Abstract: A method for fabricating a semiconductor device includes forming an etching target layer over a substrate including a first region and a second region; forming a hard mask layer over the etching target layer; forming a first etch mask over the hard mask layer, wherein the first etch mask includes a plurality of line patterns and a sacrificial spacer layer formed over the line patterns; forming a second etch mask over the first etch mask, wherein the second etch mask includes a mesh type pattern and a blocking pattern covering the second region; removing the sacrificial spacer layer; forming hard mask layer patterns having a plurality of holes by etching the hard mask layer using the second etch mask and the first etch mask; and forming a plurality of hole patterns in the first region by etching the etching target layer using the hard mask layer patterns.

Abstract: A method for fabricating a semiconductor device includes forming a first dielectric structure over a second region of a substrate to expose a first region of the substrate, forming a barrier layer over an entire surface including the first dielectric structure, forming a second dielectric structure over the barrier layer in the first region, forming first open parts and second open parts in the first region and the second region, respectively, by etching the second dielectric structure, the barrier layer and the first dielectric structure, forming first conductive patterns filled in the first open parts and second conductive patterns filled in the second open parts, forming a protective layer to cover the second region, and removing the second dielectric structure.

Abstract: A method for fabricating a semiconductor device is provided, the method includes forming a double trench including a first trench and a second trench formed below the first trench and having surfaces covered with insulation layers, and removing portions of the insulation layers to form a side contact exposing one sidewall of the second trench.

Abstract: In one embodiment of the invention, a method for a charge pump is disclosed. The method includes biasing a plurality of transistors; switching a pair of main transistor switches to apply or remove a net charge on an output terminal though the biased transistors; and turning on auxiliary transistor switches when the main transistor switches are turned off. The auxiliary transistor switches when turned on provide an auxiliary equalizing path to nodes between the main transistor switches and the biased transistors. The auxiliary equalizing path equalizes voltages between the intermediate nodes to rapidly turn off the biased transistors and reduce noise on the output terminal of the charge pump.

Abstract: A method for fabricating a semiconductor device includes forming a plurality of active regions, each having a first sidewall and a second sidewall, by etching a semiconductor substrate, forming an insulation layer on the first sidewall and the second sidewall, forming an etch stop layer filling a portion of each gap between the active regions, forming a recess exposing the insulation layer formed on any one sidewall from among the first sidewall and the second sidewall, and forming a side contact exposing a portion of any one sidewall from among the first sidewall and the second sidewall by selectively removing a portion of the insulation layer.

Abstract: System for I-Q phase mismatch detection and correction. An apparatus to correct a phase mismatch between I and Q signals includes a correction circuit configured to continuously compare a reference signal and a phase error signal associated with the I and Q signals to generate an I bias signal and a Q bias signal, a first CMOS buffer configured to receive the I signal and the I bias signal and output a phase adjusted I signal based on the I bias signal, and a second CMOS buffer configured to receive the Q signal and the Q bias signal and output a phase adjusted Q signal based on the Q bias signal.

Abstract: A method for fabricating a semiconductor device includes etching a semiconductor substrate using a hard mask layer as a barrier to form a trench defining a plurality of active regions, forming a gap-fill layer to gap-fill a portion of the inside of the trench so that the hard mask layer becomes a protrusion, forming spacers covering both sides of the protrusion, removing one of the spacers using a doped etch barrier as an etch barrier, and etching the gap-fill layer using a remaining spacer as an etch barrier to form a side trench exposing one side of the active region.

Abstract: Techniques for reducing or eliminating DC (direct current) offset in transmitters are disclosed. An apparatus for DC offset reduction may include a converter, a digital engine, and a plurality of programmable current supplies. The converter is configured to provide digital representations of a plurality of DC currents associated, respectively, with a plurality of differential signal legs. The digital engine is configured to receive the digital representations and to produce instructions for generating compensating currents for the plurality of differential signal legs based on comparisons, respectively, between each of the digital representations and a calibration current. The programmable current supplies correspond, respectively, to the differential signal legs. The current supplies are configured to inject the compensating currents into the differential signal legs, respectively, to reduce DC offset between the differential signal legs, based upon the instructions.

Abstract: Methods and apparatus for self testing a multiband voltage controlled oscillator (VCO) are disclosed. A tuning voltage of the VCO is adjusted where the output of the VCO does not affect the input to the VCO. Frequency bands in the VCO are selected. Output frequencies of the VCO are measured.

Abstract: In one embodiment of the invention, a method for a charge pump is disclosed. The method includes biasing a plurality of transistors; switching a pair of main transistor switches to apply or remove a net charge on an output terminal though the biased transistors; and turning on auxiliary transistor switches when the main transistor switches are turned off. The auxiliary transistor switches when turned on provide an auxiliary equalizing path to nodes between the main transistor switches and the biased transistors. The auxiliary equalizing path equalizes voltages between the intermediate nodes to rapidly turn off the biased transistors and reduce noise on the output terminal of the charge pump.

Abstract: A method for fabricating a semiconductor device includes forming an isolation layer over a substrate, forming a plurality of open regions exposing the substrate by selectively etching the isolation layer, performing a surface treatment over the isolation layer, expanding the open regions by removing the surface-treated portion of the isolation layer, and forming a conductive layer in the expanded open regions.

Abstract: Techniques for compensating for the effects of temperature change on voltage controlled oscillator (VCO) frequency are disclosed. In an embodiment, an auxiliary varactor is coupled to an LC tank of the VCO. The auxiliary varactor has a capacitance controlled by a temperature-dependant control voltage to minimize the overall change in VCO frequency with temperature. Techniques for generating the control voltage using digital and analog means are further disclosed.

Abstract: In one embodiment of the invention, a method for a charge pump is disclosed. The method includes biasing a plurality of transistors; switching a pair of main transistor switches to apply or remove a net charge on an output terminal though the biased transistors; and turning on auxiliary transistor switches when the main transistor switches are turned off. The auxiliary transistor switches when turned on provide an auxiliary equalizing path to nodes between the main transistor switches and the biased transistors. The auxiliary equalizing path equalizes voltages between the intermediate nodes to rapidly turn off the biased transistors and reduce noise on the output terminal of the charge pump.

Abstract: A method for forming contact holes in a semiconductor device includes forming a hard mask layer over an etch target layer, forming a first line pattern in the hard mask layer by etching a portion of the hard mask layer through a primary etch process, forming a second line pattern crossing the first line pattern by etching the hard mask layer including the first line pattern through a secondary etch process, and etching the etch target layer by using the hard mask layer including the first line pattern and the second line pattern as an etch barrier.

Abstract: A method for fabricating a semiconductor device includes forming a plurality of active regions, each having a first sidewall and a second sidewall, by etching a semiconductor substrate, forming an insulation layer on the first sidewall and the second sidewall, forming an etch stop layer filling a portion of each gap between the active regions, forming a recess exposing the insulation layer formed on any one sidewall from among the first sidewall and the second sidewall, and forming a side contact exposing a portion of any one sidewall from among the first sidewall and the second sidewall by selectively removing a portion of the insulation layer.

Abstract: A method for fabricating a semiconductor device is provided, the method includes forming a double trench including a first trench and a second trench formed below the first trench and having surfaces covered with insulation layers, and removing portions of the insulation layers to form a side contact exposing one sidewall of the second trench.

Abstract: A method for fabricating a semiconductor device includes etching a semiconductor substrate using a hard mask layer as a barrier to form a trench defining a plurality of active regions, forming a gap-fill layer to gap-fill a portion of the inside of the trench so that the hard mask layer becomes a protrusion, forming spacers covering both sides of the protrusion, removing one of the spacers using a doped etch barrier as an etch barrier, and etching the gap-fill layer using a remaining spacer as an etch barrier to form a side trench exposing one side of the active region.

Abstract: Techniques for improving the linearity of a cascode amplifier. In an exemplary embodiment, an auxiliary common-gate amplifier is provided in parallel with the principal cascode branch. The auxiliary common-gate amplifier samples a cascoded node in the principal cascode branch. The auxiliary common-gate amplifier generates a current which, when combined with the current generated by the principal cascode branch, cancels a distortion component to generate an output current with improved linearity characteristics. In an exemplary embodiment, a phase shifting network couples the cascoded node to the auxiliary common-gate amplifier, and may include, e.g., a capacitor coupled to an inductor.

Abstract: Techniques are disclosed for trimming a capacitance associated with a capacitor bank for use in a voltage-controlled oscillator (VCO). In an embodiment, each capacitance is sub-divided into a plurality of constituent capacitances. The constituent capacitances may be selectively enabled or disabled to trim the step sizes of the capacitor bank. Further techniques are disclosed for calibrating the trimmable capacitance to minimize step size error for the capacitor bank.

Abstract: A circuit which selects a supply voltage from a plurality of voltage supplies is presented. The circuit includes a first transistor configured to select a first voltage supply, a second transistor configured to select a second voltage supply, a first parasitic current inhibitor coupled the first transistor, the first voltage supply, and the second voltage supply, where the first parasitic current inhibitor automatically utilizes the voltage supply providing the highest voltage for preventing a substrate current from flowing through a bulk node of the first transistor, and a second parasitic current inhibitor coupled the second transistor, the first voltage supply, and the second voltage supply, where the second parasitic current inhibitor automatically utilizes the voltage supply providing the highest voltage for preventing a substrate current from flowing through a bulk node of the second transistor.