, Won Gu Choi, Chi Gwan An
  • Patent number: 11482261
    Abstract: A memory device, and a method of operating the same, includes a plurality of pages, a peripheral circuit, and control logic. The peripheral circuit is configured to receive a command, an address, and data from an external controller to program a page selected from among the plurality of pages, and to generate internal input data depending on an input mode for the command, the address, and the data. The control logic is configured to determine whether internal input data is to be generated based on the data depending on the input mode and to control the peripheral circuit so that a program operation of programming the internal input data is performed.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: October 25, 2022
    Assignee: SK hynix Inc.
    Inventor: Sang Hwan Kim
  • Patent number: 11476502
    Abstract: Disclosed herein are electrolyte compositions comprising: a) a first solvent comprising a cyclic carbonate; b) a second solvent comprising a non-fluorinated acyclic carbonate; c) at least one electrolyte component selected from: i) a fluorinated acyclic carboxylic acid ester; ii) a fluorinated acyclic carbonate; iii) a fluorinated acyclic ether; or iv) a mixture thereof; and d) an electrolyte salt; wherein the electrolyte component is present in the electrolyte composition in the range of from about 0.05 weight percent to about 10 weight percent, based on the total weight of the first and second solvents.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: October 18, 2022
    Assignee: Solvay SA
    Inventors: Stephen E. Burkhardt, Jun J. Liu, Sang-Hwan Kim, Kostantinos Kourtakis
  • Patent number: 11466178
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Eun Yeong Kim, Sera Kim, Kwang Joo Lee, Sang Hwan Kim, Sung Chan Park, Mi Seon Yoon
  • Publication number: 20220275260
    Abstract: The present disclosure provides a surface protective film which is used in a process of fabricating an encapsulation layer for an organic light-emitting diode, and makes it possible to prevent bubbles from being generated in the protective film or the surface smoothness of the protective film from being degraded, due to solvent volatilization from the protective film. Specifically, the present disclosure provides a surface protective film including an adhesive layer provided on one surface of a substrate layer, wherein the adhesive layer includes a cured product of an adhesive composition including: a urethane-based resin having a photoreactive group at the end or side chain thereof; a monofunctional (meth)acrylate monomer; a crosslinking agent having two or more photoreactive groups at the end thereof; a photoinitiator; and a photoreactive siloxane additive, the adhesive composition being solvent-free.
    Type: Application
    Filed: November 20, 2020
    Publication date: September 1, 2022
    Inventors: So Jin Kim, Hyun Cheol Kim, Jeong Min Choi, Sang Hwan Kim, Kwang Su Seo
  • Patent number: 11424153
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 23, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Seon Yoon, Sera Kim, Kwang Joo Lee, Bora Yeon, Sang Hwan Kim, Eun Yeong Kim
  • Patent number: 11373722
    Abstract: A memory device includes a first pad, a second pad, and a double data rate (DDR) test controller. The first pad may receive a write enable signal. The second pad may receive a data strobe signal. The DDR test controller is connected to the first pad and the second pad and outputs an internal write enable signal and an internal data strobe signal. The DDR test controller generates the internal data strobe signal based on the write enable signal received through the first pad, in at least a portion of a DDR test operation of the memory device.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: June 28, 2022
    Assignee: SK hynix Inc.
    Inventor: Sang Hwan Kim
  • Patent number: 11339288
    Abstract: A photocurable composition is provided. The photocurable composition includes: a urethane acrylamide oligomer derived from a first urethane prepolymer having an isocyanate end group and a polar group-containing acrylamide; a urethane acrylate oligomer derived from a second urethane prepolymer having an isocyanate end group and a polar group-containing (meth)acrylate; and an amide group-containing acrylic polymer derived from acrylamide and a polar group-containing (meth)acrylate.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: May 24, 2022
    Inventors: Sang Hwan Kim, Sle Lee, Jang Soon Kim, Kwang Su Seo
  • Publication number: 20220130436
    Abstract: A memory device, and a method of operating the same, includes a plurality of pages, a peripheral circuit, and control logic. The peripheral circuit is configured to receive a command, an address, and data from an external controller to program a page selected from among the plurality of pages, and to generate internal input data depending on an input mode for the command, the address, and the data. The control logic is configured to determine whether internal input data is to be generated based on the data depending on the input mode and to control the peripheral circuit so that a program operation of programming the internal input data is performed.
    Type: Application
    Filed: April 28, 2021
    Publication date: April 28, 2022
    Applicant: SK hynix Inc.
    Inventor: Sang Hwan KIM
  • Patent number: 11299624
    Abstract: A thermoplastic polyurethane film including a cured product of a polyurethane resin composition is provided. The polyurethane resin composition includes a polyurethane resin, a first isocyanate-based curing agent, and an organic solvent. The thermoplastic polyurethane film has a tensile strength break of 50 MPa to 80 MPa. A method for preparing the thermoplastic polyurethane film is also provided.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: April 12, 2022
    Inventors: Sang Yool Lee, Joo Hee Hong, Se Jung Park, Sang Hwan Kim, Jang Soon Kim
  • Patent number: 11261353
    Abstract: The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: March 1, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Seung-Won Lee, Eun-Kyung Park, Won-Gu Choi, Jang-Soon Kim, Sang-Hwan Kim, Tae-Yi Choi
  • Patent number: 11239104
    Abstract: A chip ejecting apparatus includes a table configured to be provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape, an ejector unit including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape, and a control unit configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes. The active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: February 1, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Ryoung Lee, Sang Hwan Kim, Min Sung Kim
  • Publication number: 20220013188
    Abstract: A memory device includes a first pad, a second pad, and a double data rate (DDR) test controller. The first pad may receive a write enable signal. The second pad may receive a data strobe signal. The DDR test controller is connected to the first pad and the second pad and outputs an internal write enable signal and an internal data strobe signal. The DDR test controller generates the internal data strobe signal based on the write enable signal received through the first pad, in at least a portion of a DDR test operation of the memory device.
    Type: Application
    Filed: January 14, 2021
    Publication date: January 13, 2022
    Applicant: SK hynix Inc.
    Inventor: Sang Hwan KIM
  • Publication number: 20210339109
    Abstract: The present invention forms meshes between intersections of synthetic fiber cords while the synthetic fiber cords having a form in which a plurality of synthetic fiber filaments are plied and twisted is crossed in a knotless type, wherein a diameter (d) of the synthetic fiber cord satisfies the Equation (I), a maximum distance (DI) between the intersections adjacent to each other satisfies the Equation (II), and a minimum distance (D2) between the intersections adjacent to each other satisfies the Equation (III). Since the present invention is made lightweight with a lower areal density than a conventional protective net for sports and increases rate of hole size with a small diameter of the synthetic fiber cord constituting the protective net, the present invention improves resistance against wind during manufacture of a protective net structure, and has excellent mechanical properties and thus provides excellent resistance against impact applied when a ball flies and bumps.
    Type: Application
    Filed: December 18, 2019
    Publication date: November 4, 2021
    Inventor: Sang Hwan KIM
  • Patent number: 11161929
    Abstract: A thermoplastic polyurethane film including a cured product of a polyurethane resin composition is provided. The polyurethane resin composition includes a polyurethane resin, a first isocyanate-based curing agent, and an organic solvent. The thermoplastic polyurethane film has a tensile strength of 0.2 MPa to 1.5 MPa at an initial elongation of 5% to 10%. A method for preparing the thermoplastic polyurethane film is also provided.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: November 2, 2021
    Inventors: Sang Yool Lee, Joo Hee Hong, Se Jung Park, Sang Hwan Kim, Jang Soon Kim
  • Publication number: 20210214591
    Abstract: A substrate-free adhesive tape which is easily applied to a continuous process due to an excellent adhesive strength and a short fracture distance is provided. An adhesive composition for making the substrate-free adhesive tape is also provided.
    Type: Application
    Filed: July 11, 2019
    Publication date: July 15, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Sang Hwan Kim, Ki Seung Seo, Ji Hye Kim, Kyung Jun Yoon, Kwang Su Seo
  • Publication number: 20210035847
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Application
    Filed: June 4, 2019
    Publication date: February 4, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Mi Seon YOON, Sera KIM, Kwang Joo LEE, Bora YEON, Sang Hwan KIM, Eun Yeong KIM
  • Patent number: 10902898
    Abstract: A semiconductor memory device includes a memory cell array, a buffer unit, control logic, and a decoding circuit. The memory cell array includes a plurality of memory cells. The buffer coupled to the memory cell array, and includes a first memory area, a second memory area, and a conversion memory area. The control logic outputs a mode control signal representing an operating mode of the buffer. The decoding circuit controls the operating mode of the buffer such that the conversion memory area operates as any one of a main memory area and a repair memory area, based on the mode control signal.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: January 26, 2021
    Assignee: SK hynix Inc.
    Inventor: Sang Hwan Kim
  • Publication number: 20210002524
    Abstract: A substrate-free adhesive tape that is excellent in adhesive physical properties and is suitable for a continuous process is provided. The substrate-free adhesive tape includes a release film, and an adhesive layer provided on one surface of the release film and the adhesive layer containing a cured product of an adhesive composition, wherein when the release film is fixed on the outer surface of a semicircular tip part of a jig, the semicircular tip part having a radius of 22.5 mm, a breaking distance of the adhesive layer is 110 mm or less when the adhesive layer is stretched at a rate of 20 m/min from a semicircular center of the semicircular tip part toward an outermost direction of the semicircular tip part.
    Type: Application
    Filed: August 6, 2019
    Publication date: January 7, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Ki Seung Seo, Ji Hye Kim, Sang Hwan Kim, Jun Hyoung Park, Kyung Jun Yoon
  • Publication number: 20210002518
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Application
    Filed: March 7, 2019
    Publication date: January 7, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Eun Yeong KIM, Sera KIM, Kwang Joo LEE, Sang Hwan KIM, Sung Chan PARK, Mi Seon YOON