Patents by Inventor Sang-soo Jee

Sang-soo Jee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120048356
    Abstract: A doping paste includes an inorganic particle including a phosphorus-containing silicon compound and an organic vehicle, wherein a concentration of phosphorus at an interior portion of the inorganic particle is greater than a concentration of phosphorous at a surface of the inorganic particle.
    Type: Application
    Filed: February 28, 2011
    Publication date: March 1, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Soo JEE, Eun-Sung LEE, Se-Yun KIM, Vladimir URAZAEV, Jung Yun WON, Mi-Jeong SONG
  • Publication number: 20120037221
    Abstract: A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass includes an alloy of at least two elements selected from an element having a low resistivity, an element which forms a solid solution with the conductive powder, or an element having a high oxidation potential, wherein the element having a low resistivity has a resistivity of less than about 100 microohm-centimeters, and the element having a high oxidation potential has an absolute value of a Gibbs free energy of oxide formation of about 100 kiloJoules per mole or greater.
    Type: Application
    Filed: August 12, 2011
    Publication date: February 16, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Se-Yun KIM, Eun-Sung LEE, Sang-Soo JEE, Sang-Mock LEE
  • Publication number: 20120037220
    Abstract: A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass has a resistivity that is decreased when the metallic glass is heat treated at a temperature that is higher than a glass transition temperature of the metallic glass.
    Type: Application
    Filed: August 10, 2011
    Publication date: February 16, 2012
    Applicants: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, Yonsei University, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Soo JEE, Eun-Sung LEE, Se-Yun KIM, Sang-Mock LEE, Jun Ho LEE, Do-Hyang KIM, Ka Ram LIM
  • Publication number: 20120037216
    Abstract: A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass includes an alloy of at least two metals selected from a first metal having a low resistivity, a second metal which forms a solid solution with the conductive powder, a third metal which extends a supercooled liquid region of the metallic glass, or a fourth metal having a higher standard free energy of formation of oxide than a standard free energy of formation of oxide of the first, the second, and third metals.
    Type: Application
    Filed: February 4, 2011
    Publication date: February 16, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Se-Yun KIM, Eun-Sung LEE, Sang-Soo JEE, Sang-Mock LEE
  • Publication number: 20120031481
    Abstract: A conductive paste including a conductive powder, a metallic glass having a supercooled liquid region, and an organic vehicle.
    Type: Application
    Filed: January 28, 2011
    Publication date: February 9, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Soo JEE, Eun-Sung LEE, Se-Yun KIM, Sang-Mock LEE, Jung Yun WON, Do-Hyang KIM
  • Patent number: 8055177
    Abstract: A heating member includes a weight supporter having an outer circumference, and a resistive heating disposed on the outer circumference of the weight supporter. The resistive heating layer includes a conductive filler dispersed in a base material. A pair of electrodes extends along a length direction of a rotational axis of the weight supporter and is arranged along a circumference of the weight supporter for supplying electric power to the resistive heating layer.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: November 8, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, In-taek Han, Ha-jin Kim, Sang-soo Jee, Dong-earn Kim
  • Publication number: 20110139208
    Abstract: A nanocomposite thermoelectric material, a thermoelectric element including the nanocomposite thermoelectric material, and a thermoelectric module including the thermoelectric element are disclosed herein. The nanocomposite thermoelectric material includes highly electrically conductive nano metallic particles that are uniformly dispersed in a thermoelectric material matrix. Thus, the nanocomposite thermoelectric material has high thermoelectric performance, and thus, may be used in a wide range of thermoelectric elements and thermoelectric modules.
    Type: Application
    Filed: July 9, 2010
    Publication date: June 16, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu-hyoung LEE, Hyun-sik KIM, Sang-mock LEE, Eun-sung LEE, Sang-soo JEE
  • Publication number: 20110116850
    Abstract: A heating member includes a resistive heating layer disposed on an outermost layer of the heating member, where the resistive heating layer comprises a conductive filler distributed in a base material and where the resistive heating layer emits heat when supplied with an electric current from an electrode, and a contacting unit which exposes the conductive filler of the resistive heating layer and contacts the electrode..
    Type: Application
    Filed: July 29, 2010
    Publication date: May 19, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-eui LEE, In-taek HAN, Ha-jin KIM, Sang-soo JEE, Dong-earn KIM
  • Publication number: 20110114170
    Abstract: Disclosed is a conductive paste including; a conductive powder including a plurality of conductive particles, a metallic glass disposed between adjacent conductive particles of the conductive powder, and an organic vehicle in which the conductive powder and metallic glass are disposed, and a solar cell using the conductive paste.
    Type: Application
    Filed: November 10, 2010
    Publication date: May 19, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-Sung LEE, Se-Yun KIM, Sang-Soo JEE
  • Publication number: 20110100409
    Abstract: A thermoelectric nano-composite including a thermoelectric matrix; a nano-metal particle; and a nano-thermoelectric material represented by Formula 1: AxMyBz??Formula 1 wherein A includes at least one element of indium, bismuth, or antimony, B includes at least one element of tellurium or selenium (Se), M includes at least one element of gallium, thallium, lead, rubidium, sodium, or lithium, x is greater than 0 and less than or equal to about 4, y is greater than 0 and less than or equal to about 4, and z is greater than 0 and less than or equal to about 3.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 5, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-sik KIM, Kyu-hyoung LEE, Sang-mock LEE, Eun-sung LEE, Sang-soo JEE, Xiangshu LI
  • Publication number: 20110044739
    Abstract: A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.
    Type: Application
    Filed: August 10, 2010
    Publication date: February 24, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-earn KIM, In-taek HAN, Ha-jin KIM, Sang-soo JEE, Sang-eui LEE
  • Publication number: 20100327408
    Abstract: A carbon/epoxy composition includes a bisphenol-based epoxy, an amine-based curing agent, an imidazole-based curing catalyst, and carbon black. A carbon-epoxy dielectric layer is fabricated using a reaction product of the carbon/epoxy composition.
    Type: Application
    Filed: February 23, 2010
    Publication date: December 30, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Eun-Sung LEE, Jin-Young BAE, Yoo-Seong YANG, Sang-Soo JEE
  • Publication number: 20100260526
    Abstract: A heating member includes a weight supporter having an outer circumference, and a resistive heating disposed on the outer circumference of the weight supporter. The resistive heating layer includes a conductive filler dispersed in a base material. A pair of electrodes extends along a length direction of a rotational axis of the weight supporter and is arranged along a circumference of the weight supporter for supplying electric power to the resistive heating layer.
    Type: Application
    Filed: October 26, 2009
    Publication date: October 14, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-eui LEE, In-Taek HAN, Ha-jin KIM, Sang-soo JEE, Dong-earn KIM
  • Publication number: 20100209154
    Abstract: A fixing unit includes a heating member which includes a core member, and a heating layer. The heating layer is disposed on an outer circumference of the core member. The heating layer includes an elastic material, and carbon nanotube doped with metal and distributed in the elastic material as a conductive filler of the heating layer. A press member faces the heating member to form a fixing nip. The fixing unit applies heat and pressure to toner on a medium passing through the fixing nip, to fix the toner on the medium.
    Type: Application
    Filed: September 11, 2009
    Publication date: August 19, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ha-jin KIM, In-taek HAN, Sang-soo JEE, Sang-eui LEE, Dong-earn KIM
  • Publication number: 20100201004
    Abstract: A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.
    Type: Application
    Filed: July 27, 2009
    Publication date: August 12, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Yoo-Seong YANG, Eun-Sung LEE, Sang-Soo JEE, Soon-Jae KWON