Abstract: A photocurable composition is provided. The photocurable composition includes: a urethane acrylamide oligomer derived from a first urethane prepolymer having an isocyanate end group and a polar group-containing acrylamide; a urethane acrylate oligomer derived from a second urethane prepolymer having an isocyanate end group and a polar group-containing (meth)acrylate; and an amide group-containing acrylic polymer derived from acrylamide and a polar group-containing (meth)acrylate.

Abstract: The present disclosure relates to a memory device and a memory system having the same. The memory device includes page buffers arranged in a first direction and a second direction perpendicular to the first direction, a first storage group and a second storage group arranged adjacent to the page buffers in the second direction, and a switch circuit arranged between the first storage group and the second storage group and selectively coupling the first storage group and the second storage group to data lines according to a number of page buffers and a number of first and second storage groups.

Abstract: A chip ejecting apparatus includes a table configured to be provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape, an ejector unit including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape, and a control unit configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes. The active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.

Abstract: A fire resistant cable comprising a conductor and a sheath surrounding the conductor, the cable is characterized in further comprising: a bedding filler arranged between the conductor and the sheath and made of materials providing fire resistance; and, a tunnel filler arranged between the conductor and the sheath in the longitudinal direction of the cable, and having a melting point lower than the combustion point of the bedding filler.

Abstract: Described are electrolyte compositions comprising a fluorinated solvent, an organic carbonate, a sultone, and optionally a borate. The fluorinated solvent may be a fluorinated acyclic carboxylic acid ester, a fluorinated acyclic carbonate, a fluorinated acyclic ether, or mixtures thereof. The organic carbonate may be fluorinated or non-fluorinated. The electrolyte compositions are useful in electrochemical cells, such as lithium ion batteries.

Abstract: The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.

Abstract: A semiconductor memory device includes a memory cell array, a buffer unit, control logic, and a decoding circuit. The memory cell array includes a plurality of memory cells. The buffer coupled to the memory cell array, and includes a first memory area, a second memory area, and a conversion memory area. The control logic outputs a mode control signal representing an operating mode of the buffer. The decoding circuit controls the operating mode of the buffer such that the conversion memory area operates as any one of a main memory area and a repair memory area, based on the mode control signal.

Abstract: A thermoplastic polyurethane film including a cured product of a polyurethane resin composition is provided. The polyurethane resin composition includes a polyurethane resin, a first isocyanate-based curing agent, and an organic solvent. The thermoplastic polyurethane film has a tensile strength of 0.2 MPa to 1.5 MPa at an initial elongation of 5% to 10%. A method for preparing the thermoplastic polyurethane film is also provided.

Abstract: The present disclosure relates to a memory device and a memory system having the same. The memory device includes page buffers arranged in a first direction and a second direction perpendicular to the first direction, a first storage group and a second storage group arranged adjacent to the page buffers in the second direction, and a switch circuit arranged between the first storage group and the second storage group and selectively coupling the first storage group and the second storage group to data lines according to a number of page buffers and a number of first and second storage groups.

Abstract: A method for preparing a thermoplastic polyurethane film having a large thickness and excellent durability, and a thermoplastic polyurethane film prepared thereby are provided.

Abstract: A thermoplastic polyurethane film including a cured product of a polyurethane resin compositon is provided. The polyurethane resin compostion includes a polyurethane resin, a first isocyanate-based curing agent, and an organic solvent. The thermoplastic polyurethane film has a tensile strength break of 50 MPa to 80 MPa. A method for preparing the thermoplastic polyurethane film is also provided.

Abstract: A method of preparing an acrylic adhesive, in which the durability of an adhesive film may be improved through additional photocuring and the residual components according to solution photopolymerization are efficiently removed, and an adhesive film prepared therefrom.

Abstract: The present invention provides an optical adhesive sheet including a layered structure of a first adhesive layer and a second adhesive layer, in which the first adhesive layer has a glass transition temperature of ?50° C. to ?30° C. and a modulus of 0.3×105 Pa to about 0.6×105 Pa, and the second adhesive layer has a glass transition temperature of ?20° C. to ?10° C. and a modulus of 0.7×105 Pa to 1.0×105 Pa.

Abstract: Provided are an adhesive bonding composition for optical use and a multistage curing method thereof, the composition including a methacrylate-based monomer and an acrylate-based monomer, in which a weight ratio of the methacrylate-based monomer to the acrylate-based monomer ranges from about 1:1 to about 1:10.

Abstract: Disclosed herein are electrolyte compositions comprising: a) a first solvent comprising a cyclic carbonate; b) a second solvent comprising a non-fluorinated acyclic carbonate; c) at least one electrolyte component selected from: i) a fluorinated acyclic carboxylic acid ester; ii) a fluorinated acyclic carbonate; iii) a fluorinated acyclic ether; or iv) a mixture thereof; and d) an electrolyte salt; wherein the electrolyte component is present in the electrolyte composition in the range of from about 0.05 weight percent to about 10 weight percent, based on the total weight of the first and second solvents.

Abstract: A fire resistant cable comprising a conductor and a sheath surrounding the conductor, the cable is characterized in further comprising: a bedding filler arranged between the conductor and the sheath and made of materials providing fire resistance; and, a tunnel filler arranged between the conductor and the sheath in the longitudinal direction of the cable, and having a melting point lower than the combustion point of the bedding filler.

Abstract: Provided is an adhesive composition including: a (meth)acrylic acid ester-based photo-curable resin; and an oxygen-free di-functional diene-based rubber hardener.

Abstract: The present invention relates to an auditory information security system and, more specifically, to an auditory information security system for preventing illegal leakage of auditory information by transmitting security signals, which are unspecified noise signals within a preset frequency band among frequency bands that the human ear cannot hear, and then, preventing the auditory information, including voices and sounds occurring in a specific area where wiretapping or recording is expected, from being collected by a wiretap or recorder.

Abstract: A semiconductor package includes a package substrate and semiconductor chips stacked on the package substrate. The package substrate may include at least one first chip enablement finger, at least one second chip enablement finger, and a chip enablement pad selection finger. Each of the semiconductor chips includes a first chip enablement pad connected to the at least one first chip enablement finger, a second chip enablement pad connected to the at least one second chip enablement finger, and a chip enablement pad selection pad connected to the chip enablement pad selection finger. The first chip enablement pads of the semiconductor chips or the second chip enablement pads of the semiconductor chips are optionally activated by a signal applied to the chip enablement pad selection finger.

Abstract: The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.